Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7485959 | Structure for joining a semiconductor package to a substrate using a solder column A semiconductor package and a package mounting substrate can be joined using a conductive material column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder colum... | 02/03/2009 |
| 7485960 | Semiconductor device and manufacturing method thereof A semiconductor device of the invention includes a semiconductor element (1), an interposer (5) having electrodes (2) arranged on a top face thereof in four directions and external electrodes (4) arranged on a bottom face thereof with the... | 02/03/2009 |
| 7476968 | Semiconductor device including an under electrode and a bump electrode Making the relative size of the surface area of a bump electrode at a portion in contact with an under electrode larger than the surface area of a base of a hole increases the contact surface area between the lower surface of the bump electrode and a polyimide layer... | 01/13/2009 |
| 7473997 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching A method for forming an interconnect structure for a semiconductor device includes defining a via in a passivation layer so as expose a top metal layer in the semiconductor device. A seed layer is formed over the passivation layer, sidewalls of the via, and the top ... | 01/06/2009 |
| 7470985 | Solder connector structure and method Disclosed are embodiments of a far back end of the line solder connector and a method of forming the connector that eliminates the use aluminum, protects the integrity of the ball limiting metallurgy (BLM) layers and promotes adhesion of the BLM layers by incorporat... | 12/30/2008 |
| 7462936 | Formation of circuitry with modification of feature height A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts. ... | 12/09/2008 |
| 7462937 | Semiconductor device A semiconductor device includes: a semiconductor substrate; an insulation layer which is disposed on the semiconductor substrate and includes a groove formed on a second surface of the insulation layer, opposite from a first surface of the insulation layer facing th... | 12/09/2008 |
| 7449779 | Wire bonded wafer level cavity package A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front... | 11/11/2008 |
| 7446414 | Semiconductor device A semiconductor device includes a semiconductor substrate, an electrode pad electrically connected to a circuit element formed on the semiconductor substrate, a connection wiring electrically connected to the electrode pad and extending on the semiconductor substrat... | 11/04/2008 |
| 7442878 | Low stress conductive polymer bump Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dend... | 10/28/2008 |
| 7443038 | Flip-chip image sensor packages The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an ... | 10/28/2008 |
| 7443040 | Aluminum cap with electroless nickel/immersion gold A resulting solder bump structure comprising the following steps. A structure having a metal bond pad formed thereover is provided. A patterned cover layer is formed over the structure. The patterned cover layer including an opening exposing a portion of the metal b... | 10/28/2008 |
| 7443041 | Packaging of a microchip device A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer is placed on microchip devices. The interposer includes an aperture which extends from the interposer surface where external electrical contacts are... | 10/28/2008 |
| 7436062 | Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bu... | 10/14/2008 |
| 7436063 | Packaging substrate and semiconductor device A packaging substrate according to the present invention is a packaging substrate to which a semiconductor chip having a plurality of connection metal bodies on a surface thereof is bonded with the surface opposed to the packaging substrate and comprises a wiring pr... | 10/14/2008 |
| 7432585 | Semiconductor device electronic component, circuit board, and electronic device A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a co... | 10/07/2008 |
| 7432595 | System and method to reduce metal series resistance of bumped chip Provided herein, in accordance with one aspect of the present invention, are exemplary embodiments of semiconductor chips having low metallization series resistance. In one embodiment, the semiconductor chip comprises a semiconductor substrate and a metallization st... | 10/07/2008 |
| 7429796 | Semiconductor device and fabrication process thereof A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having ... | 09/30/2008 |
| 7425458 | Selectable decoupling capacitors for integrated circuits and associated methods Selectable capacitors are used to modify performance characteristics of functional circuit elements of an integrated circuit (IC). In an embodiment, the decoupling capacitors are implemented as additional or alternative mounting pads on a surface of the IC. At least... | 09/16/2008 |
| 7425759 | Semiconductor chip assembly with bumped terminal and filler A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulan... | 09/16/2008 |
| 7422974 | Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device A method of manufacturing an electronic component mounting body is used for mounting an IC chip having a bumps as an external mounting terminal on a base material made of thermoplastic resin, comprising: a bump burying step of burying the bumps into the base materia... | 09/09/2008 |
| 7420284 | Semiconductor device and manufacturing method thereof A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump... | 09/02/2008 |
| 7420267 | Image sensor assembly and method for fabricating the same An assembly device of an image sensor chip is disclosed. A flexible circuit has a die-attached portion, a plurality of bendable portions, and a plurality of bonding portions where the bendable portions extend from the die-attached portion and are connected to the co... | 09/02/2008 |
| 7420285 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of the electrodes; a conductive foil provided at a given spacing from the... | 09/02/2008 |
| 7420274 | Method for forming a redistribution layer in a wafer structure A method for forming a redistribution layer in a wafer structure, including (a) providing a wafer having a plurality of conductive structures and a first passivation layer thereon, wherein the first passivation layer covers the wafer except the conductive surfaces o... | 09/02/2008 |
| 7417326 | Semiconductor device and manufacturing method of the same A semiconductor device includes a plurality of electrode layers provided at designated positions of a semiconductor substrate, an organic insulation film formed on the semiconductor substrate by selectively exposing designated areas of the electrode layers, and proj... | 08/26/2008 |
| 7417309 | Circuit device and portable device with symmetrical arrangement To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) att... | 08/26/2008 |
| 7417314 | Semiconductor chip assembly with laterally aligned bumped terminal and filler A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulan... | 08/26/2008 |
| 7416963 | Manufacturing method of semiconductor device This invention offers a manufacturing method to reduce a manufacturing cost of a semiconductor device having a through-hole electrode by simplifying a manufacturing process and to enhance yield of the semiconductor device. A first insulation film is formed on a top ... | 08/26/2008 |
| 7411295 | Circuit board, device mounting structure, device mounting method, and electronic apparatus A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is elec... | 08/12/2008 |
| 7411296 | Method, system, and apparatus for gravity assisted chip attachment A method, system, and apparatus, the apparatus including a metal layer on silicon, photo-resist material disposed on the metal layer, a bump pad reservoir adjacent to the metal layer, a quantity of interconnect metal disposed in the bump pad reservoir, and a resist ... | 08/12/2008 |
| 7407877 | Self-coplanarity bumping shape for flip-chip A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the... | 08/05/2008 |
| 7408261 | BGA package board and method for manufacturing the same Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit... | 08/05/2008 |
| 7408119 | Electrical interconnection for high-frequency devices Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corre... | 08/05/2008 |
| 7407833 | Process for fabricating chip package structure A chip package structure comprising a carrier, a chip and an underfill layer is disclosed. The carrier has a plurality of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps... | 08/05/2008 |
| 7405478 | Substrate package structure and packaging method thereof A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the fi... | 07/29/2008 |
| 7402509 | Method of forming self-passivating interconnects and resulting devices A method of forming self-passivating interconnects. At least one of two mating bond structures is formed, at least in part, from an alloy of a first metal and a second metal (or other element). The second metal is capable of migrating through the first metal to free... | 07/22/2008 |
| 7401523 | Capacitive sensor and method of fabricating A capacitive sensor and a method of making it with a substrate having a diaphragm forming a first plate of a capacitor; a second fixed plate of the capacitor spaced from the diaphragm and defining a predetermined dielectric gap; a plurality of conductor elements int... | 07/22/2008 |
| 7402508 | Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board The invention provides a bump structure whose mounting position, shape, and size are favorably controlled and to a method of manufacturing the same. The bump structure of the invention can be provided on an insulating layer and includes a protruding part made of res... | 07/22/2008 |
| 7400035 | Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ... | 07/15/2008 |
