Bizarre Patents
Decorative Jeweled Wheel Cover
An improved wheel is provided wherein decorative items such as gem stones are embedded in either the wheel surface, a special mounting section attached to the wheel surface, or to a spoke strap that wraps around each spoke and positions embedded gem stones on the outside surface of the spoke.
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| Number | Title | Issue Date |
| 4917466 | Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby The invention provides a very efficient and reliable method for electrically connecting the electrodes of an electronic device, e.g., IC chips, and the electrodes of, for example, a glass-made circuit board substrate with good repairability. Thus, the ele... | 04/17/1990 |
| 4860087 | Semiconductor device and process for producing the same The present invention relates to a semiconductor device and a process for producing the same. The principal surface of a semiconductor pellet is provided with a plurality of first bonding pad electrodes arranged in a first arrangement state and a pluralit... | 08/22/1989 |
| 4825284 | Semiconductor resin package structure A semiconductor resin package structure formed according to the flip-chip connection method and permitting to cool the rear surface of semiconductor chips, comprising semiconductor chip and carrier substrate which is soldered on one surface thereof to ele... | 04/25/1989 |
| 4820013 | LED array head An LED array head which has a simplified structure and can be produced at a reduced cost. The LED array head comprises an LED array, a plurality of flexible printed circuits connected at faces thereof opposing to light emitting portions of the LED array t... | 04/11/1989 |
| 4812897 | Semiconductor element sealing structure A semiconductor element mounted on a substrate is sealed with a silicone gel which has a complex modulus of elasticity such that breakage of solder bumps due to thermal fatique occurs preferentially by shear stress thereto due to a difference between ther... | 03/14/1989 |
| 4803546 | Heatsink package for flip-chip IC A semiconductor device which includes a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and... | 02/07/1989 |
| 4797715 | Optoelectric component for surface mounting The invention relates to an optoelectronic component for surface mounting of the type having an opto-electronic element arranged on the bottom of a cavity provided in a support and to the method of manufacturing same. The component includes a cavity coate... | 01/10/1989 |
| 4774630 | Apparatus for mounting a semiconductor chip and making electrical connections thereto Apparatus for mounting a semiconductor device chip and making electrical connections thereto is disclosed. A semiconductor device chip has its backside connected to the surface of a substrate, and its upper surface includes a plurality of electrical pads ... | 09/27/1988 |
| 4731700 | Semiconductor connection and crossover apparatus A ceramic member with thick film conductors is mounted on a heat sink and a silicon integrated circuit (chip) is placed through a hole in the ceramic member and is soldered by a back surface (the substrate) to the heat sink. A tape automated bonding lead ... | 03/15/1988 |
| 4724472 | Semiconductor device A semiconductor device to be mounted on a circuit board, including a semiconductor chip, a package for mounting the semiconductor chip, a plurality of conductor pads provided on the outer surface of the package, and a plurality of conductor pins, connecte... | 02/09/1988 |
| 4714953 | Welded wire cooling An improved thermal management technique is disclosed for use in semiconductor device packaging utilizing ultrasonic welding to attach aluminum wires of predetermined diameter at one end directly to preselected hot spots on the device and at the other end... | 12/22/1987 |
| 4710798 | Integrated circuit chip package An integrated circuit is mounted on, and electrically connected to an underlying substrate by the flip-chip technique. In this technique, the chip is inverted and bonding pads on the chip are soldered to correspondingly located bonding pads on the substra... | 12/01/1987 |
| 4697204 | Leadless chip carrier and process for fabrication of same A leadless chip carrier is constructed in such a manner that each of the electrode terminals is made to be recessed from the insulation layer of the bottom surface of the carrier so as to have a difference in level between the bottom surface and at least ... | 09/29/1987 |
| 4695870 | Inverted chip carrier Apparatus is disclosed for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. An inverted chip carrier 36 comprises a carrier 35 between an improved interconnection device 37 and a s... | 09/22/1987 |
| 4693770 | Method of bonding semiconductor devices together Disclosed is a method of realizing high-density and inexpensive semiconductor apparatus by joining the electrodes of two semiconductor devices. A metal bump formed on a substrate is transferred and joined onto the electrode of first semiconductor device, ... | 09/15/1987 |
| 4672421 | Semiconductor packaging and method A mounting means for a semiconductor integrated circuit, the mounting means comprising a semiconductor material having a mounting surface as one major surface thereof, a semiconductor integrated circuit mounted on the major surface of the semiconductor ma... | 06/09/1987 |
| 4672415 | Power thyristor on a substrate A power thyristor assembly, includes an insulating and metallized substrate, and a power thyristor having a cathode and gate side facing toward and soldered to the substrate, and an anode side facing away from the substrate, the anode side having an anode... | 06/09/1987 |
| 4620216 | Unitary slotted heat sink for semiconductor packages A unitary heat sink for a semiconductor package having a plurality of cooling fin elements, each element having upwardly extending openings that divide the base into a plurality of leg portions, the heat sink having a plurality of flat base portions indiv... | 10/28/1986 |
| 4607276 | Tape packages The present invention is directed to Tape Packages adapted to house semiconductor devices. The packages comprise a base component having a cover component disposed thereon to form an enclosure to house the semiconductor. A tape lead frame is disposed betw... | 08/19/1986 |
| 4603345 | Module construction for semiconductor chip A module for a semiconductor chip is disclosed. The module includes a heat sink with a flat surface to which the back face of the semiconductor chip is directly bonded. The exposed face of the chip has an array of power, ground and signal contacts. A plur... | 07/29/1986 |
| 4561040 | Cooling system for VLSI circuit chips A system for cooling integrated circuit chips and particularly those involving very large scale integrated circuits; the system provides for closely associating the heat-sink or heat exchange element with the integrated circuit chip by having the heat-sin... | 12/24/1985 |
| 4561011 | Dimensionally stable semiconductor device A heat dissipating member including a heat sink is placed on a module base board with flip-chips mounted thereon, with metallic plates and first adhesive materials of a good thermal conductivity interposed between the heat dissipating member and the flip-... | 12/24/1985 |
| 4453176 | LSI Chip carrier with buried repairable capacitor with low inductance leads A carrier for LSI chips includes a built-in capacitor structure in the carrier. The capacitor is located beneath the chip with the plates of the capacitor parallel to the chip mounting surface or at right angles to the chip mounting surface. The capacitor... | 06/05/1984 |
| 4336551 | Thick-film printed circuit board and method for producing the same A thick-film printed circuit board and a method for producing the same are disclosed, in which wiring conductors having connecting sections for connection with solder electrodes of an electronic element such as a semiconductor chip are provided on an insu... | 06/22/1982 |
| 4323914 | Heat transfer structure for integrated circuit package Heat is removed from a Large Scale Integrated Circuit semiconductor package via a thermal conductive path including a thermally conductive liquid. The integrated circuit chips are flip chip bonded to a substrate having a printed circuit and raised contact... | 04/06/1982 |
| 4300153 | Flat shaped semiconductor encapsulation Electrodes are formed on one major surface of a semiconductor chip and electrically connected to lead electrodes carried by a support substrate. A cover plate is fixed to the opposing major surface of the semiconductor chip to determine one major surface ... | 11/10/1981 |
| 4264917 | Flat package for integrated circuit devices According to the present invention, a flat package for at least one integed circuit device having output pads comprises a supporting member for the IC device, a plurality of output terminals external to the package, an array of conductors connecting the ... | 04/28/1981 |
| 4259684 | Packages for microwave integrated circuits This disclosure relates to the packaging of microwave integrated circuits (MICs) whereby an MIC is hermetically sealed within an enclosure comprising a first plate of dielectric material which carries the circuit to be enclosed, a wall of dielectric mater... | 03/31/1981 |
| 4250520 | Flip chip mounted diode A planar semiconductor device having a cathode region surrounding an anode region is flip chip mounted to a conductor film circuit. An anode contact extends from the anode region and is bonded to a first portion of the conductor film circuit such that tha... | 02/10/1981 |
| 4238763 | Solid state microwave devices with small active contact and large passive contact This disclosure relates to two-terminal solid state microwave devices, such as transferred electron and avalanche effect devices, comprising a high-conductivity semiconductor substrate formed over at least a part of one major surface with an active layer ... | 12/09/1980 |
| 4231154 | Electronic package assembly method A method for making an electronic package assembly of the type having an insulator pin carrier, a thin, i.e. substantially five microns, flexible printed circuit (PC) polyimide member having printed circuit conductors bonded to the heads of the pins of th... | 11/04/1980 |
| 4218701 | Package for an integrated circuit having a container with support bars An integrated circuit package for an electronic timepiece comprising an integrated circuit holder, a circuit board having an aperture therein and an integrated circuit chip is disclosed. The integrated circuit plastic holder comprises a container, a frame... | 08/19/1980 |
| 4216488 | Lateral semiconductor diac The specification discloses a lateral diac including a semiconductor body having three alternating layers of first and second opposite conductivity types of semiconductor material. An isolating member such as a groove is disposed through one of the exteri... | 08/05/1980 |
| 4190855 | Installation of a semiconductor chip on a glass substrate A flipchip LSI is mounted on a glass substrate through the use of bonding techniques. An insulating layer made of, for example, epoxy resin is formed between the LSI chip and the glass substrate in such a manner that the insulating layer is fixed to both ... | 02/26/1980 |
| 4183041 | Self biasing of a field effect transistor mounted in a flip-chip carrier A field effect transistor is mounted in a flip-chip carrier which is in contact with one surface of a metal plate, the other surface of the plate being in contact with one surface of a block of beryllium oxide. A metal sheet, connected to a ground plane, ... | 01/08/1980 |
| 4180828 | Hybrid circuit having a semiconductor circuit A hybrid circuit comprises an insulating substrate which is provided with conductors and on which a semiconductor circuit is provided consisting of a semiconductor element connected to an insulating flexible foil having conductor tracks, and in which the ... | 12/25/1979 |
| 4161740 | High frequency power transistor having reduced interconnection inductance and thermal resistance A transistor having small, closely spaced emitter and base contact areas and an active area capable of generating heat to be removed, is provided with an electrode structure comprising a finger electrode for connecting emitter or base contact areas with o... | 07/17/1979 |
| 4034399 | Interconnection means for an array of majority carrier microwave devices An improved means for interconnecting a semiconductor array to a carrier wherein the array comprises a plurality of MESFET transistors each having a distinct gate pad and a distinct drain pad, the improvement comprising a bilaterally symmetric conductive ... | 07/05/1977 |
| 4024570 | Simplified housing structure including a heat sink for a semiconductor unit A plastic housing structure, for a semiconductor component or integrated circuit, employing a metallic heat conducting member forming a base plate of the housing, the conductor members for electrical connection of the semiconductor component extending fro... | 05/17/1977 |
| 4021838 | Semiconductor integrated circuit devices A power bus element for use in large scale integrated circuits is described. Each bus element consists, for example, of a chip of silicon having two levels of metallization thereon, one acting as an earth (or ground) return plane and the other providing p... | 05/03/1977 |
