Quotables
"There is no reason anyone would want a computer in their home."
Ken Olsen, chairman and founder of Digital Equipment Corporation ; 1977
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7888800 | Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics A semiconductor structure including a first rigid dielectric layer and a second rigid dielectric layer. A first non-rigid low-k dielectric layer is formed between the first and second rigid dielectric layer. A plurality of dummy fill shapes is formed in the first no... | 02/15/2011 |
| 7791199 | Packaged semiconductor chips A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar ... | 09/07/2010 |
| 7692299 | Semiconductor apparatus having improved thermal fatigue life A semiconductor apparatus having improved thermal fatigue life is provided by lowering maximum temperature on jointing members and reducing temperature change. A jointing member is placed between a semiconductor chip and a lead electrode, and a thermal stress relaxa... | 04/06/2010 |
| 7538432 | Temporary structure to reduce stress and warpage in a flip chip organic package A flip chip assembly having reduced stress and warpage comprises a flip chip package including an organic substrate and an integrated circuit chip, a temporary structure having a coefficient of thermal expansion that is substantially similar to a coefficient of ther... | 05/26/2009 |
| 7432596 | Apparatus and method for bonding silicon wafer to conductive substrate A system and method is disclosed for bonding a substrate to a semiconductor die that is prone to curling when subjected to an elevated temperature in a solder reflow oven, for example, thereby improving the electrical and mechanical bonding for large dies, wafers, c... | 10/07/2008 |
| 7417315 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine... | 08/26/2008 |
| 7400040 | Thermal interface apparatus, systems, and methods An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion suffici... | 07/15/2008 |
| 7361993 | Terminal pad structures and methods of fabricating same Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of multiple dielectric layers including diffusion barrier layers. The method... | 04/22/2008 |
| 7331106 | Underfill method A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a filler material, and optionally a fluxing material onto the die surfac... | 02/19/2008 |
| 7320426 | Cover for ball-grid array connector A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for eng... | 01/22/2008 |
| 7312145 | Electronic member, method for making the same, and semiconductor device The present invention provides an electronic device having high insulating reliability, in which metal portions of a circuit are not electrically conductive with each other via an adhesive layer even when the electronic device is used in high-temperature low-humidit... | 12/25/2007 |
| 7303427 | Electrical connector with air-circulation features A preferred embodiment of an electrical connector includes an electrical conductor for transmitting electrical power, and a housing. The electrical conductor is mounted in the housing so that the housing and the electrical conductor define a channel for circulating ... | 12/04/2007 |
| 7295029 | Chip-scale package for integrated circuits A chip-scale packaged IC is made by bonding one or more singulated die chips (from an IC wafer) to a common substrate, such as a single cap wafer (or a portion thereof) and cutting (singulating) the substrate to yield individual, chip-scale packaged ICs. Alternative... | 11/13/2007 |
| 7282132 | Zinc oxide film treatment method and method of manufacturing photovoltaic device utilizing the same A film of zinc oxide electrochemically deposited from an aqueous solution is subjected to heat treatment at a temperature equal to or higher than 150° C. and equal to or lower than 400° C. in a nitrogen or inert gas atmosphere that contains oxygen, thereby obtaini... | 10/16/2007 |
| 7262622 | Wafer-level package for integrated circuits A wafer-level packaged IC is made by attaching a cap wafer to the top of an IC wafer before cutting the IC wafer, i.e. before singulating the plurality of die on the IC wafer. The cap wafer is mechanically attached and electrically connected to the IC wafer, then th... | 08/28/2007 |
| 7256501 | Semiconductor device and manufacturing method of the same In a semiconductor device having a package structure in which lead terminals connected to electrodes on both of the upper and lower surfaces of a semiconductor chip are exposed from both of the upper and lower surfaces and side surfaces of a sealing body formed of r... | 08/14/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7245008 | Ball grid array package, stacked semiconductor package and method for manufacturing the same A BGA package including a substrate, a plurality of solder balls on the semiconductor and an encapsulant, which leaves the solder balls partially exposed on the semiconductor chip, thereby reducing the size of the BGA package. In addition, an edge of the substrate m... | 07/17/2007 |
| 7223992 | Thermal conducting trench in a semiconductor structure The invention relates to a trench filled with a thermally conducting material in a semiconductor substrate. In one embodiment, the semiconductor device has a trench defining a cell region, wherein a portion of the trench includes a thermally conducting material, and... | 05/29/2007 |
| 7205652 | Electronic assembly including multiple substrates An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having ... | 04/17/2007 |
| 7199475 | Semiconductor copper bond pad surface protection Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal conta... | 04/03/2007 |
| 7193320 | Semiconductor device having a heat spreader exposed from a seal resin A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes o... | 03/20/2007 |
| 7173804 | Array capacitor with IC contacts and applications An apparatus having a first set of contacts on a first side of the apparatus adapted to interface with a corresponding plurality of contacts on an integrated circuit package. The apparatus further includes a second set of contacts on a second side of the apparatus a... | 02/06/2007 |
| 7170184 | Treatment of a ground semiconductor die to improve adhesive bonding to a substrate Methods are provided to improve the adhesive bonding of a semiconductor die to a substrate through an adhesive paste by forming a layer of silicon dioxide on the back surface of the semiconductor die prior to applying the adhesive paste. Contacting the semiconductor... | 01/30/2007 |
| 7164192 | Semiconductor die package with reduced inductance and reduced die attach flow out In one exemplary embodiment, a structure comprises a substrate having a top surface, and a die attach pad situated on the top surface of the substrate. The die attach pad includes a die attach region and at least one substrate ground pad region electrically connecte... | 01/16/2007 |
| 7161241 | Multi-layer board A multi-layer board includes a ceramic layer and plural resin layers which are stacked together. The ceramic layer is provided with an impedance element formed thereon, and the uppermost resin layer is provided with an electronic component mounted thereon. The multi... | 01/09/2007 |
| 7142243 | Image sensing apparatus having a member that adjusts with temperature change This invention has building members which include an image sensing portion, an optical member for forming a beam from an object to be sensed into an image on the image sensing portion, a positioning portion which positions the optical member, and a support member wh... | 11/28/2006 |
| 7106592 | Coolant cooled type semiconductor device A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semicond... | 09/12/2006 |
| 7091619 | Semiconductor device, semiconductor package, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device A method is provided to enhance the connection reliability in three-dimensional mounting while considering the warping of packages. Opening diameters of the openings provided corresponding to protruding electrodes, respectively, are set so as to gradually decrease f... | 08/15/2006 |
| 7092890 | Method for manufacturing thin GaAs die with copper-back metal structures A thin GaAs Substrate can be provided with a copper back-metal layer to allow the GaAs Substrate to be packaged using conventional plastic packaging technologies. By providing the GaAs Substrate with a copper back-metal layer, the GaAs Substrate can be made thinner ... | 08/15/2006 |
| 7084502 | Microelectromechanical device and method for producing it A microelectromechanical device and a method for producing it having at least one layer on a substrate, in particular a thermoelectric layer on a substrate, the thermal expansion coefficient of the at least one layer and the thermal expansion coefficient of the subs... | 08/01/2006 |
| 7067916 | Extension of fatigue life for C4 solder ball to chip connection A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a con... | 06/27/2006 |
| 7038322 | Multi-chip module A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for ... | 05/02/2006 |
| 7026710 | Molded package for micromechanical devices and method of fabrication According to the present invention, a plastic land-grid array package, a plastic ball-grid package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by placing a sheet-like protector on the surface of the ... | 04/11/2006 |
| 7018915 | Group III nitride compound semiconductor device and method for forming an electrode An AlN buffer layer 2; a silicon (Si)-doped GaN high-carrier-concentration n+ layer 3; an Si-doped n-type Al0.07Ga0.93N n-cladding layer 4; an Si-doped n-type GaN n-guide layer 5; an active layer 6 ... | 03/28/2006 |
| 7009253 | Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event A method and apparatus for preventing thermo-mechanical damage to an electrostatic discharge (ESD) protection device is disclosed. The method and apparatus of the invention use materials with superior thermo-mechanical properties, in particular, the Coefficient of T... | 03/07/2006 |
| 7005724 | Semiconductor device and a method of manufacture therefor The present invention provides a semiconductor device, a method of manufacture therefor, and an integrated circuit including the aforementioned semiconductor device. The semiconductor device, in accordance with the principles of the present invention, may include a ... | 02/28/2006 |
| 6943376 | Electrode for p-type SiC An object of this invention is to provide an electrode for p-type SiC which can provide improved surface morphology and less thermal damage for a semiconductor crystal layer due to formation of an electrode. In this invention, a p-type electrode is manufactured to c... | 09/13/2005 |
| 6943391 | Modification of carrier mobility in a semiconductor device Tensile or compressive stress may be added in one or more selected locations to the biaxial residual stress existing in the channel of a semiconductor device, such as a MOSFET. The periphery of the active area containing the channel is modified by following layout p... | 09/13/2005 |
| 6939173 | Low cross talk and impedance controlled electrical connector with solder masses An electrical connector, comprising: a dielectric base; a plurality of ground or power contacts in the dielectric base; a plurality of signal contacts in the dielectric base and angled relative to the ground or power contacts; and a plurality of solder balls secured... | 09/06/2005 |
