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| Number | Title | Issue Date |
| 7298022 | Semiconductor sensor A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the ... | 11/20/2007 |
| 7294790 | Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used ... | 11/13/2007 |
| 7295445 | Holder for surface mount device during reflow Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one aspect, may include a substrate, a plurality of terminals coupled with th... | 11/13/2007 |
| 7294827 | Electronic module with light-blocking features An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on t... | 11/13/2007 |
| 7294928 | Components, methods and assemblies for stacked packages A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly e... | 11/13/2007 |
| 7294929 | Solder ball pad structure An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that is aligned over and exposes an inner portion of the contact pad. The ... | 11/13/2007 |
| 7294930 | Semiconductor device and manufacturing process therefor An objective of this invention is to allow each process of contacting of a test probe and bonding to be reliably conducted within a given region. A semiconductor device 100 has a probing mark 111 forming region; a bonding pad 110 having a bondin... | 11/13/2007 |
| 7291924 | Flip chip stacked package A flip chip stacked package mainly comprises a carrier, a lower chip, an upper chip, a plurality of bumps, a plurality of bonding wires and a supporter. The supporter is attached to the lower surface of the carrier via an adhesive and covers the opening of the carri... | 11/06/2007 |
| 7291926 | Multi-chip package structure The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the su... | 11/06/2007 |
| 7291915 | Circuit board and method of manufacturing the same A circuit board includes an insulating substrate, a first conductive layer on the insulating substrate, a second conductive layer on the first conductive layer, and a third conductive layer covering the first conductive layer and the second conductive layer. The fir... | 11/06/2007 |
| 7291916 | Signal transmission structure and circuit substrate thereof A signal transmission structure suitable for a multi-layer circuit substrate comprising a core layer and at least a dielectric layer is provided. The signal transmission structure according to the present invention comprises a first via landing pad and a reference p... | 11/06/2007 |
| 7291908 | Quad flat no-lead package structure and manufacturing method thereof The present invention provides a QFN package structure, comprising a chip carrier and at least a chip. The chip is disposed on the top surface of the chip carrier, while the back surface of the chip carrier includes a plurality of flat no-lead conductive leads as I/... | 11/06/2007 |
| 7291549 | Method and structure to reduce risk of gold embrittlement in solder joints A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further compri... | 11/06/2007 |
| 7291547 | Filter device and method for fabricating filter devices A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate elimina... | 11/06/2007 |
| 7291910 | Semiconductor chip assemblies, methods of making same and components for same Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensa... | 11/06/2007 |
| 7287323 | Materials and structure for a high reliability BGA connection between LTCC and PB boards A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is form... | 10/30/2007 |
| 7288729 | Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring l... | 10/30/2007 |
| 7288846 | Semiconductor chip having pads with plural junctions for different assembly methods Development efficiency and mass production efficiency of a semiconductor chip (LSI) is improved, whereby the LSI on which an integrated circuit is formed has plural pad parts connecting the integrated circuit with an external circuit. The pad part is provided with a... | 10/30/2007 |
| 7284991 | Flexible scrub ring contact Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ... | 10/23/2007 |
| 7285196 | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requir... | 10/23/2007 |
| 7285446 | Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device The present invention provides a mounting structure of a semiconductor chip (3) onto an insulated substrate (2). The insulated substrate (2) is made of a polyimide resin, at least side surfaces (3c) of the semiconductor chip (3 | 10/23/2007 |
| 7285867 | Wiring structure on semiconductor substrate and method of fabricating the same A semiconductor device includes a semiconductor substrate having a plurality of connecting pads on one surface, an insulating film formed on one surface of the semiconductor substrate. The insulating film has holes each corresponding to one of the connecting pads, a... | 10/23/2007 |
| 7286764 | Reconfigurable modulator-based optical add-and-drop multiplexer An optical add and drop multiplexer system comprising a first module for providing a first signal; a second module for providing a second signal; and a modulator for receiving a channel of the first signal at a first location, the first location configured to actuat... | 10/23/2007 |
| 7285865 | Micro-package, multi-stack micro-package, and manufacturing method therefor A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; b... | 10/23/2007 |
| 7285734 | Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring l... | 10/23/2007 |
| 7285858 | Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate A confronting surface of a substrate faces a first surface of a semiconductor element. Extension layers are formed on the substrate at positions facing electrodes on the semiconductor element. A levee film is disposed on one of the confronting surface and the first ... | 10/23/2007 |
| 7285854 | Wire bonding method and semiconductor device A wire bonding method for bonding a plurality of conducting wires to connect first conductors and second conductors has the following steps. 1) Bonding a first conducting ball on a first first conductor. 2) Bonding a first conducting wire on the first conducting bal... | 10/23/2007 |
| 7282801 | Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip A microelectronic device chip including a hybrid Au bump in which foreign materials are not generated in a probe tip in an electrical die sorting (EDS) test is provided. The microelectronic device chip includes a chip pad which is connected to a microelectronic devi... | 10/16/2007 |
| 7282792 | Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are pr... | 10/16/2007 |
| 7282800 | Semiconductor device and method of manufacturing the same The present invention provides a semiconductor device capable of improving productivity while maintaining electrical characteristics, and a manufacturing method thereof. One characteristic point of the present invention is that a plating processing condition (A) for... | 10/16/2007 |
| 7279356 | Depopulation of a ball grid array to allow via placement The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid array having open spaces therein. Within the open spaces, pairs of op... | 10/09/2007 |
| 7279720 | Large bumps for optical flip chips The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer. ... | 10/09/2007 |
| 7279797 | Module assembly and method for stacked BGA packages Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the s... | 10/09/2007 |
| 7276800 | Carrying structure of electronic components A carrying structure of electronic components is proposed. The carrying structure includes at least one supporting board with at least one cavity disposed thereon, at least one adhesive layer formed on the supporting board, and at least one electronic component havi... | 10/02/2007 |
| 7275925 | Apparatus for stereolithographic processing of components and assemblies An apparatus for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic processing. A double platen assembly including a first platen and a second platen... | 10/02/2007 |
| 7276801 | Designs and methods for conductive bumps Methods, techniques, and structures relating to die packaging. In one exemplary implementation, a die package interconnect structure includes a semiconductor substrate and a first conducting layer in contact with the semiconductor substrate. The first conducting lay... | 10/02/2007 |
| 7276802 | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to t... | 10/02/2007 |
| 7276792 | Semiconductor device, circuit substrate, electro-optic device and electronic appliance A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin pr... | 10/02/2007 |
| 7276386 | Semiconductor device and method of manufacturing the same A method of manufacturing a semiconductor device includes the steps of forming barrier metals on first electrodes provided on a chip of the semiconductor device, implementing a predetermined test on the semiconductor device by applying a signal to the semiconductor ... | 10/02/2007 |
| 7274103 | Semiconductor device and manufacturing method thereof In a semiconductor module connecting a semiconductor element and a passive element to a printed board, each of connection portions between the semiconductor element and the printed board and between the passive element and the printed board includes a metal with a m... | 09/25/2007 |
