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| Number | Title | Issue Date |
| 7357293 | Soldering an electronics package to a motherboard In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of... | 04/15/2008 |
| 7358618 | Semiconductor device and manufacturing method thereof A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce s... | 04/15/2008 |
| 7358173 | Bumping process of light emitting diode A bumping process for a light emitting diode (LED) chip is provided. Firstly, a LED chip with a plurality of electrodes is provided, then a pattern plate having a plurality of openings is disposed on the LED chip, and the electrodes are correspondingly exposed by th... | 04/15/2008 |
| 7358619 | Tape carrier for TAB A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides... | 04/15/2008 |
| 7358607 | Substrates and systems to minimize signal path discontinuities Arrangements are used for minimizing signal path discontinuities. ... | 04/15/2008 |
| 7355272 | Semiconductor device with stacked semiconductor chips of the same type A semiconductor device includes a wiring board, a first semiconductor chip (e.g. DRAM) that is flip-chip connected on the wiring board, a second semiconductor chip (e.g. DRAM) that is of the same type as the first semiconductor chip and is mounted face up on the fir... | 04/08/2008 |
| 7355280 | Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is form... | 04/08/2008 |
| 7354797 | Method for producing a plurality of electronic devices An electronic device has external contact elements projecting from at least one external contact side of a plastic housing. The external contact elements have an internal section and an external section. The external section has an external contact region tapering a... | 04/08/2008 |
| 7354782 | Group III nitride based flip-chip integrated circuit and method for fabricating A flip-chip integrated circuit and method for fabricating the integrated circuit are disclosed. A method according to the invention comprises forming a plurality of active semiconductor devices on a wafer and separating the active semiconductor devices. Passive comp... | 04/08/2008 |
| 7355279 | Semiconductor device and fabrication method thereof A semiconductor device and a fabrication method thereof are provided. A semiconductor substrate having a plurality of bonding pads is prepared, and a first passivation layer, a second passivation layer and a metallic layer are successively formed on the semiconducto... | 04/08/2008 |
| 7352054 | Semiconductor device having conducting portion of upper and lower conductive layers A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a semiconductor substrate and a plurality of external connecting electrod... | 04/01/2008 |
| 7350988 | Optical module and method of manufacturing the same An optical module including: a housing formed of ceramics and having a base portion and a frame portion provided on the base portion; an optical element provided inside the frame portion; a cover member for the housing, the cover member being formed of a transparent... | 04/01/2008 |
| 7352071 | Method of fabricating anti-warp package An anti-warp package comprising a packaging substrate, a chip and a stiffening member is provided. The chip is disposed on a top surface of the packaging substrate. The stiffening member is disposed on a bottom surface of the packaging substrate in a location undern... | 04/01/2008 |
| 7352001 | Method of editing a semiconductor die Resistance and capacitance are added to a prototype die to fix or identify performance issues with the integrated circuit formed in the die by forming a thin piece of silicon on the top surface of the die. For resistance, vias are formed to regions on the metal trac... | 04/01/2008 |
| 7348669 | Bump structure of semiconductor device and method of manufacturing the same In connection with a bump of a semiconductor device and a manufacturing method thereof, a groove is formed in a bump pad region of a semiconductor substrate. An under bump metal layer is then formed in the groove, and a lower end portion of the bump fills the groove... | 03/25/2008 |
| 7348210 | Post bump passivation for soft error protection A structure and a method for forming the same. The method includes (a) providing a structure which includes (i) a dielectric layer, (ii) an electrically conducting bond pad on and in direct physical contact with the dielectric layer top surface, (iii) a first passiv... | 03/25/2008 |
| 7347352 | Low loop height ball bonding method and apparatus In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top o... | 03/25/2008 |
| 7348662 | Composite multi-layer substrate and module using the substrate A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and... | 03/25/2008 |
| 7345358 | Copper interconnect for semiconductor device An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described whe... | 03/18/2008 |
| 7344061 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 03/18/2008 |
| 7341887 | Integrated circuit die configuration for packaging Integrate circuit die terminal arrangements and configurations for mounting an integrate circuit die on a package substrate to reduce package transmission paths. In one embodiment, terminals for signals sensitive to trace length outside a die are arranged at the cor... | 03/11/2008 |
| 7342319 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to t... | 03/11/2008 |
| 7342312 | Semiconductor device The semiconductor device has the CSP structure, and includes: a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bum... | 03/11/2008 |
| 7342320 | Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly An electronic component includes a semiconductor chip with an active front face and a passive rear face, with contact connections and contact surfaces respectively being provided on the active front face and/or on the passive rear face, and with conductive connectio... | 03/11/2008 |
| 7339794 | Stacked memory module in mirror image arrangement and method for the same A stacked memory module is manufactured in mirror image arrangement and a method for the same. The pins of a first memory unit and pins of a second memory unit are electrically connected to an upper face and a lower face of a first printed circuit board made of rigi... | 03/04/2008 |
| 7339276 | Underfilling process in a molded matrix array package using flow front modifying solder resist Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By... | 03/04/2008 |
| 7339263 | Integrated circuit packages, systems, and methods An integrated circuit package includes a first capacitor supported by a surface of a substrate, and a second capacitor supported by the surface of the substrate. The first capacitor is within a die shadow region, and the second capacitor lies outside of the die shad... | 03/04/2008 |
| 7337522 | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimens... | 03/04/2008 |
| 7335532 | Method of assembly for multi-flip chip on lead frame on overmolded IC package A multichip module package uses bond wire with plastic resin on one side of a lead frame to package an integrated circuit and flip chip techniques to attach one or more mosfets to the other side of the lead frame. The assembled multichip module 30 has an inte... | 02/26/2008 |
| 7335982 | Chip package structure and chip packaging process A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the ca... | 02/26/2008 |
| 7335970 | Semiconductor device having a chip-size package Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided i... | 02/26/2008 |
| 7332821 | Compressible films surrounding solder connectors Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to t... | 02/19/2008 |
| 7333217 | System and method for detecting and correcting position deviations of an object having a curved surface A position deviation system and method detects and corrects position deviations between the optical axis of an optical system, such as an exposure apparatus, and the center of a curved shaped object, such as a spherical shaped semiconductor. The system determines po... | 02/19/2008 |
| 7332817 | Die and die-package interface metallization and bump design and arrangement A die metallization and bump design/arrangement, and a die-package interface metallization and bump design/arrangement are described herein. ... | 02/19/2008 |
| 7332801 | Electronic device An electronic device includes a first die that includes wires for bonding, a second die that includes an array of balls for bonding, and a substrate. The substrate includes bond sites for wires from the first die, and bond sites for the array of balls from the secon... | 02/19/2008 |
| 7332800 | Semiconductor device For high density packaging of a semiconductor device, the semiconductor device has a multi-layer substrate, a first-stage chip connected electrically to the multi-layer substrate, other package substrates stacked in three stages on the multi-layer substrate and each... | 02/19/2008 |
| 7332423 | Soldering a die to a substrate One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a fe... | 02/19/2008 |
| 7332799 | Packaged chip having features for improved signal transmission on the package A packaged chip is provided which includes a package element on which a signal-bearing conductive trace has an edge laterally adjacent to an edge of a reference conductive trace (e.g., ground trace) on the same face of a dielectric element, the two traces together f... | 02/19/2008 |
| 7331502 | Method of manufacturing electronic part and electronic part obtained by the method In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be co... | 02/19/2008 |
| 7329603 | Semiconductor device and manufacturing method thereof A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on this surface. The first resin film has elasticity low enough to reduce s... | 02/12/2008 |
