Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 8084857 | Method and article of manufacture for wire bonding with staggered differential wire bond pairs A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The ... | 12/27/2011 |
| 8072065 | System and method for integrated waveguide packaging A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel m... | 12/06/2011 |
| 8049332 | Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same A flexible semiconductor package apparatus having a responsive bendable conductive wire member is presented. The apparatus includes a flexible substrate, semiconductor chips, and conductive wires. The semiconductor chips are disposed on the flexible substrate and sp... | 11/01/2011 |
| 8022537 | Semiconductor device The present invention provides a semiconductor device comprising a semiconductor substrate, and transistors formed on the semiconductor substrate, wherein control electrode terminals constituting external electrode terminals of the transistors, and first electrode t... | 09/20/2011 |
| 7994637 | High-frequency semiconductor device An example of a high-frequency semiconductor device includes two unit semiconductor devices. Each of the two unit semiconductor devices has a ground substrate, a high-frequency semiconductor element, an input-side matching circuit, an output-side matching circuit, a... | 08/09/2011 |
| 7977785 | Electronic device including dies, a dielectric layer, and a encapsulating layer An electronic device and a method of packaging an electronic device are disclosed. In one embodiment, the electronic device can include a first die. The electronic device can also include a dielectric layer defining a first opening. The first die can be disposed wit... | 07/12/2011 |
| 7969001 | Method and system for intra-chip waveguide communication Methods and systems for intra-chip waveguide communication are disclosed and may include configuring one or more waveguides in an integrated circuit and communicating one or more signals between blocks within the integrated circuit via the one or more waveguides. Th... | 06/28/2011 |
| 7952197 | Electrical component The invention discloses an electrical component with a carrier substrate, on which at least one semiconductor chip is mounted. Terminal areas are arranged on the underside of the carrier substrate and contact areas designed for the assembly with semiconductor chips ... | 05/31/2011 |
| 7952196 | Affordable high performance high frequency multichip module fabrication and apparatus An interconnect assembly for use in high frequency applications includes an interconnect structure, a plurality of electronic die disposed on the interconnect structure, and an encapsulant at least partially surrounding the plurality of electronic die. The interconn... | 05/31/2011 |
| 7888797 | High frequency package device with internal space having a resonant frequency offset from frequency used A lid forms an internal space on a bottom plate together with a plurality of side walls. A dielectric plate on the bottom plate in the internal space has a smaller width than an inner surface of the lid. A projection on the inner surface of the lid has a surface are... | 02/15/2011 |
| 7851909 | Group III nitride based flip-chip integrated circuit and method for fabricating A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mo... | 12/14/2010 |
| 7838990 | High-frequency hermetically-sealed circuit package A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements, and which includes an opening at an end thereof at the side of the bas... | 11/23/2010 |
| 7838989 | Semiconductor component and apparatus for production of a semiconductor component A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on the chip to the contact connecting pads. Signals are passed via these... | 11/23/2010 |
| 7795729 | Transceiver device A transceiver device includes a dielectric substrate, a ring member that is welded onto the dielectric substrate thereby forming a plurality of cavities, a cover that is welded onto the ring member, and at least one semiconductor device that is arranged in each of t... | 09/14/2010 |
| 7772694 | Integrated circuit module and method of packaging same An integrated circuit (IC) module (20) includes a ground plane (22) having adjoining cutouts (30, 32). The cutout (32) defines a critical signal pathway (38). A device (24) is positioned in the cutout (30) and a devic... | 08/10/2010 |
| 7745930 | Semiconductor device packages with substrates for redistributing semiconductor device electrodes A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connect... | 06/29/2010 |
| 7696621 | RFID tag packaging system An electronic packaging system includes an electronic device. The electronic packaging system also includes a flexible material located adjacent a plurality of sides of the electronic device. The electronic device is located in a cavity in the flexible material. The... | 04/13/2010 |
| 7692295 | Single package wireless communication device An integrated circuit package includes a substrate, first, second and third dies and an antenna. The substrate includes a first layer with electrical traces and a second layer substantially formed of a dielectric material. The first die includes a first integrated c... | 04/06/2010 |
| 7683480 | Methods and apparatus for a reduced inductance wirebond array A wirebond array (100) comprising a plurality of signal wires 110 and a plurality of ground wires (120) interdigitated with and substantially parallel to the set of signal wires (110). In one embodiment, each of the plurality of signal wi... | 03/23/2010 |
| 7675168 | Integrated circuit with staggered differential wire bond pairs An integrated circuit comprises an integrated circuit package and one or more circuit elements disposed within the integrated circuit package. The integrated circuit also comprises at least two differential wire bond pairs providing connections for at least one of t... | 03/09/2010 |
| 7667322 | High-frequency semiconductor device An example of a high-frequency semiconductor device includes two unit semiconductor devices. Each of the two unit semiconductor devices has a ground substrate, a high-frequency semiconductor element, an input-side matching circuit, an output-side matching circuit, a... | 02/23/2010 |
| 7667321 | Wire bonding method and related device for high-frequency applications A wire bond circuit device has a circuit die in which substantially all of the input/output (I/O) pads are disposed along the outermost row of pads. A substrate onto which the die is disposed has wedges that are similarly arranged in rows, with the wedges used to ca... | 02/23/2010 |
| 7659618 | Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device A semiconductor device for radio frequencies of more than 10 GHz having a semiconductor chip is disclosed. In one embodiment, the semiconductor chip, on its active top side, having a radio-frequency region and a low-frequency region and/or a region which is supplied... | 02/09/2010 |
| 7656030 | Semiconductor device Heating elements different in heat generating timing are laminated in a stacked state, and the heating element close to a wiring substrate is allowed to function as a heat diffusion plate for another heating element. ... | 02/02/2010 |
| 7635918 | High frequency device module and manufacturing method thereof A high frequency device module of an embodiment of a current invention includes: an insulation substrate in which electrodes are provided on the front surface thereof and a grounding substrate is provided on the rear surface thereof; a high frequency device provided... | 12/22/2009 |
| 7633158 | Electronic component comprising a cooling surface An electronic component comprising at least two connection elements (2,7,8), each provided with at least one contact surface (13.1, 13.2, 13.3, 9, 10) which is used to fix the electronic component (1) to a surface of a printed circuit board. An ... | 12/15/2009 |
| 7615863 | Multi-dimensional wafer-level integrated antenna sensor micro packaging An integrated packaging assembly for an MMIC that uses the semiconductor wafers on which circuit elements are fabricated as the package. The packaging assembly includes a plurality of semiconductor layers that have been diced from the semiconductor wafers, where the... | 11/10/2009 |
| 7589419 | Side connectors for RFID chip An RFID chip can have an RFID circuit having first and second initial bond pads and conductive paths on the RFID chip connecting the first and second bond pads to the different sides of the chip. The conductive paths including a first side connector on a first side ... | 09/15/2009 |
| 7586192 | Routing configuration for high frequency signals in an integrated circuit package An apparatus for routing a high-speed signal is disclosed, having a signal router and a plurality of projections extending therefrom. The projections are separated from each other by a distance between about 0.25 and 0.125 of λgo, wherein λgo is a guide wavelength... | 09/08/2009 |
| 7586193 | Mm-wave antenna using conventional IC packaging An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad that is intended to be an antenna connection to be elongated compared ... | 09/08/2009 |
| 7569933 | Housing for accommodating microwave devices having an insulating cup member A housing for accommodating a microwave device having an insulating cup member. ... | 08/04/2009 |
| 7545036 | Semiconductor device that suppresses variations in high frequency characteristics of circuit elements A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first and second areas formed with a high-frequency circuit element, and a third area located around the first and second areas and formed with a low-freque... | 06/09/2009 |
| 7535100 | Wafer bonding of thinned electronic materials and circuits to high performance substrates A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the wafer from the back surface; bonding the back surface of the wafer to... | 05/19/2009 |
| 7479696 | Integrated BST microwave tunable devices fabricated on SOI substrate A tunable microwave device includes a SOI structure. A buffer layer is formed on the SOI structure. A microwave film layer is formed on the buffer layer. The microwave film layer comprises BST related materials. ... | 01/20/2009 |
| 7444041 | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity ... | 10/28/2008 |
| 7439621 | Radio frequency signal processing device The RF device of the present invention includes: a semiconductor substrate; and first and second semiconductor components provided on the substrate. Each of the components includes source electrodes, a gate electrode and a drain electrode. And multiple through holes... | 10/21/2008 |
| 7439622 | Semiconductor device The present invention provides a semiconductor device comprising a semiconductor substrate, and transistors formed on the semiconductor substrate, wherein control electrode terminals constituting external electrode terminals of the transistors, and first electrode t... | 10/21/2008 |
| 7411294 | Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer A display device includes a display panel, and the circuit substrate is separately formed and positioned different from the array substrate of the display panel and connected to the display panel. The circuit substrate includes an insulating substrate, a conductive ... | 08/12/2008 |
| 7405477 | Ball grid array package-to-board interconnect co-design apparatus A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between package and PCB enhances the signal propagation, minimizes parasitic ... | 07/29/2008 |
| 7400032 | Module assembly for stacked BGA packages Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrange... | 07/15/2008 |
