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| Number | Title | Issue Date |
| 8125081 | Semiconductor device, printed wiring board for mounting the semiconductor device and connecting structure for these The present invention relates to a connecting structure between semiconductor device 1 of a BGA type which has external electrode terminals 9 including column-like electrode 17, insulating layer 16 formed around the column-like electrode ... | 02/28/2012 |
| 7595553 | Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a packaging board. The wiring pattern of the packaging board is formed on an in... | 09/29/2009 |
| 7425758 | Metal core foldover package structures Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip-scale package includes a core member of a metal or alloy having a re... | 09/16/2008 |
| 7416332 | Flexible circuit temperature sensor assembly for flanged mounted electronic devices A temperature sensing system for a flange mounted device is provided. The temperature sensing system (100) can be comprised of a flexible wiring board (102). The temperature sensing system can be further comprised of a temperature sensing device (12... | 08/26/2008 |
| 7411179 | Photodetector module with impedance matching A photodetector module that can achieve impedance matching and power saving. A photodetector (11) and an amplifier (12) for amplifying an electric signal from the photodetector (11) are mounted on a stem (14). A dielectric plate (18 | 08/12/2008 |
| 7378748 | Solid-state imaging device and method for manufacturing the same A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal spac... | 05/27/2008 |
| 7375424 | Wirebonded device packages for semiconductor devices having elongated electrodes A device package includes at least one semiconductor device having at least one electrode of an elongated length. The device package also includes at least one conductive pad that extends parallel to the elongated length of the electrode. A terminal lead may be inte... | 05/20/2008 |
| 7375426 | Semiconductor package A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor c... | 05/20/2008 |
| 7368926 | Electric signal connecting device and probe assembly and probing device using the same The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into c... | 05/06/2008 |
| 7368795 | Image sensor module with passive component An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper surface of the circuit board. A substrate has a first surface, a second... | 05/06/2008 |
| 7361880 | Digital camera module for detachably mounting with flex printed circuit board A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip pack... | 04/22/2008 |
| 7359579 | Image sensor package and its manufacturing method Disclosed are an image sensor package and a method for manufacturing the same. A sealing portion is formed between an image sensor die and a glass substrate to completely isolate the sensing portion of the image sensor die from external environment. Electrically con... | 04/15/2008 |
| 7348666 | Chip-to-chip trench circuit structure A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the trench, and optionally, may divide the trench into sections. A conducti... | 03/25/2008 |
| 7335993 | Multi chip package A multi chip package includes a first semiconductor chip, a second semiconductor chip and a spacer. The spacer is formed between the first semiconductor chip and the second semiconductor chip. The second semiconductor chip is fixed on the first semiconductor chip by... | 02/26/2008 |
| 7332712 | Camera module fabrication method including the step of removing a lens mount and window from the mold An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 02/19/2008 |
| 7327017 | Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and there... | 02/05/2008 |
| 7324333 | Lock for notebook computer or other personal electronic device A notebook/laptop computer or other personal electronic device locking assembly includes a locking base secured to a working surface. The locking base locks the notebook computer or other personal electronic device securely in place to a work surface such as a desk ... | 01/29/2008 |
| 7294536 | Process for manufacturing an SOI wafer by annealing and oxidation of buried channels A process for manufacturing an SOI wafer, including the steps of: forming, in a wafer of semiconductor material, cavities delimiting structures of semiconductor material; thinning out the structures through a thermal process; and completely oxidizing the structures.... | 11/13/2007 |
| 7275312 | Apparatus for precise alignment of packaging caps on a substrate The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packagi... | 10/02/2007 |
| 7274093 | Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulatio... | 09/25/2007 |
| 7274089 | Integrated circuit package system with adhesive restraint An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad. ... | 09/25/2007 |
| 7242085 | Semiconductor device including a semiconductor chip mounted on a metal base A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A... | 07/10/2007 |
| 7227236 | Image sensor package and its manufacturing method Disclosed are an image sensor package and its manufacturing method. As an example, an infrared ray protection glass is positioned directly on an image sensing region of an image sensor die. An electrically conductive wire and so forth located outside the image sensi... | 06/05/2007 |
| 7227261 | Vertical surface mount assembly and methods A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. At least... | 06/05/2007 |
| 7205658 | Singulation method used in leadless packaging process A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of t... | 04/17/2007 |
| 7205180 | Process of fabricating semiconductor packages using leadframes roughened with chemical etchant A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and there... | 04/17/2007 |
| 7205649 | Ball grid array copper balancing A ball grid array device includes a substrate having a first major surface and a second major surface. The first major surface includes leads for electrical connections. The second major surface is devoid of leads. The ball grid array device also includes a first la... | 04/17/2007 |
| 7199359 | Camera module fabrication method including singulating a substrate An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 04/03/2007 |
| 7199470 | Surface-mountable semiconductor component and method for producing it Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip ... | 04/03/2007 |
| 7187077 | Integrated circuit having a lid and method of employing a lid on an integrated circuit The present invention relates to a lid for an integrated circuit. According to one embodiment, an integrated circuit having a lid comprises a substrate having a flat surface and extending a first length and a lid having a recess and a foot portion. The lid generally... | 03/06/2007 |
| 7181968 | Configurable accelerometer assembly An improved accelerometer assembly including a circuit board and an accelerometer is provided. The accelerometer is configured to sense acceleration along a sensing axis. The accelerometer is attached to the circuit board and configured to sense acceleration along a... | 02/27/2007 |
| 7180163 | Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices The specification teaches a device for use in the manufacturing of microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In a preferred embodiment th... | 02/20/2007 |
| 7167074 | Integrated planar flyback transformer Method and apparatus are provided for fabricating a planar transformer assembly for use in an implantable medical device. The planar transformer assembly includes a board, a first core, and a second core. The board has a first side, a second side, and an embedded wi... | 01/23/2007 |
| 7164196 | Semiconductor device A semiconductor device includes a base, a semiconductor element having a plurality of electrodes, a plurality of conductive lines connected to the electrodes of the semiconductor element, plating stubs attached to the conductive lines, and a plurality of wiring laye... | 01/16/2007 |
| 7146106 | Optic semiconductor module and manufacturing method An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main boa... | 12/05/2006 |
| 7145230 | Semiconductor device with a solder creep-up prevention zone The present invention provides a semiconductor device which includes a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal packag... | 12/05/2006 |
| 7140790 | Sector drive assembly for camera A sector drive assembly for a camera which can open and close an aperture has a sector drive unit having an actuator, a drive force transmitting mechanism, and a sector position detecting unit that are removably mounted as a unit to a support plate, and a sector uni... | 11/28/2006 |
| 7138708 | Electronic system for fixing power and signal semiconductor chips An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes. ... | 11/21/2006 |
| 7135704 | VCSEL settling fixture A VCSEL settling fixture provides for a plurality of VCSEL chip packages to be selectively tested within a burn-in or environmental chamber having a remote pendant controller. The settling fixture includes a mounting frame including a plurality of recesses and throu... | 11/14/2006 |
| 7126111 | Camera module having a threaded lens barrel and a ball grid array connecting device An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window s... | 10/24/2006 |
