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| Number | Title | Issue Date |
| 8115319 | Flip chip package maintaining alignment during soldering Disclosed is a flip chip package maintaining alignment during soldering, primarily comprising a chip and a substrate. A plurality of bumps and at least an extruded alignment key are disposed on the active surface of the chip. The substrate has a plurality of bonding... | 02/14/2012 |
| 8110930 | Die backside metallization and surface activated bonding for stacked die packages Methods and apparatus to provide die backside metallization and/or surface activated bonding for stacked die packages are described. In one embodiment, an active metal layer of a first die may be coupled to an active metal layer of a second die through silicon vias ... | 02/07/2012 |
| 8097958 | Flip chip connection structure having powder-like conductive substance and method of producing the same A connection structure (package 10) has a first plate body 101 and a second plate body; in the first plate body 101, a wiring pattern having a plurality of connection terminals 102 is formed, and the second plate body has at least two con... | 01/17/2012 |
| 8097959 | Semiconductor device including first and second carriers A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. ... | 01/17/2012 |
| 8089164 | Substrate having optional circuits and structure of flip chip bonding The present invention relates to a substrate having optional circuits and a structure of flip chip bonding. The substrate includes a substrate body, at least one substrate pad, a first conductive trace and a second conductive trace. The substrate body has a surface.... | 01/03/2012 |
| 8084869 | Semiconductor device and method for manufacturing the same A technique permitting the reduction in size of a semiconductor device is provided. In a BGA type semiconductor device with a semiconductor chip flip-chip-bonded onto a wiring substrate, bump electrodes of the semiconductor chip are coupled to lands formed at an upp... | 12/27/2011 |
| 8076784 | Stacked semiconductor chips Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substr... | 12/13/2011 |
| 8072084 | Integrated circuit, circuit system, and method of manufacturing An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating layer on the chip surface. The insulating layer includes a flexible mat... | 12/06/2011 |
| RE42972 | Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof A semiconductor device comprising a semiconductor pellet mounted on a pellet mounting area of the main surface of a base substrate, in which first electrode pads arranged on the back of the base substrate are electrically connected to bonding pads arranged on the ma... | 11/29/2011 |
| 8063494 | Semiconductor device and power supply unit utilizing the same A semiconductor device has pluralities of grid array terminals forming a grid array structure, e.g. a BGA structure, in which the output end of a built-in switch circuit is connected to multiple terminals of the grid array structure, thereby reducing the current tha... | 11/22/2011 |
| 8053904 | Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conducti... | 11/08/2011 |
| 8053905 | Compliant bonding structures for semiconductor devices A light emitting device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region, a metal p-contact disposed on the p-type region, and a metal n-contact disposed on the n-type region. The metal p-cont... | 11/08/2011 |
| 8035234 | Wiring substrate, manufacturing method thereof, and semiconductor device There is provided a wiring substrate for connecting a mounting board on one surface thereof and mounting an integrated circuit chip on the opposite surface to the surface. The wiring substrate has a conductive connecting portion penetrating the substrate for connect... | 10/11/2011 |
| 8026614 | Semiconductor IC-embedded substrate and method for manufacturing same A semiconductor IC-embedded substrate suitable for embedding a semiconductor IC in which the electrode pitch is extremely narrow. The substrate comprises a semiconductor IC 120 in which stud bumps 121 are provided to the principal surface 120... | 09/27/2011 |
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with... | 09/27/2011 |
| 8022556 | Electrical component having a reduced substrate area An electrical component includes a substrate, component structures on the substrate, and solder metal platings electrically connected to the component structures. The substrate is electrically and mechanically connected in a flip chip arrangement to a carrier via co... | 09/20/2011 |
| 8022557 | Near chip scale semiconductor packages Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first poly... | 09/20/2011 |
| 8018073 | Electronic packages with fine particle wetting and non-wetting zones Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be mad... | 09/13/2011 |
| 8013454 | Wiring substrate and display device including the same An active matrix substrate includes a first substrate, a driving integrated circuit chip mounted on the first substrate with an anisotropic electrically conductive layer, and an insulating member. The insulating member isolates a terminal from a wiring and a bump el... | 09/06/2011 |
| 8013453 | Leadless alignment of a semiconductor chip There is disclosed a mounting technique for mounting a semiconductor chip of the leadless or so-called flip chip type to a header. The header has an insert made of glass or other suitable non-conductive material within the header hollow. Mounted into the glass inser... | 09/06/2011 |
| 7986046 | Semiconductor module and method of producing the same A semiconductor module including: a semiconductor chip in which an integrated circuit is formed; an electrode formed on the semiconductor chip and electrically connected to the integrated circuit; an insulating film formed on the semiconductor chip and having an ope... | 07/26/2011 |
| 7982319 | Semiconductor device with improved resin configuration A semiconductor device comprises a wiring substrate including a wiring pattern; a semiconductor chip installed on the wiring substrate, including a plurality of pads formed on a surface of the semiconductor chip, which opposes the wiring substrate; a first resin lay... | 07/19/2011 |
| 7977802 | Integrated circuit packaging system with stacked die and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming a flip chip die, having a backside protrusion; mounting a wire bond die on the flip chip die, adjacent to the backside protrusion; and mounting an internal stacking module over the b... | 07/12/2011 |
| 7952206 | Solder bump structure for flip chip semiconductor devices and method of manufacture therefore The invention provides, in one aspect, a semiconductor device that comprises an interconnect layer located over a semiconductor substrate. A passivation layer is located over the interconnect layer and having a solder bump support opening formed therein. Support pil... | 05/31/2011 |
| 7952208 | Substrate, manufacturing method thereof, method for manufacturing semiconductor device A substrate on which an IC element is fixed includes: a plurality of metal posts arranged in a plurality of columns in a lengthwise direction and in a plurality of rows in a crosswise direction when viewed in a plan view, the plurality of metal posts having first fa... | 05/31/2011 |
| 7952207 | Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening Disclosed are embodiments of a flip-chip assembly and method using lead-free solder. This assembly incorporates mushroom-plated metal layers that fill and overflow solder resist openings on an organic laminate substrate. The lower portion of metal layer provides str... | 05/31/2011 |
| 7928582 | Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces are disclosed. In one embodiment, a microelectronic assembly comprises a support member having a first side and a projection extending away from the first side. Th... | 04/19/2011 |
| 7928584 | Stacked MEMS device A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a pa... | 04/19/2011 |
| 7928583 | Semiconductor device A semiconductor device includes a semiconductor substrate; a sealing resin layer formed on a top face of the semiconductor substrate; a metal post formed on the top face of the semiconductor substrate such that a top face of the metal post is exposed through the sea... | 04/19/2011 |
| 7923850 | Semiconductor chip with solder joint protection ring Various semiconductor chip arrangements and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip that has an external peripheral wall to a first side of a substrate. A first metall... | 04/12/2011 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with... | 04/12/2011 |
| 7919873 | Structure of high performance combo chip and processing method A method for fabricating a chip package is achieved. A seed layer is formed over a silicon wafer. A photoresist layer is formed on the seed layer, an opening in the photoresist layer exposing the seed layer. A first solder bump is formed on the seed layer exposed by... | 04/05/2011 |
| 7919874 | Chip package without core and stacked chip package structure A chip package including a base, a chip, a molding compound and a plurality of outer terminals is provided. The base is essentially consisted of a patterned circuit layer having a first surface and a second surface opposite to each other and a solder mask disposed o... | 04/05/2011 |
| 7919872 | Integrated circuit (IC) carrier assembly with first and second suspension means An integrated circuit (IC) carrier assembly comprises a printed circuit board (PCB), a carrier soldered to the PCB, the carrier comprising a plurality of electrical contact islands surrounding a receiving zone for receiving an IC, a first resilient suspension means ... | 04/05/2011 |
| 7915740 | Semiconductor device Provided is a semiconductor device that can reduce the resistance in a horizontal direction of a substrate. A current path in a horizontal direction of a substrate is formed in a direction along a short side of the substrate (chip). For example, adopted is a layout ... | 03/29/2011 |
| 7915739 | Method and arrangement for contact-connecting semiconductor chips on a metallic substrate The method comprises the following steps: the substrate in the form of a one-piece basic substrate (4) is prepatterned into regions corresponding to future modules, pads of the semiconductor chip (1) are then contact-connected in predetermined regions ... | 03/29/2011 |
| 7911066 | Through-chip via interconnects for stacked integrated circuit structures A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external ci... | 03/22/2011 |
| 7902678 | Semiconductor device and manufacturing method thereof Electrode pads (5) and a solder resist (7) are disposed on the upper surface of a wiring board (1), and apertures (7a) are formed in the solder resist (7) so as to expose the electrode pads (5). Electrodes (4) ... | 03/08/2011 |
| 7902679 | Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump A new method and package is provided for the mounting of semiconductor devices that have been provided with small-pitch Input/Output interconnect bumps. Fine pitch solder bumps, consisting of pillar metal and a solder bump, are applied directly to the I/O pads of th... | 03/08/2011 |
| 7893542 | Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board The invention provides a connecting structure for a flip-chip semiconductor package in which cracking and delamination are inhibited or reduced to improve reliability, and in which the potential range of designs is expanded for the inner circuitry of circuit boards ... | 02/22/2011 |
