Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8183689 | Printed circuit board and flip chip package using the same with improved bump joint reliability A printed circuit board and a flip chip package using the same are designed to minimize thermal stress due to different thermal coefficients present in areas having metal lines and solder resist versus other areas on the printed circuit board. The printed circuit bo... | 05/22/2012 |
| 8183691 | Semiconductor device with pads overlapping wiring layers including dummy wiring A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of wirings arranged within the regions of the electrode pads are, respecti... | 05/22/2012 |
| 8183690 | Electronic device An electronic device including: a semiconductor chip on which an integrated circuit is formed; an electrode formed on the semiconductor chip and electrically connected to the integrated circuit; a resin protrusion disposed on the semiconductor chip; an interconnect ... | 05/22/2012 |
| 8178969 | Flip chip package A flip chip package may include a substrate, a semiconductor chip, main bump structures and auxiliary bump structures. The substrate has a circuit pattern. The semiconductor chip is arranged over the substrate. The semiconductor chip includes a body having semicondu... | 05/15/2012 |
| 8178970 | Strong interconnection post geometry A flip-chip packaging assembly and integrated circuit device are disclosed. An exemplary flip-chip packaging assembly includes a first substrate; a second substrate; and joint structures disposed between the first substrate and the second substrate. Each joint struc... | 05/15/2012 |
| 8178968 | Electronic component An electronic component includes: an active surface; a plurality of external connection terminals included in the active surface; a bump electrode disposed to the active surface, the bump electrode including: an internal resin formed on the active surface as a core;... | 05/15/2012 |
| 8178967 | Low fabrication cost, high performance, high reliability chip scale package The invention provides a new method and chip scale package is provided. The inventions starts with a substrate over which a contact point is provided, the contact point is exposed through an opening created in the layer of passivation and a layer of polymer or elast... | 05/15/2012 |
| 8174117 | Semiconductor device and method of manufacturing the same Provided is a semiconductor device having a substrate, a semiconductor chip flip-chip mounted on the substrate, and a stacked film provided in a gap between the substrate and the semiconductor chip. The stacked film is composed of a protective film covering the surf... | 05/08/2012 |
| 8174118 | Detection device and method for manufacturing the same A method for manufacturing a detection device includes the steps of providing bonding bumps on at least one of a light-receiving element array and a read-out circuit multiplexer, fixing a bump height adjusting member for adjusting the heights of the bumps to the lig... | 05/08/2012 |
| 8169076 | Interconnect structures having lead-free solder bumps An integrated circuit structure includes a semiconductor substrate, and a polyimide layer over the semiconductor substrate. An under-bump-metallurgy (UBM) has a first portion over the polyimide layer, and a second portion level with the polyimide layer. A first sold... | 05/01/2012 |
| 8169075 | Electronic part with affixed MEMS According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined dist... | 05/01/2012 |
| 8164189 | Multi-chip semiconductor device An interposer has an opening in the central portion. A plurality of first electrode terminals are formed on the front surface near the opening of the interposer, a plurality of second electrode terminals are formed on the front surface of the peripheral portion ther... | 04/24/2012 |
| 8164187 | Flip chip device and manufacturing method thereof A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the ce... | 04/24/2012 |
| 8164188 | Methods of forming solder connections and structure thereof A method comprises depositing a first metal containing layer into a trench structure, which contacts a metalized area of a semiconductor structure. The method further includes patterning at least one opening in a resist to the first metal containing layer. The openi... | 04/24/2012 |
| 8154123 | Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure A solder bump and a conductive connection structure are provided which can conductively connect a semiconductor chip and a substrate with high connection reliability. Filler 5 is contained in a solder bump 6 and a solder joint 17 which connect a... | 04/10/2012 |
| 8154122 | Semiconductor package and methods of manufacturing the semiconductor package A semiconductor package and a method of manufacturing the semiconductor package are provided. A semiconductor package according to the present general inventive concept may include a base substrate having one surface on which a connection terminal is formed and a fi... | 04/10/2012 |
| 8154121 | Polymer interlayer dielectric and passivation materials for a microelectronic device Polymer interlayer dielectric and passivation materials for a microelectronic device are generally described. In one example, an apparatus includes one or more interconnect structures of a microelectronic device and one or more polymeric dielectric layers coupled wi... | 04/10/2012 |
| 8148819 | Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device A semiconductor device includes a semiconductor substrate on which an electrode and a Cu bump are stacked. On the electrode and the Cu bump, a metal bump layer is provided. The metal bump layer comprises (i) a solder layer via which the semiconductor device is bonde... | 04/03/2012 |
| 8138602 | Solder interconnect pads with current spreading layers Structure and methods of making the structures. The structures include a structure, comprising: an organic dielectric passivation layer extending over a substrate; an electrically conductive current spreading pad on a top surface of the organic dielectric passivatio... | 03/20/2012 |
| 8129840 | Semiconductor package and methods of manufacturing the same A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package include a substrate including a plurality of pads and a plurality of bumps evenly disposed on an entire region of the substrate regardless of an arrangement of... | 03/06/2012 |
| 8129841 | Solder joint flip chip interconnection A flip chip interconnect has a tapering interconnect structure, and the area of contact of the interconnect structure with the site on the substrate metallization is less than the area of contact of the interconnect structure with the die pad. Also, a bond-on-lead o... | 03/06/2012 |
| 8120176 | Semiconductor device having a conductive bump In one embodiment, a semiconductor device includes a semiconductor substrate and a bonding pad disposed thereon. The semiconductor device also includes a passivation layer, a buffer layer, and an insulating layer sequentially stacked on the semiconductor substrate. ... | 02/21/2012 |
| 8120175 | Soft error rate mitigation by interconnect structure A method creates a structure that comprises a carrier connected to an integrated circuit chip by pillars and openings. Thus, in this structure, at least one conductive pillar extends a distance or height from the surface of the integrated circuit chip and a barrier ... | 02/21/2012 |
| 8115307 | Embedding device in substrate cavity An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first device having a device surface and a thickness is placed into the cavit... | 02/14/2012 |
| 8115308 | Microelectronic assemblies having compliancy and methods therefor A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer an... | 02/14/2012 |
| 8115309 | Semiconductor device A semiconductor device including: a semiconductor chip having a rectangular surface on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the surface of the semiconductor chip; and a plurality of interconnects each of which is ele... | 02/14/2012 |
| 8106509 | Electronic device and electronic apparatus An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the su... | 01/31/2012 |
| 8093720 | Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device A mounting structure and a mounting method which are capable of securely electrically connecting wiring on a board and a device to each other in the case where the device is mounted on the board, and are capable of forming a finer bump, and increasing the number of ... | 01/10/2012 |
| 8093721 | Flip chip semiconductor package and fabrication method thereof There is provide a flip chip semiconductor package comprising: an electrode pad formed a semiconductor substrate; a lower metal bonding layer formed on the electrode pad; an upper metal bonding layer formed on the lower metal bonding layer and having a post shape of... | 01/10/2012 |
| 8089150 | Structurally robust power switching assembly A structurally robust power switching assembly, comprising a first rigid structural unit that defines a first unit major surface that is patterned to define a plurality of mutually electrically isolated, electrically conductive paths. Also, a similar, second rigid s... | 01/03/2012 |
| 8084859 | Semiconductor device In a wafer level CSP package, with respect to signal wiring 9b disposed in a signal wiring disposition forbidden region 16 in the vicinity of external output terminals disposed in a package outer peripheral portion, since a stress generated at s... | 12/27/2011 |
| 8072069 | Semiconductor device and method of manufacturing a semiconductor device A semiconductor device includes at least a wiring board, a semiconductor chip that is mounted on one face side of the wiring board, connection pads that are formed on the one face side of the wiring board, and connect through bonding wires to electrode pads on the s... | 12/06/2011 |
| 8072068 | Semiconductor device and a method for manufacturing the same A semiconductor device according to the present invention includes: a semiconductor chip; a sealing resin layer formed on the semiconductor chip; and a post electrode formed in a through-hole penetrating through the sealing resin layer in a thickness direction, and ... | 12/06/2011 |
| 8072070 | Low fabrication cost, fine pitch and high reliability solder bump A barrier layer is deposited over a layer of passivation including in an opening to a contact pad created in the layer of passivation. A column of three layers of metal is formed overlying the barrier layer and aligned with the contact pad and having a diameter that... | 12/06/2011 |
| 8072067 | Semiconductor structure A semiconductor structure including a substrate, an insulating layer, a composite pad structure, a passivation layer, and a bump is provided. A circuit structure is disposed on the substrate. The insulating layer covers the substrate and has a first opening exposing... | 12/06/2011 |
| 8063487 | Manufacturing method of semiconductor apparatus and semiconductor apparatus A first conducting layer is formed on a side of a main surface on which an electrode terminal of a semiconductor device is provided in a semiconductor substrate. The first conducting layer is electrically connected to the electrode terminal of the semiconductor devi... | 11/22/2011 |
| 8063488 | Semiconductor device and manufacturing method thereof The semiconductor device comprises a first area and a second area positioned adjacent to the outside of the first area, the semiconductor substrate having a main surface and side surfaces and disposed in such a manner that the main surface is positioned in the first... | 11/22/2011 |
| 8063486 | Circuit board, method for manufacturing the same, and semiconductor device A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the el... | 11/22/2011 |
| 8044511 | Function element and function element mounting structure The semiconductor device is manufactured by forming a lower electrode layer 2 having a predetermined pattern on a semiconductor substrate 1 and forming an upper electrode layer 3 on a part of the top surface of the lower electrode layer 2... | 10/25/2011 |
| 8044512 | Electrical property altering, planar member with solder element in IC chip package A structure includes a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and ... | 10/25/2011 |
