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| Number | Title | Issue Date |
| 8110923 | Semiconductor device and method of manufacturing the same An improved manufacturing method of a semiconductor device is provided. The method includes preparing a semiconductor substrate having an integrated circuit together with connection pads. The method also includes forming a dielectric film on the semiconductor substr... | 02/07/2012 |
| 8106510 | Nano-tube thermal interface structure A semiconductor structure having: an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electri... | 01/31/2012 |
| 8026603 | Interconnect structure of an integrated circuit and manufacturing method thereof An interconnect structure of an integrated circuit and manufacturing method therefore are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conduct... | 09/27/2011 |
| 7880301 | Semiconductor device and method for manufacturing the same A semiconductor device includes a semiconductor element including a semiconductor substrate having an element region, a laminated film formed on the semiconductor substrate and including a low dielectric constant insulating film, and a laser-machined groove provided... | 02/01/2011 |
| 7880300 | Semiconductor chip comprising a metal coating structure and associated production method A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9... | 02/01/2011 |
| 7863743 | Capactive connectors with enhanced capacitive coupling A single-chip module (SCM) and a multi-chip module (MCM) that includes at least two instances of the SCM are described. The SCM includes a pad disposed on a substrate. This pad has a top surface that includes a pattern of features. A given feature in the pattern of ... | 01/04/2011 |
| 7816788 | Structure, method and system for assessing bonding of electrodes in FCB packaging Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrod... | 10/19/2010 |
| 7812450 | Electrode with nano-sized structures The present invention relates to an electrode 100 with high capacitance. The electrode includes a conducting substrate 10 with a number of nano-sized structures 13 thereon and a coating 15. The nano-sized structures are concave-shaped and... | 10/12/2010 |
| 7679191 | Polysilicon film with increased roughness The semiconductor device, in which a flaking of a layer or an element is prevented, is provided. A bonding pad section 13 of a semiconductor device 1 includes a polysilicon film 131, a barrier metal film 133 provided on the polysilicon fi... | 03/16/2010 |
| 7622806 | Laser mark on an IC component A laser mark is inscribed on an IC component, which character stroke consists of a plurality of laser paths inscribed by a laser beam. The width of the character stroke is greater than the widths of the laser paths. In addition, at least two of the laser paths, movi... | 11/24/2009 |
| 7514790 | Semiconductor device and method of manufacturing a semiconductor device A semiconductor device comprises: an insulation layer located on or above a semiconductor element; a conductive pad formed on the insulation film; and a first opening pattern formed on the conductive pad. ... | 04/07/2009 |
| 7405418 | Memory device electrode with a surface structure The invention relates to a memory device electrode, in particular for a resistively switching memory device, wherein the surface of the electrode is provided with a structure, in particular comprises one or a plurality of shoulders or projections, respectively. Furt... | 07/29/2008 |
| 7391120 | Increasing the adhesion of an adhesive connection in housings A housing having a non-detachable bond to a micromechanical component using a flexible bonding material in particular. The combination including the housing and the micromechanical component as well as the manufacturing method of this combination. At least part of t... | 06/24/2008 |
| 7368374 | Super high density module with integrated wafer level packages A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packa... | 05/06/2008 |
| 7365280 | Switch and manufacturing method thereof A switch provided with a fixed contact and a movable contact coming into contact with each other and separating from each other. The surface of at least one of the fixed contact and the movable contact is provided with a plurality of recesses whose edges are overlap... | 04/29/2008 |
| 7358607 | Substrates and systems to minimize signal path discontinuities Arrangements are used for minimizing signal path discontinuities. ... | 04/15/2008 |
| 7351096 | Cable connector A cable connector includes a contact assembly including an electrical insulating block part which is configured to incorporate plural signal contacts; and a relay wiring substrate mounted to a back of the contact assembly. The relay wiring substrate includes, on a s... | 04/01/2008 |
| 7352071 | Method of fabricating anti-warp package An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location undern... | 04/01/2008 |
| 7332424 | Fluxless solder transfer and reflow process Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately ... | 02/19/2008 |
| 7329934 | Smooth metal semiconductor surface and method for making the same A method for reducing the surface roughness of a metal layer is provided. In some embodiments, the method may include polishing the metal layer to a level substantially above any layers arranged directly beneath the metal layer. In some cases, the semiconductor topo... | 02/12/2008 |
| 7314817 | Microelectronic device interconnects A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns. ... | 01/01/2008 |
| 7285856 | Package for semiconductor devices To prevent the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a small strength. ... | 10/23/2007 |
| 7279792 | Semiconductor device and method of manufacturing same According to this invention, a semiconductor device has an upper surface on which an external connection electrode is formed and a lower surface which opposes the upper surface and is in a mirror surface state. A roughened region roughened by laser marking is formed... | 10/09/2007 |
| 7276793 | Semiconductor device and semiconductor module A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed throu... | 10/02/2007 |
| 7274102 | Contacting device, testing method and corresponding production method A contacting device comprises a carrier device with a first surface, a plurality of first terminal regions on the first surface, at least one elastic elevation on the first surface, and a plurality of interconnects, each running from a respective of the first termin... | 09/25/2007 |
| 7271480 | Constraint stiffener design A constraint stiffener for reinforcing an integrated circuit package is provided. In one embodiment, the constraint stiffener comprises a rigid, planar base element for bonding to an integrated circuit substrate. The base element has a plurality of elongated support... | 09/18/2007 |
| 7245014 | Semiconductor light emitting apparatus and method for producing the same A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder materia... | 07/17/2007 |
| 7233067 | Manufacturing a bump electrode with roughened face The invention includes a semiconductor device, and a method for making the same, wherein bumps of a semiconductor chip and inner leads of a film tape carrier can be securely bonded to each other by thermal welding using a heating unit. A semiconductor wafer is etche... | 06/19/2007 |
| 7229936 | Method to reduce photoresist pattern collapse by controlled surface microroughening A method is provided for preparing a substrate for photolithographic patterning. The method includes providing a substrate having at least an exposed rough surface layer including a polymeric material. The rough surface layer has surface features characterized by fe... | 06/12/2007 |
| 7224043 | Semiconductor element with improved adhesion characteristics of the non-metallic surfaces The invention relates to a semiconductor element with metallic and non-metallic surfaces, with the non-metallic surfaces of the semiconductor being provided with a layer which has irregularities, so that adhesion between the non-metallic surface and the molding comp... | 05/29/2007 |
| 7214569 | Apparatus incorporating small-feature-size and large-feature-size components and method for making same An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The fi... | 05/08/2007 |
| 7214604 | Method of fabricating ultra thin flip-chip package Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the s... | 05/08/2007 |
| 7208964 | Probe card It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probe 200 has a shape including a first quarter circle arc... | 04/24/2007 |
| 7205652 | Electronic assembly including multiple substrates An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having ... | 04/17/2007 |
| 7196000 | Method for manufacturing a wafer level chip scale package A semiconductor wafer with semiconductor chips having chip pads and a passivation layer is provided. First and second dielectric layers are sequentially formed on the passivation layer. The first and second dielectric layers form a ball pad area that includes an emb... | 03/27/2007 |
| 7190073 | Circuit film with bump, film package using the same, and related fabrication methods A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a l... | 03/13/2007 |
| 7180173 | Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC) A method of forming a heat spreader ball grid array package, and the resultant heat spreader ball grid array package, comprising the following steps. A semiconductor chip affixed to a ball grid substrate is provided. The semiconductor chip over the ball grid substra... | 02/20/2007 |
| 7173336 | Hybrid integrated circuit device A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed throu... | 02/06/2007 |
| 7170187 | Low stress conductive polymer bump Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dend... | 01/30/2007 |
| 7170172 | Semiconductor device having a roughened surface An oxide film formed on the surface of copper film of an electrode pad is cleaned by oxalic acid after unevenness is formed on the surface of copper film by treating the surface with organic acid. Thereby, stable resistance is obtained when carrying out a characteri... | 01/30/2007 |
