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| Number | Title | Issue Date |
| 8154120 | Chip-mounted film package A chip-mounted film package includes a base film, an effective film package defined on the base film by a cutting line, a driving chip mounted on the effective film package, a plurality of input pads arranged on an input area of the effective film package and connec... | 04/10/2012 |
| 8106508 | Electronic component for surface mounting The electric component includes at least a set of electrode terminals 2, 3, a semiconductor element 4 electrically connected with the set of electrode terminals, and a package 6 made of synthetic resin and sealing the electrode terminals and the... | 01/31/2012 |
| 8093719 | Seal ring for preventing crack propagation in integrated circuit devices In one embodiment, an integrated circuit device includes an active area encompassed by a seal ring. The seal ring may include a deep moat formed on an outer edge of the seal ring. The deep moat may have a depth that extends substantially to the substrate to prevent ... | 01/10/2012 |
| 8076776 | Integrated circuit package having security feature and method of manufacturing same An integrated circuit package comprises a package substrate (210, 410), an electrically insulating material (220, 420) adjacent to the package substrate, and a mark (230, 420) on the electrically insulating material. The mark is such that a visu... | 12/13/2011 |
| 8076775 | Semiconductor package and method for making the same A semiconductor package includes: a semiconductor substrate; an inner insulator layer formed on the substrate; at least one internal wiring extending from a front side of the substrate along one of lateral sides of the substrate to a rear side of the substrate; a fi... | 12/13/2011 |
| 8044509 | Semiconductor device In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed la... | 10/25/2011 |
| 8022538 | Base package system for integrated circuit package stacking and method of manufacture thereof A method of manufacture of a base package system includes: forming a substrate strip assembly including: providing a substrate strip having ball lands, mounting an integrated circuit on the substrate strip, and molding a finger structure, having a knuckle region, on... | 09/20/2011 |
| 8022539 | Integrated circuit packaging system with increased connectivity and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming a lead frame having contact pads and connection leads; coupling a base integrated circuit to the contact pads; coupling a chip interconnect between the base integrated circuit, the c... | 09/20/2011 |
| 8018056 | Package for high power density devices A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resis... | 09/13/2011 |
| 8004081 | Semiconductor chip package and printed circuit board having through interconnections A semiconductor chip package includes a signal interconnection penetrating a semiconductor chip and transmitting a signal to the semiconductor chip and a power interconnection and a ground interconnection penetrating the semiconductor and supplying power and ground ... | 08/23/2011 |
| 7977786 | Saw debris reduction in MEMS devices An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at... | 07/12/2011 |
| 7939938 | Functional device package with metallization arrangement for improved bondability of two substrates A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said conc... | 05/10/2011 |
| 7936063 | Carrier assembly for an integrated circuit A carrier assembly for an integrated circuit is disclosed. The carrier assembly has a retainer with electrical contacts for receiving the integrated circuit, and island defining portions arranged about the retainer. Each island defining portion is connected to neigh... | 05/03/2011 |
| 7923835 | Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the... | 04/12/2011 |
| 7911054 | Semiconductor device In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed la... | 03/22/2011 |
| 7834452 | Device made of single-crystal silicon A device made of single-crystal silicon having a first side, a second side which is situated opposite to the first side, and a third side which extends from the first side to the second side, the first side and the second side each extending in a 100 plane of... | 11/16/2010 |
| 7808104 | Substrate for mounting electronic component and electronic apparatus including the substrate A recess (5a) in the corner direction and recesses (5b) in side directions are formed in each connecting pad (5A) located at a corner of a lower surface-side of an insulating base 2 having groove-shaped recesses (6) i... | 10/05/2010 |
| 7786576 | Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus A semiconductor device includes a substrate having a resin layer on at least a surface thereof; a thin-film circuit layer provided on the substrate, and a reinforcing section provided on the surface of the substrate so as to surround the thin-film circuit layer.... | 08/31/2010 |
| 7781888 | Surface mounting electronic component and manufacturing method thereof The electric component includes at least a set of electrode terminals 2, 3, a semiconductor element 4 electrically connected with the set of electrode terminals, and a package 6 made of synthetic resin and sealing the electrode terminals and the... | 08/24/2010 |
| 7768124 | Semiconductor sensor having a flat mounting plate with banks A semiconductor sensor is contained in a cylindrical housing, an opening of which is closed with a cover member. The cover member includes a mounting plate integrally molded therewith. Components including a bare sensing chip and other circuit chips are directly mou... | 08/03/2010 |
| 7759792 | Integrated circuit including parylene material layer An integrated circuit includes a substrate including a contact pad, a redistribution line coupled to the contact pad, and a dielectric material layer between the substrate and the redistribution line. The integrated circuit includes a solder ball coupled to the redi... | 07/20/2010 |
| 7741711 | Power semiconductor module with a connected substrate carrier and production method therefor A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner surface (facing the interior of the module) and its outer surface. The cuto... | 06/22/2010 |
| 7705452 | Carrier assembly for an integrated circuit A carrier assembly for an integrated circuit is described. The assembly includes a retainer for receiving the integrated circuit, and island defining portions surrounding the retainer. Each island defining portion is connected to neighboring island defining portions... | 04/27/2010 |
| 7649256 | Semiconductor chip having pollished and ground bottom surface portions A semiconductor chip having a thickness of 130 micrometers or less includes a mechanically ground bottom surface corresponding to a central circuit area, and a polished bottom surface corresponding to a peripheral scribe area. The mechanically ground bottom surface ... | 01/19/2010 |
| 7633159 | Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages A sacrificial substrate for fabricating semiconductor device assemblies and packages with edge contacts includes conductive elements on a surface thereof, which are located so as to align along a street between each adjacent pair of semiconductor devices on the devi... | 12/15/2009 |
| 7598611 | Semiconductor device with side terminals Side terminals 3 at respective corners of a package are higher than side terminals 4 on each side of the package. Thus, even if the side terminals 4 on each side are lower than those according to the conventional art owing to miniaturization or ... | 10/06/2009 |
| 7592699 | Hidden plating traces A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger edges reduces the mechanical stress exerted on the semiconductor die whic... | 09/22/2009 |
| 7521795 | Semiconductor package A semiconductor package has: a semiconductor chip having first and second main electrodes arranged on two principal surfaces being opposite to each other; a first main wiring plate connected to the first main electrode and having a first external connection terminal... | 04/21/2009 |
| 7504722 | Semiconductor device with slanting side surface for external connection The invention provides a semiconductor device and a manufacturing method thereof where mounting strength and accuracy can be improved without making processes complex. Grooves are formed on a back surface of a semiconductor substrate along a dicing line. Via holes a... | 03/17/2009 |
| 7501703 | Acoustic transducer module A module (100, 200, 300, 400, 500, 600) may be electrically connected to a PCB (18) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16) of the device (14). The module includes ... | 03/10/2009 |
| 7492044 | System and method for decreasing stress on solder holding BGA module to computer motherboard Mechanical stress on solder joints that hold BGA modules to computer motherboards is reduced by adding to the motherboard a topmost layer, and forming V-shaped channels into the layer next to the BGA module so that stress is shielded from the BGA module and its sold... | 02/17/2009 |
| 7479697 | Resilient carrier assembly for an integrated circuit Provided is a carrier assembly for an integrated circuit. The assembly includes a carrier having a matrix of island contacts interconnected by respective serpentine members to allow resilient deflection between such contacts, said matrix surrounding a passage define... | 01/20/2009 |
| 7442968 | Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same A chip on film (COF) package comprising a test pad for testing the electrical function of a semiconductor chip and a method for manufacturing same are provided. The COF package comprises a semiconductor chip mounted on a base film, a signal-input portion for receivi... | 10/28/2008 |
| 7443038 | Flip-chip image sensor packages The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an ... | 10/28/2008 |
| 7443023 | High capacity thin module system Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry ... | 10/28/2008 |
| 7443016 | Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is f... | 10/28/2008 |
| 7439616 | Miniature silicon condenser microphone A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume... | 10/21/2008 |
| 7436061 | Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to ex... | 10/14/2008 |
| 7436077 | Semiconductor device and method of manufacturing the same A semiconductor device includes a first surface faced to a mounting board when the semiconductor device is placed over the mounting board and a second surface opposed to the first surface. The semiconductor device also includes a position reference portion which is ... | 10/14/2008 |
| 7432600 | System having semiconductor component with multiple stacked dice A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configu... | 10/07/2008 |
