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"Flight by machines heavier than air is unpractical and insignificant, if not utterly impossible."
Simon Newcomb, astronomer ; Said in 1902, less than two years before the first flight at Kitty Hawk
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| Number | Title | Issue Date |
| 8148818 | Semiconductor device and method for manufacturing the same A conductive shield covering a semiconductor integrated circuit prevents electrostatic breakdown of the semiconductor integrated circuit (e.g., malfunction of a circuit and damage to a semiconductor element) due to electrostatic discharge. Further, with use of a pai... | 04/03/2012 |
| 8143721 | Package substrate dynamic pressure structure Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also i... | 03/27/2012 |
| 8138601 | Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package The waveform signals of ultrasonic waves reflected by a plurality of interfaces in a measurement object are received, the waveform signal of a reflected wave on a reference interface inside the measurement object is detected based on the amplitudes of the received w... | 03/20/2012 |
| 7982309 | Integrated circuit including gas phase deposited packaging material An integrated circuit includes a substrate including an active area and a gas phase deposited packaging material encapsulating the active area. ... | 07/19/2011 |
| 7969002 | Integrated circuit packages incorporating an inductor and methods Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit, and a second area having a plurality of connections from one ... | 06/28/2011 |
| 7919857 | Plastic housing and semiconductor component with said plastic housing A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the ... | 04/05/2011 |
| 7906847 | Semiconductor device To provide a semiconductor device which can increase reliability with respect to external force, especially pressing force, while the circuit size or the capacity of memory is maintained. A pair of structure bodies each having a stack of fibrous bodies of an organic... | 03/15/2011 |
| 7855450 | Circuit module In a circuit module for a high frequency, a resistance film is formed on a side of a semiconductor circuit chip, mounted above a dielectric substrate through ground metal layers, opposite to the dielectric substrate. A distance from the ground metal layer to the res... | 12/21/2010 |
| 7830004 | Packaging with base layers comprising alloy 42 A semiconductor packaging structure is provided. The structure includes a base layer comprising alloy 42; die attached on a first side of the base layer; and an interconnect structure on the die, wherein the interconnect structure comprises vias and conductiv... | 11/09/2010 |
| 7821129 | Low cost hermetic ceramic microcircuit package Hermeticity of microcircuit packages is achieved in one embodiment by recognition that water can penetrate the ceramic structure and thus the ceramic structure is sealed and the edges of the ceramic package are metallically bonded to the electronic package. In one e... | 10/26/2010 |
| 7732920 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus The flip chip mounted body of the present invention includes: a circuit board (213) having a plurality of connection terminals (211); a semiconductor chip (206) having a plurality of electrode terminals (207) that are disposed opposing th... | 06/08/2010 |
| 7705451 | Semiconductor device and method of manufacturing the same A semiconductor device includes a laminated substrate formed by laminating a plurality of semiconductor substrates, a concave part formed in the laminated substrate, and a semiconductor element mounted in the concave part. A method of manufacturing a semiconductor d... | 04/27/2010 |
| 7696622 | MEMS device formed inside hermetic chamber having getter film A MEMS device including a getter film formed inside a hermetic chamber provides stable performance of the MEMS device by electrically stabilizing the getter film. The MEMS device includes a movable portion and a fixed portion formed inside the hermetic chamber. The ... | 04/13/2010 |
| 7629685 | Semiconductor device package Disclosed is a semiconductor device package. The semiconductor device package includes at least one semiconductor device acting as a heating source, a package substrate having an upper surface on which the semiconductor device is mounted, the package substrate at le... | 12/08/2009 |
| 7589420 | Print head with reduced bonding stress and method An ink jet print head includes a silicon ink jet chip, a print head holder, configured to carry and support the silicon chip, and a glass plate, bonded between the silicon chip and the print head holder. The ink jet chip has a coefficient of thermal expansion α | 09/15/2009 |
| 7586194 | Semiconductor device having exposed heat dissipating metal plate A semiconductor device including; a bottom plate having a laminated structure in which between a first and a second metal plates a third metal plate harder than these metal plates is clipped, a concave portion formed by removing a part of the first metal plate lamin... | 09/08/2009 |
| 7554196 | Plastic package and semiconductor component comprising such a plastic package, and method for its production A plastic package and to a semiconductor component including such a plastic package, as well as to a method for its production is disclosed. In one embodiment, the plastic package includes plastic outer faces, which include lower outer contact faces on a lower side ... | 06/30/2009 |
| 7439616 | Miniature silicon condenser microphone A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume... | 10/21/2008 |
| 7436077 | Semiconductor device and method of manufacturing the same A semiconductor device includes a first surface faced to a mounting board when the semiconductor device is placed over the mounting board and a second surface opposed to the first surface. The semiconductor device also includes a position reference portion which is ... | 10/14/2008 |
| 7427786 | Diode device utilizing bellows A diode device is disclosed, comprising a pair of electrodes separated by bellows. The corrugated walls of the bellows create a tortuous thermal pathway thereby reducing parasitic heat losses and increasing the device's efficiency. The bellows' also allow for a cont... | 09/23/2008 |
| 7425758 | Metal core foldover package structures Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip-scale package includes a core member of a metal or alloy having a re... | 09/16/2008 |
| 7425764 | Top layers of metal for high performance IC's A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an ... | 09/16/2008 |
| 7408259 | Sheet to form a protective film for chips A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder ... | 08/05/2008 |
| 7405477 | Ball grid array package-to-board interconnect co-design apparatus A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between package and PCB enhances the signal propagation, minimizes parasitic ... | 07/29/2008 |
| 7384698 | Metal article intended for at least partially coating with a substance and a method for producing the same A metal article intended for at least partially coating with a substance, which includes a metal solder, a plastic, a glass, or a ceramic. The metal article itself may include, in particular, connecting, supporting, or conducting components for an electronic compone... | 06/10/2008 |
| 7372142 | Vertical conduction power electronic device package and corresponding assembling method A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sid... | 05/13/2008 |
| 7368810 | Invertible microfeature device packages Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected ... | 05/06/2008 |
| 7362493 | Micromirror and post arrangements on substrates A micromirror of a micromirror array of a spatial light modulator used in display systems comprises a mirror plate attached to a hinge that is supported by two posts formed on a substrate. Also the mirror plate is operable to rotate along a rotation axis that is par... | 04/22/2008 |
| 7358605 | Heat dissipation structure for electronic device A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering members, and a portion of the heat dissipation frame is exposed outside... | 04/15/2008 |
| 7358106 | Hermetic MEMS package and method of manufacture A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the pa... | 04/15/2008 |
| 7335395 | Methods of using pre-formed nanotubes to make carbon nanotube films, layers, fabrics, ribbons, elements and articles Methods of Using Preformed Nanotubes to Make Carbon Nanotube Films, Layers, Fabrics, Ribbons, Elements and Articles are disclosed. To make various articles, certain embodiments provide a substrate. Preformed nanotubes are applied to a surface of the substrate to cre... | 02/26/2008 |
| 7332809 | Glass substrate having a grooved portion, method for fabricating the same, and press mold for fabricating the glass substrate A press mold for fabricating a glass substrate, the glass substrate comprising a substrate; and a terrace-shaped flat portion formed on the substrate and having a grooved portion formed therein, is characterized in that the press mold comprises a top mold and a bott... | 02/19/2008 |
| 7332797 | Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold The specification discloses an apparatus comprising a die mounted on a substrate, the die being connected to the substrate by a plurality of wires, and a mold cap encapsulating the die and the plurality of wires, the mold cap comprising an electrically insulating po... | 02/19/2008 |
| 7329861 | Integrally packaged imaging module An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted t... | 02/12/2008 |
| 7323238 | Printed circuit board having colored outer layer In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to b... | 01/29/2008 |
| 7303976 | Wafer bonding method One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sea... | 12/04/2007 |
| 7301224 | Surface acoustic wave device and manufacturing method of the same A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap ... | 11/27/2007 |
| 7298046 | Semiconductor package having non-ceramic based window frame A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled ... | 11/20/2007 |
| 7298039 | Electronic circuit device In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a modu... | 11/20/2007 |
| 7279239 | Laminating product including adhesion layer and laminate product including protective film In a laminate product formed by an organic member and/or an inorganic member, high strength adhesion between the organic member and the inorganic member is achieved by providing an adhesion layer which includes amorphous carbon nitride (a-CNx:H) particularly between... | 10/09/2007 |
