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Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
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| Number | Title | Issue Date |
| 8164186 | BGA semiconductor device having a dummy bump A BGA semiconductor device includes a semiconductor package and a mounting board mounting thereon the semiconductor package, wherein an array of signal electrodes of the semiconductor package and an array of signal electrodes of the mounting board are coupled togeth... | 04/24/2012 |
| 8072066 | Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring An integrated circuit includes a substrate; a sealing element spanning a periphery of the substrate that forms a protective boundary for the substrate; a plurality of copper lines spanning the substrate in at least two distinct layers contained within the protective... | 12/06/2011 |
| 8030766 | Semiconductor device A semiconductor device that can cope with larger numbers of pins and finer pitches while suppressing lowering of the manufacturing yield and reliability includes: a semiconductor chip having a plurality of electrodes provided on an upper surface thereof; a plurality... | 10/04/2011 |
| 8026600 | Controlled impedance structures for high density interconnections An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described. ... | 09/27/2011 |
| 8013441 | Power semiconductor device in lead frame employing connecting element with conductive film One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device has a vertical current path through a power semiconductor chip. The power semiconductor chip has at least... | 09/06/2011 |
| 7745932 | Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein th... | 06/29/2010 |
| 7732921 | Window type BGA semiconductor package and its substrate A window-type BGA semiconductor package is revealed, primarily comprising a substrate with a wire-bonding slot, a chip disposed on a top surface of the substrate, and a plurality of bonding wires passing through the wire-bonding slot. A plurality of plating line stu... | 06/08/2010 |
| 7659619 | Structures for Z-aligned proximity communication A device includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to the first surface. The firs... | 02/09/2010 |
| 7528485 | Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device A semiconductor device which uses a semiconductor element having main current input/output electrodes, one and the other of which are extended up to a one surface and a remaining surface of a semiconductor chip respectively for causing one of the input/output electr... | 05/05/2009 |
| 7504723 | Electrical connection pattern in an electronic panel A connector layout for arranging a plurality of parallel electrical connectors between two electronic devices. In one device, each connector has a strip connected to a bump pad. The bump pad is superimposed on and electrically connected to a bump pad on the other de... | 03/17/2009 |
| 7489036 | Thin-film device A thin-film device incorporates: a substrate; an insulating layer, a lower conductor layer, a dielectric film, an insulating layer, an upper conductor layer and a protection film that are stacked in this order on the substrate; and four terminal electrodes. The four... | 02/10/2009 |
| 7485958 | Device with beam structure, and semiconductor device A device with a beam structure includes a substrate, an anchor and a cavity which are provided on and over the substrate, respectively, and a beam structure which is provided on the anchor and over the cavity, extends in a first direction and includes a plurality of... | 02/03/2009 |
| 7473996 | Signal transfer film, display apparatus having the same and method of manufacturing the same A signal transfer film includes a base film, a lead line formed on the base film and a passivation layer protecting the lead line. The passivation layer includes a nonlinear edge portion formed at a boundary region between the lead line and the passivation layer. Th... | 01/06/2009 |
| 7439619 | Electronic package structure and the packaging process thereof The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip attachment region. At least a baffle is formed on the surface of the chip car... | 10/21/2008 |
| 7439612 | Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector In certain embodiments, a leadframe structure for forming one or more integrated circuit packages includes a number of adjacent substantially parallel lead bars adapted to receive a die associated with an integrated circuit at one or more of the lead bars such that ... | 10/21/2008 |
| 7432594 | Semiconductor chip, electrically connections therefor A semiconductor device has a semiconductor chip including first and second surfaces opposed to each other in a thickness direction of the semiconductor chip, wherein the first and second surfaces include first and second electrode surfaces respectively, and first an... | 10/07/2008 |
| 7425470 | Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at lea... | 09/16/2008 |
| 7414301 | Printed circuit board with soldering lands The present invention provides a printed circuit board having an area of non-resist portion, where each non-resist portion expands gradually toward the back end of a land array in the dipping direction A. Thus the area of solder deposition also expands in the region... | 08/19/2008 |
| 7414299 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 08/19/2008 |
| 7408244 | Semiconductor package and stack arrangement thereof A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor pac... | 08/05/2008 |
| 7405419 | Unidirectionally conductive materials for interconnection A method of forming and a device including an interconnect structure having a unidirectional electrical conductive material is described. The unidirectional conductive material may overlie interconnect materials, and/or may surround interconnect materials, such as b... | 07/29/2008 |
| 7394146 | MOSFET package A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body con... | 07/01/2008 |
| 7378616 | Heating apparatus and method for semiconductor devices A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the semiconductor device and a layer of compliant material extending over... | 05/27/2008 |
| 7375032 | Semiconductor substrate thinning method for manufacturing thinned die In a method according to the present invention, a substrate thinning process is performed on a bumped substrate prior to the ultimate solder reflow process to heal bump defects caused by the substrate thinning process. Concurrently, the risk of substrate breakage is... | 05/20/2008 |
| 7372144 | High speed electronics interconnect and method of manufacture Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and i... | 05/13/2008 |
| 7372139 | Semiconductor chip package A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bon... | 05/13/2008 |
| 7368818 | Methods of making microelectronic assemblies including compliant interfaces An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and t... | 05/06/2008 |
| 7368326 | Methods and apparatus to reduce growth formations on plated conductive leads A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal... | 05/06/2008 |
| 7365420 | Semiconductor packages and methods for making and using same A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected... | 04/29/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7361976 | Data carrier with a module with a reinforcement strip In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47, 48) of a chip (41 | 04/22/2008 |
| 7358607 | Substrates and systems to minimize signal path discontinuities Arrangements are used for minimizing signal path discontinuities. ... | 04/15/2008 |
| 7351096 | Cable connector A cable connector includes a contact assembly including an electrical insulating block part which is configured to incorporate plural signal contacts; and a relay wiring substrate mounted to a back of the contact assembly. The relay wiring substrate includes, on a s... | 04/01/2008 |
| 7348659 | Semiconductor device and method of manufacturing thereof A semiconductor chip is mounted on a tab, leads alternately arranged around the tab are electrically connected to electrodes of the semiconductor chip via bonding wires, and encapsulating resin encapsulates the semiconductor chip and bonding wires. The lower surface... | 03/25/2008 |
| 7338889 | Method of improving copper interconnects of semiconductor devices for bonding An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described whe... | 03/04/2008 |
| 7339261 | Semiconductor device A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing body having an upper surface, a lower surface opposite to the upper sur... | 03/04/2008 |
| 7332803 | Circuit device A circuit device is provided comprising leads and electrical circuitry. The circuit device has a first semiconductor element, a second semiconductor element, first leads electrically connected to the first semiconductor element or the second semiconductor element vi... | 02/19/2008 |
| 7329597 | Semiconductor chip and tab package having the same A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and ... | 02/12/2008 |
| 7323774 | Integrated circuit package system with pedestal structure An integrated circuit package system includes providing a substrate having a bond finger thereon and forming a pedestal on a portion of the bond finger. A first die is mounted on the substrate and adjacent to the bond finger. A portion of the first die, a portion of... | 01/29/2008 |
| 7323778 | Semiconductor device with improved design freedom of external terminal A semiconductor device comprises: a semiconductor chip; an extension portion formed in contact with the side surfaces so as to surround the semiconductor chip; an insulating film formed on a surface of the extension portion and the semiconductor chip; each of a plur... | 01/29/2008 |
