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| Number | Title | Issue Date |
| 4151543 | Lead electrode structure for a semiconductor chip carried on a flexible carrier A semiconductor device comprises an insulating substrate such as a film carrier having wiring patterns formed thereon, lead electrodes connected to the wiring patterns, and a semiconductor chip bonded to the lead electrodes. The surface of the lead electr... | 04/24/1979 |
| 4097266 | Microsphere of solder having a metallic core and production thereof A microsphere of solder having a metallic core, in which the thickness of the solder coating of the microsphere is more than 20 microns, can be produced by a process comprising preparing a sheet having a plurality of hollows provided all over the sheet, p... | 06/27/1978 |
| 4081825 | Conduction-cooled circuit package A circuit package exhibiting an excellent heat transfer path from a semiconductor chip or other heat-generating device to the heat-sink can or cover of the package. A heat-conducting pad is metallurgically bonded to either said cover or a surface of said ... | 03/28/1978 |
| 4034468 | Method for making conduction-cooled circuit package A method for making a circuit package which exhibits an excellent heat transfer path from a semiconductor chip or other heat generating device to the heat sink can or cover of the package. A heat conducting pad is placed in proximate relationship to eithe... | 07/12/1977 |
| 4034469 | Method of making conduction-cooled circuit package A circuit package exhibiting an excellent heat transfer path from a semiconductor chip or other heat-generating device to the heat-sink can or cover of the package. A heat-conducting pad is metallurgically bonded to either said cover or a surface of said ... | 07/12/1977 |
| 4023198 | High frequency, high power semiconductor package A semiconductor packaging configuration is described in which a heat sink is bonded to a semiconductor chip or die and a conductor is bonded to the die and a metalized ceramic insulating body for achieving optimum heat transfer. Additionally, electrical m... | 05/10/1977 |
| 4017889 | Ternary barrier structure for conductive electrodes A ternary barrier structure and method for forming the structure to be used on a conductive electrode. In electronic structures, dielectric substrates are used which have a plurality of connecting conductive areas which are wettable by solder. The region ... | 04/12/1977 |
| 4005454 | Semiconductor device having a solderable contacting coating on its opposite surfaces A semiconductor device which is resistant against alternating thermal stres in which a disc of semiconductor material, which is provided with at least one pn-junction and with solderable contacting coatings on its opposite major surfaces, has these coati... | 01/25/1977 |
