Bizarre Patents
A simulation environment for the sport of boxing utilizing a robotic machine interface system which carries a person.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 4862248 | Contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements In a contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements, in which a circuit element body provided on at least one of two major surfaces located opposite each other with a thick, pressure-contact lay... | 08/29/1989 |
| 4845543 | Semiconductor device and method of manufacturing the same A semiconductor device in which a pellet and external leads are connected by bonding wires made of aluminum containing a predetermined amount of at least one additive element, the bonding wires containing 0.05 to 3.0 weight % of at least one element selec... | 07/04/1989 |
| 4807021 | Semiconductor device having stacking structure A semiconductor device includes a base semiconductor structure including semiconductor elements, interconnection layers for connecting the semiconductor elements together, and conductive pads to which the interconnection layers are connected, at least one... | 02/21/1989 |
| 4748495 | High density multi-chip interconnection and cooling package A package for mounting and cooling a high density array of integrated circuit chips includes an interconnection assembly for the IC chips which (1) provides base connections to a printed circuit board (PCB), which is adapted to connect to external signal ... | 05/31/1988 |
| 4746966 | Logic-circuit layout for large-scale integrated circuits A VLSI chip has multiple annular rings of circuit cells, interspersed with annular wiring channels for interconecting the cells. Another wiring layer runs perpendicular to the rings. A central chip area contains all the I/O connections for the chip.... | 05/24/1988 |
| 4731643 | Logic-circuit layout for large-scale integrated circuits A VLSI chip has multiple annular rings of circuit cells, interspersed with annular wiring channels for interconnecting the cells. Another wiring layer runs perpendicular to the rings. A central chip area contains all the I/O connections for the chip.... | 03/15/1988 |
| 4720738 | Focal plane array structure including a signal processing system A structure for a focal plane array substrate is disclosed that includes a focal plane array positioned above a semiconductor substrate containing a signal processor. The signal processor is connected to the image detection elements of the focal plane arr... | 01/19/1988 |
| 4604644 | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making An improved solder interconnection for forming I/O connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array joining a set of I/O's on a flat surface of the semiconduc... | 08/05/1986 |
| 4600600 | Method for the galvanic manufacture of metallic bump-like lead contacts A method of galvanic manufacture of bump-like lead contacts of semiconductor components. The lead contacts are formed of etchable metals having a surface coating of gold. The gold is chemically deposited onto the lead contacts in a first and in a second w... | 07/15/1986 |
| 4591896 | Pressure-contact sealing arrangement for a semiconductor pellet An assembled semiconductor device comprising a base constituting one electrode, a semiconductor pellet mounted on the base, an insulation ring located to surround the semiconductor pellet and having a height larger than the thickness of the semiconductor ... | 05/27/1986 |
| 4336551 | Thick-film printed circuit board and method for producing the same A thick-film printed circuit board and a method for producing the same are disclosed, in which wiring conductors having connecting sections for connection with solder electrodes of an electronic element such as a semiconductor chip are provided on an insu... | 06/22/1982 |
| 4288808 | Circuit structures including integrated circuits The specification discloses a structure for locating integrated circuits on a substrate by etching V grooves in a silicon substrate arranged to co-operate with spheroidal connectors on the integrated circuit. Contact pads are located in the V grooves wher... | 09/08/1981 |
| 4249299 | Edge-around leads for backside connections to silicon circuit die Electrical connection is made to circuits in a silicon die from its bottom surface through vacuum deposited contacts formed around one of its edges.... | 02/10/1981 |
| 4127321 | Liquid crystal display apparatus The display apparatus comprises a liquid crystal display element, a circuit board and electroconductive members interconnecting them. External terminals are formed on one substrate of the display element and input terminals are formed on the circuit board... | 11/28/1978 |
| 4122479 | Optoelectronic device having control circuit for light emitting element and circuit for light receiving element integrated in a semiconductor body An optoelectronic device comprises a light emitting element having a source from which a light signal is emitted, a semiconductor body having a light receiving element, a control circuit for the emitting element, and a circuit for the receiving element wh... | 10/24/1978 |
| 4109269 | Opto-coupler semiconductor device An opto-coupler semiconductor device includes a sensor integrated circuit mounted on a lead frame with an LED which is attached to beam leads on a copper clad tape mounted directly over the sensor portion of the integrated circuit by means of a transparen... | 08/22/1978 |
| 3947867 | Two part package for a semiconductor die Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite stru... | 03/30/1976 |
