Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
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| Number | Title | Issue Date |
| 7317258 | Thermal interface apparatus, systems, and fabrication methods An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material. ... | 01/08/2008 |
| 7317224 | Semiconductor device A semiconductor device includes a gate electrode GE electrically connected to a gate portion which is made of a polysilicon film provided in the inside of a plurality of grooves formed in a striped form along the direction of T of a chip region CA wherein the gate e... | 01/08/2008 |
| 7317243 | Encapsulated lead having step configuration Substrate for electrical devices and methods of manufacturing such substrate are disclosed. An embodiment for the substrate comprised of an insulator and a plurality of conductive elements, wherein the insulator having a recess. The conductive elements embedded in t... | 01/08/2008 |
| 7317254 | Semiconductor device mounting structure for reducing thermal stress and warpage A semiconductor device is composed of a circuit board, a semiconductor chip connected with the circuit board by a plurality of bumps. The semiconductor chip includes a center portion and a peripheral portion surrounding the center portion. The peripheral portion has... | 01/08/2008 |
| 7315083 | Circuit device and manufacturing method thereof A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing m... | 01/01/2008 |
| 7315081 | Semiconductor device package utilizing proud interconnect material A semiconductor package which includes a conductive can, a semiconductor die received in the interior of the can and connected to an interior portion thereof at one of its sides, at least one interconnect structure formed on the other side of the semiconductor die, ... | 01/01/2008 |
| 7315085 | Ball grid array package and method thereof A ball grid array package includes a substrate, a chip, a plurality of pads, a solder mask, a plurality of partitioning walls, and a plurality of solder balls. The substrate has an upper surface and a lower surface opposite to the upper surface. The chip is disposed... | 01/01/2008 |
| 7315086 | Chip-on-board package having flip chip assembly structure and manufacturing method thereof A chip-on-board (COB) package has a flip chip assembly structure and is used for an integrated circuit (IC) card. The COB package has conductive patterns as contact terminals on an outer surface of a non-conductive film, and an IC chip on an inner surface of the fil... | 01/01/2008 |
| 7314779 | Semiconductor device, manufacturing method for semiconductor device and mounting method for the same A semiconductor device in accordance with the present invention reduces cracks occurring in a junction between a semiconductor device and a mounting substrate due to a heat stress when the semiconductor device is mounted on a printed circuit board or the like. The s... | 01/01/2008 |
| 7314822 | Method of fabricating stacked local interconnect structure A method is provided for forming stacked local interconnects that do not extend into higher levels within a multilevel IC device, thereby economizing space available within the IC device and increasing design flexibility. In a first embodiment, the method of the pre... | 01/01/2008 |
| 7314817 | Microelectronic device interconnects A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns. ... | 01/01/2008 |
| 7312528 | Semiconductor device having antenna connection electrodes A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of the semiconductor chip compared to the first and second antenna connec... | 12/25/2007 |
| 7312143 | Wafer level chip scale package having a gap and method for manufacturing the same A wafer level chip scale package may have a gap provided between a solder bump and a bump land. The gap may be filled with a gas. A method of manufacturing a wafer level chip scale package may involve forming a redistribution line having a first opening, forming a s... | 12/25/2007 |
| 7312103 | Method for making an integrated circuit substrate having laser-embedded conductive patterns A method for making an integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. A dielectric material is injection-molded or laminated over a metal layer that is punch... | 12/25/2007 |
| 7311242 | Design of an insulated cavity The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two silicon wafers [WA]... | 12/25/2007 |
| 7312529 | Structure and method for producing multiple size interconnections An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises ... | 12/25/2007 |
| 7312535 | Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer The objects of the present invention is to improve the impact resistance of the semiconductor device against the impact from the top surface direction, to improve the corrosion resistance of the surface of the top layer interconnect, to inhibit the crack occurred in... | 12/25/2007 |
| 7312516 | Chip scale package with heat spreader A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional semicondu... | 12/25/2007 |
| 7309020 | Deposition fabrication using inkjet technology A method of fabricating a circuit lead, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of substantially uniformly patterned micropores operative to drain a fluid component of the slurry... | 12/18/2007 |
| 7310458 | Stacked module systems and methods The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be em... | 12/18/2007 |
| 7309913 | Stacked semiconductor packages A stacked semiconductor package includes a substrate and a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semico... | 12/18/2007 |
| 7309924 | UBM for fine pitch solder ball and flip-chip packaging method using the same A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connecte... | 12/18/2007 |
| 7307349 | Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface A semiconductor device including a first semiconductor chip, a second semiconductor chip bonded to the first semiconductor chip in a stacked relation, and a registration structure which causes the first and second semiconductor chips to be positioned with respect to... | 12/11/2007 |
| 7307337 | Resin-molded semiconductor device having posts with bumps and method for fabricating the same A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductiv... | 12/11/2007 |
| 7303944 | Microelectronic devices having underfill materials with improved fluxing agents Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device wit... | 12/04/2007 |
| 7303978 | Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device To fabricate a semiconductor device, a pattern of recesses and lands is formed on a copper sheet as a matrix sheet, and BGA pads are formed on the lands on the copper sheet. An insulating layer is formed on the copper sheet to transfer the pattern of recesses and la... | 12/04/2007 |
| 7304382 | Managed memory component The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is disposed along the obverse side of a flex circuit. In a preferred embo... | 12/04/2007 |
| 7303941 | Methods and apparatus for providing a power signal to an area array package An area array device has a grid array of primary electrical contacts coupled to a coupling surface of the device and configured to carry data signals between the area array package and a circuit board. The area array device also has an additional series of secondary... | 12/04/2007 |
| 7304859 | Chip carrier and fabrication method A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive compo... | 12/04/2007 |
| 7304394 | Semiconductor device and method for manufacturing same A wiring pattern is provided on an insulating tape. Part of the wiring pattern is a connection section. An insulating resin is provided so that the connection section is coated with the insulating resin. A protrusion electrode of a semiconductor element is so positi... | 12/04/2007 |
| 7302982 | Label applicator and system A label applicator including a support surface having a central area and curving downwardly from the central area. A post assembly extends up from the central area such that a label having a label through-hole can be positioned in a support position generally on the... | 12/04/2007 |
| 7304395 | Semiconductor chip package A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. Th... | 12/04/2007 |
| 7301243 | High-reliable semiconductor device using hermetic sealing of electrodes The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather than a sealing material. The frame member in the present invention su... | 11/27/2007 |
| 7301235 | Semiconductor device module with flip chip devices on a common lead frame The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each other without wire bonding. The common housing includes a packaging ... | 11/27/2007 |
| 7299546 | Method for manufacturing an electronic module An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also ... | 11/27/2007 |
| 7301222 | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages An apparatus and method for enhancing the formation of fillets around the periphery of assembled wafer-level chip scale packages when mounted onto substrates. The method includes fabricating a plurality of integrated circuit die on a first surface of a semiconductor... | 11/27/2007 |
| 7301228 | Semiconductor device, method for manufacturing same and thin plate interconnect line member The present invention provides a low-profile and light-weight semiconductor device having improved product reliability and higher frequency performance. A multi-layer interconnect line structure is disposed just under circuit devices 410a and 410 | 11/27/2007 |
| 7298042 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the inte... | 11/20/2007 |
| 7298029 | Semiconductor devices and manufacturing method therefor A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits an... | 11/20/2007 |
| 7298235 | Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module... | 11/20/2007 |
