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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 8188597 | Fixture to constrain laminate and method of assembly A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at... | 05/29/2012 |
| 8154119 | Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via,... | 04/10/2012 |
| 8063485 | Electronics package with integrated lugs for cooling attachment A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dis... | 11/22/2011 |
| 7982308 | Light-emitting diode packaging structure and light-emitting diode module A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two me... | 07/19/2011 |
| 7932598 | Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink A semiconductor module has a housing (2) and a metal base plate (3). A reliable yet easily producible force-transmitting connection between a semiconductor module and an external heat sink is provided by a mechanical pressure-proof counterpart (4 | 04/26/2011 |
| 7893531 | Integrated-circuit package for proximity communication Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connecto... | 02/22/2011 |
| 7834451 | Film tray for fabricating flexible display A film tray for fabricating a flexible display, the film tray preventing a flexible substrate or film from sagging. The film tray includes a support plate and at least one pair of clamps, each clamp of the at least one pair of clamps located along an opposite edge o... | 11/16/2010 |
| 7683479 | Semiconductor package involving a rotary lock that connects a package substrate and a separate component A semiconductor chip 36 is mounted on a package substrate 30 with its circuit side facing to a board 38. Heat is dissipated from an upper side of the semiconductor chip 36 opposite to the circuit side. A sealing resin 32 seals arou... | 03/23/2010 |
| 7675167 | Electronic device package heat sink assembly An electronic package includes a flat base having a notch formed at opposite ends of the base. A clamping mechanism has a boss adapted to the notch for matingly connecting to the base, and includes an aperture for receiving a fastener for securing the package to a s... | 03/09/2010 |
| 7566967 | Semiconductor package structure for vertical mount and method In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with ... | 07/28/2009 |
| 7511375 | Semiconductor device carrier unit and semiconductor socket provided therewith In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted. ... | 03/31/2009 |
| 7443026 | IC chip package having force-adjustable member between stiffener and printed circuit board An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an undersid... | 10/28/2008 |
| 7443665 | Lock for notebook computer or other personal electronic device A notebook/laptop computer or other personal electronic device locking assembly includes a locking base frame. The locking base frame locks the notebook computer or other personal electronic device securely in place to a work surface such as a desk top or table top.... | 10/28/2008 |
| 7443681 | Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal t... | 10/28/2008 |
| 7436057 | Elastomer interposer with voids in a compressive loading system An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric ... | 10/14/2008 |
| 7436670 | Heat sink retaining device A heat sink retaining device for attaching a heat sink on a chip unit is provided, which includes a retaining component and a rotating component. The retaining component is locked to the heat sink in a state of pressing by a hook portion thereof, and the rotating co... | 10/14/2008 |
| 7433194 | Heat sink fastening assembly A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing p... | 10/07/2008 |
| 7427813 | Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the low-K Si die. In general, the molding interface material is selectiv... | 09/23/2008 |
| 7426112 | Heat dissipating module A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion ... | 09/16/2008 |
| 7414847 | Heat dissipation device A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module... | 08/19/2008 |
| 7409751 | Clip for heat sink A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting me... | 08/12/2008 |
| 7397120 | Semiconductor package structure for vertical mount and method In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with ... | 07/08/2008 |
| 7397666 | Wedge lock Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis. ... | 07/08/2008 |
| 7397663 | Clip for heat dissipation device A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the su... | 07/08/2008 |
| 7394658 | Heat sink with twist lock mounting mechanism A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securin... | 07/01/2008 |
| 7391615 | Clip for heat sink A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The... | 06/24/2008 |
| 7385822 | Clip assembly A clip assembly (30) for mounting a heat sink (20) on a printed circuit board (10) includes a closed annular positioning portion (32) interferingly engaging with the heat sink, a securing portion (34) secured to the positioning por... | 06/10/2008 |
| 7375963 | System and method for cooling a module Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of n... | 05/20/2008 |
| 7375422 | Stacked-type semiconductor package Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission path to a second semiconductor chip and are not formed on the first tap... | 05/20/2008 |
| 7372702 | Heat spreader According to some embodiments, an arrangement is provided for cooling a heat-generating device, including a memory module (e.g., a small outline dual inline memory module), in a system such as a laptop computer. The arrangement includes a heat spreader having a firs... | 05/13/2008 |
| 7372136 | Chip card retaining mechanism A chip card retaining mechanism for retaining a chip card mounted in an electronic device. The electronic device includes a housing (10). The housing has a battery compartment (12) defined therein. The chip card retaining mechanism includes a receiving... | 05/13/2008 |
| 7364435 | Electrical connector housing having stylized guide box An electrical connector includes an insulative housing (10) adapted to engage conductive terminals, and having an IC package mating surface (101) and an opposite substrate mounting surface (103). A rigid strip (12), in a substantially wav... | 04/29/2008 |
| 7362575 | Cooling method use diamond pins and heat pipes An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one con... | 04/22/2008 |
| 7360586 | Wrap around heat sink apparatus and method A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that partially surround the component and are used to mount the heat sink. In t... | 04/22/2008 |
| 7361880 | Digital camera module for detachably mounting with flex printed circuit board A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip pack... | 04/22/2008 |
| 7362573 | Heat dissipation device A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for contacting a heat generating device. A locking device includes a locki... | 04/22/2008 |
| 7358106 | Hermetic MEMS package and method of manufacture A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the pa... | 04/15/2008 |
| 7359201 | Heat-generating electronic part cover and cover mounting method A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body (20) of rectangular prism shape having a top wall (23), bottom wall (24), side walls, op... | 04/15/2008 |
| 7332802 | Package for semiconductor light emitting element and semiconductor light emitting device A package for semiconductor light emitting element is described. The package includes a first metal substrate having a cup shaped recess portion, an insulating member having a first cup shaped opening, provided on the first metal substrate, and a second metal substr... | 02/19/2008 |
| 7323358 | Method and system for sizing a load plate A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed... | 01/29/2008 |
