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| Number | Title | Issue Date |
| 8154127 | Optical device and method of making the same An optical device includes a first electrode of a first conductivity type, and a second electrode of a second conductivity type. A nanowire is positioned between the first and second electrodes. The nanowire has at least two segments and a junction region formed bet... | 04/10/2012 |
| 8148820 | Formed product of line-structured substance composed of carbon element, and method of forming the same The present invention proposes a method of readily and reliably forming CNTs independent of a substrate allowing a catalyst metal to deposit thereon, or an underlying material, even for the case where the substrate is not used, in which a titanium-cobalt composite p... | 04/03/2012 |
| 8089152 | Continuously variable graded artificial dielectrics using nanostructures Graded artificial dielectrics using nanostructures, such as nanowires, are disclosed. The graded artificial dielectric includes a material (typically a dielectric) with a plurality of nanostructures, such as nanowires, embedded within the dielectric material. One or... | 01/03/2012 |
| 7948082 | Method of fabricating a patterned nanoscopic article Nanowire articles and methods of making the same are disclosed. A conductive article includes a plurality of inter-contacting nanowire segments that define a plurality of conductive pathways along the article. The nanowire segments may be semiconducting nanowires, m... | 05/24/2011 |
| 7911057 | Bumpless flip-chip assembly with a complaint interposer contractor Consistent with an example embodiment, an integrated circuit device (IC) is assembled on a package substrate and encapsulated in a molding compound. There is a semiconductor die having a circuit pattern with contact pads. A package substrate having bump pad landings... | 03/22/2011 |
| 7830009 | Semiconductor package and method of manufacturing the same A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, th... | 11/09/2010 |
| 7777335 | Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles. ... | 08/17/2010 |
| 7719112 | On-chip magnetic components An integrated circuit chip comprising a bond wire and a mass of magnetic material provided on the bond wire, wherein the mass of magnetic material increases the inductance of the bond wire. ... | 05/18/2010 |
| 7705458 | Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same A foamed bulk metallic glass electrical connection is formed on a substrate of an integrated circuit package. The foamed bulk metallic glass electrical connection exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed bulk metallic... | 04/27/2010 |
| 7550848 | Semiconductor constructions comprising particle-containing materials The invention includes methods of forming particle-containing materials, and also includes semiconductor constructions comprising particle-containing materials. One aspect of the invention includes a method in which a first monolayer is formed across at least a port... | 06/23/2009 |
| 7439560 | Semiconductor device using semiconductor nanowire and display apparatus and image pick-up apparatus using the same A semiconductor device, comprising a semiconductor nanowire having a first region with one of a PN junction and a PIN junction and a second region with a field effect transistor structure, a pair of electrodes connected to both ends of the semiconductor nanowire, an... | 10/21/2008 |
| 7429795 | Bond pad structure Bond pad structures are presented. Some embodiments of the structure include a conductive conductor-insulator layer overlying a substrate. The conductive conductor-insulator layer includes a composite region having a conductor sub-region and insulator sub-region, wh... | 09/30/2008 |
| 7414313 | Polymeric conductor donor and transfer method The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component of a device. The present invention also relates to methods pertinent ... | 08/19/2008 |
| 7405419 | Unidirectionally conductive materials for interconnection A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie interconnect materials, and/or may surround interconnect materials, such as b... | 07/29/2008 |
| 7367215 | Formation of metal nanowires for use as variable-range hydrogen sensors The present invention provides for variable-range hydrogen sensors and methods for making same. Such variable-range hydrogen sensors comprise a series of fabricated Pd—Ag (palladium-silver) nanowires—each wire of the series having a different Ag to Pd ratio—wi... | 05/06/2008 |
| 7348670 | Nanostructure, electronic device and method of manufacturing the same Cylinders having Al as a major constituent are orderly arrayed in an (Si, Ge) matrix. In a nanostructure in the form of a mixture film having a plurality of cylinders having Al as a major constituent, and a matrix region surrounding the plurality of cylinders and ha... | 03/25/2008 |
| 7339186 | IC chip with nanowires Arrangement of nanowires with PN junctions between bit lines and word lines are arranged as a ROM memory cell array. A number of the nanowires have dielectric regions and are present only as a dummy. The connections between word and bit lines may also exist as trans... | 03/04/2008 |
| 7332810 | Integrated circuit device and method of producing the same An integrated circuit device having vias having good resistance to migration causing the breaking of a wiring line, or an integrated circuit device having a wiring structure that is fined by breaking the limit of lithography technique is provided. The former device ... | 02/19/2008 |
| 7302856 | Strain sensors based on nanowire piezoresistor wires and arrays A highly sensitive and ultra-high density array of electromechanical nanowires is fabricated. Nanowires are extremely sensitive to the strain induced by the attachment of biological and chemical species. Real-time detection is realized through piezoresistive transdu... | 12/04/2007 |
| 7301779 | Electronic chip and electronic chip assembly A multiplicity of nanotubes are applied to at least one external chip metal contact of an electronic chip in order to make contact between the electronic chip and a further electronic chip. ... | 11/27/2007 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7294919 | Device having a complaint element pressed between substrates A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a s... | 11/13/2007 |
| 7294389 | Microstructure array and a microlens array In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating ... | 11/13/2007 |
| 7271497 | Dual metal stud bumping for flip chip applications A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed t... | 09/18/2007 |
| 7262515 | Energy conversion systems using nanometer scale assemblies and methods for using same Energy conversion systems utilizing nanometer scale assemblies are provided that convert the kinetic energy (equivalently, the thermal energy) of working substance molecules into another form of energy that can be used to perform useful work at a macroscopic level. ... | 08/28/2007 |
| 7252699 | Method for patterning metal using nanoparticle containing precursors Continuous, conducting metal patterns can be formed from metal nanoparticle containing films by exposure to radiation (FIG. 1). The metal patterns can be one, two, or three dimensional and have high resolution resulting in feature sizes in the order... | 08/07/2007 |
| 7247877 | Integrated carbon nanotube sensors A method and structure for an integrated circuit comprising a first transistor and an embedded carbon nanotube field effect transistor (CNT FET) proximate to the first transistor, wherein the CNT FET is dimensioned smaller than the first transistor. The CNT FET is a... | 07/24/2007 |
| 7245493 | Cooler for cooling electric part A cooler cools a plurality of electric parts from both sides thereof. The cooler includes a plurality of cooling units including a pair of cooling tubes for flowing coolant therethrough. A pair of cooling tubes having a flat shape is disposed to sandwich the electri... | 07/17/2007 |
| 7242582 | Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module A semiconductor module has metallic radiator plates provided at central regions of principal surfaces of a sealing resin so as to expose from these principal surfaces. The metallic radiator plates and the principal surfaces of the sealing resin are bonded via grease... | 07/10/2007 |
| 7221570 | Heat dissipating device for an integrated circuit chip An electronic assembly comprises a support board, an integrated circuit chip interconnected and coupled to the support board, and a thermal-gap-filler pad placed over the integrated circuit chip and in contact with an external device to dissipate heat generated by t... | 05/22/2007 |
| 7217946 | Method for making a wire nanostructure in a semiconductor film This invention relates to a process for manufacturing nanowire structures, the process comprising the following steps: manufacture of a thin semiconductor film (1) extending between a first terminal (4) and a second t... | 05/15/2007 |
| 7214962 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer The present invention is directed toward apparatus and methods of testing and assembling bumped die and bumped devices using an anisotropically conductive layer. In one embodiment, a semiconductor device comprises a bumped device having a plurality of conductive bum... | 05/08/2007 |
| 7205626 | Light-emitting or light-receiving with plurality of particle-shaped semiconductor devices having light-emitting or light-receiving properties In a semiconductor module, twenty five semiconductor devices having light receiving properties, for example, are arranged in five by five matrices using a conductor mechanism formed from six lead frames Each column of semiconductor devices is connected in series and... | 04/17/2007 |
| 7199498 | Electrical assemblies using molecular-scale electrically conductive and mechanically flexible beams and methods for application of same Electromechanical systems utilizing suspended conducting nanometer-scale beams are provided and may be used in applications, such as, motors, generators, pumps, fans, compressors, propulsion systems, transmitters, receivers, heat engines, heat pumps, magnetic field ... | 04/03/2007 |
| 7196450 | Electromechanical assemblies using molecular-scale electrically conductive and mechanically flexible beams and methods for application of same Electromechanical systems utilizing suspended conducting nanometer-scale beams are provided and may be used in applications, such as, motors, generators, pumps, fans, compressors, propulsion systems, transmitters, receivers, heat engines, heat pumps, magnetic field ... | 03/27/2007 |
| 7186381 | Hydrogen gas sensor A hydrogen gas sensor and/or switch fabricated from arrays nanowires composed of metal or metal alloys that have stable metal hydride phases. The sensor and/or switch response times make it quite suitable for measuring the concentration of hydrogen in a flowing gas ... | 03/06/2007 |
| 7172725 | W-Cu alloy having homogeneous micro-structure and the manufacturing method thereof In W—Cu alloy having a homogeneous micro-structure and a fabrication method thereof, the method includes forming mixed powders by mixing tungsten powders with W—Cu composite powders; forming a compact by pressurizing-forming the mixed powders; forming a skeleton... | 02/06/2007 |
| 7160796 | Method for manufacturing wiring board and semiconductor device Pads to be used for flip chip bonding and wire bonding are pattern-formed on a surface of a substrate. The pads to be used for flip chip bonding are shielded. Plating is applied to each of the pads to be used for wire bonding. Bonding pads for wire bonding is shield... | 01/09/2007 |
| 7151313 | Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment Methods are provided to form wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment, with which highly reliable electrical wirings having minute wiring patterns can be formed. In wiring forming method for a tile-sh... | 12/19/2006 |
| 7145254 | Transfer-molded power device and method for manufacturing transfer-molded power device A semiconductor device includes a semiconductor chip that generates heat in operation, a pair of heat sinks for cooling the chip, and a mold resin, in which the chip and the heat sinks are embedded. The thickness t1 of the chip and the thickness t2 of ... | 12/05/2006 |
