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| Number | Title | Issue Date |
| 8106507 | Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket Disclosed is a semiconductor package 3 including a socket 1 which is formed on the top surface 3a for enabling electrical conductivity and a connecting terminal 2 which is formed on the bottom surface 3b for enabling ... | 01/31/2012 |
| 7675166 | Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contac... | 03/09/2010 |
| 7663232 | Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion extending continuously through an aperture in two or more such elements. Computer systems include such sem... | 02/16/2010 |
| 7444041 | System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity ... | 10/28/2008 |
| 7429760 | Variable mask device for crystallizing silicon layer Disclosed are a variable mask device for crystallizing a silicon layer capable of controlling a width and a length of an opening, and a method for crystallizing a silicon using the variable mask device. The variable mask device has a frame with an opening whose widt... | 09/30/2008 |
| 7400038 | Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a secon... | 07/15/2008 |
| 7394658 | Heat sink with twist lock mounting mechanism A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securin... | 07/01/2008 |
| 7385296 | Sensor device having stopper for limitting displacement A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The stopper limits a displacement of the second chip when the adhesive member ... | 06/10/2008 |
| 7360586 | Wrap around heat sink apparatus and method A mounting plate that is secured between a substrate and a component is used to mount a heat sink. The plate includes holes to accommodate the leads of the component and mounting flanges that partially surround the component and are used to mount the heat sink. In t... | 04/22/2008 |
| 7350561 | Heat sink with combined fins A heat sink (10) for removing heat from heat-generating devices includes a plurality of fins (12) interconnected together by a fastener (20) extending therethrough. Each fin comprises a main body (14) and a flange (16) bent from an... | 04/01/2008 |
| 7349210 | Grease cover for heat dissipating apparatus A grease cover (50) for protecting grease spread on a bottom surface of a heat sink (20) includes a base wall (51), a plurality of sidewalls (52a, 52b, 52c, 52d), a protecting space (53 | 03/25/2008 |
| 7323363 | Contact load profile modification for a compression socketed CPU A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware conta... | 01/29/2008 |
| 7324352 | High capacity thin module system and method Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible c... | 01/29/2008 |
| 7294587 | Component built-in module and method for producing the same A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of t... | 11/13/2007 |
| 7288842 | Power semiconductor module with auxiliary connection Introduced is a power semiconductor module preferably a disk cell with a power semiconductor element arranged in the interior of the housing. In a preferred embodiment, the disk cell has two load and at least one auxiliary connection and the auxiliary connection ext... | 10/30/2007 |
| 7285975 | Termination providing apparatus mounted on memory module or socket and memory system using the apparatus Provided are an apparatus which provides termination with respect to signals transmitted through a bus line, and a memory system using the apparatus which can prevent the number of sockets from increasing and a continuity module from being used. The termination prov... | 10/23/2007 |
| 7282789 | Back-to-back semiconductor device assemblies A back-to-back semiconductor device assembly includes two vertically mountable semiconductor devices, the backs of which are secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the assembly. The semicond... | 10/16/2007 |
| 7277299 | Multi-device holding structure In a multi-device holding structure for integrally holding two heat generative elements which are transistors having through-holes so as to be mounted on a base plate, and a heat sensitive element which is a temperature fuse sandwiched between the heat sensitive ele... | 10/02/2007 |
| 7271473 | Semiconductor power transmission device A semiconductor power circuit in which multiple field effect transistor dies are solder connected between opposed contact surfaces of overlying flat conductors and are clamped by means of spring clips which are arranged in symmetrically opposed relationship. A circu... | 09/18/2007 |
| 7252537 | Electromagnetic coupler registration and mating A system includes a first bus coupler element, a second bus coupler element, and a visual element associated with the second bus coupler element and including a transparent media enabling the second coupler element to be visually aligned with the first coupler eleme... | 08/07/2007 |
| 7250084 | Downward mechanism for support pins A downward mechanism for support pins is applicable to a reactor of removable type. Support pins are located on the base of the reactor, and each support pin has a base thereunder. The downward mechanism has an elevator mechanism and a board fixed thereto. The board... | 07/31/2007 |
| 7244967 | Apparatus and method for attaching an integrating circuit sensor to a substrate A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface t... | 07/17/2007 |
| 7227261 | Vertical surface mount assembly and methods A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. At least... | 06/05/2007 |
| 7199050 | Pass through via technology for use during the manufacture of a semiconductor device A method for forming vias which pass through a semiconductor wafer substrate assembly such as a semiconductor die or wafer allows two different types of connections to be formed during a single formation process. One connection passes through the wafer without being... | 04/03/2007 |
| 7193852 | Control unit and method for producing the same The present invention relates to a control unit (1), for automotive applications in particular, with: a frame (8) that includes a recess (9) across which electrical conductive tracks (10) extend to supply electrical power; a base plate ( | 03/20/2007 |
| 7185423 | Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation A method of improving shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays and that includes a substrate and a package lid, includes providing a support frame attached at an attachment point to the substrate or the packa... | 03/06/2007 |
| 7178587 | Heat-dissipating module A heat-dissipating module comprises a conductive part, a fan and a flow-guiding shield. The conductive part has a receiving plane being connected to the fan and fits with the flow-guiding shield. The fan has a fan wheel with a circular area measured with the diamete... | 02/20/2007 |
| 7173340 | Daisy chaining of serial I/O interface on stacking devices A bottom die and a top die stacked on the bottom die are configured to provide a daisy chain function. Both die include an input/output function control bonding pad (20G), a first bonding pad (20C) controllable to function as either an input or an outp... | 02/06/2007 |
| 7170169 | LGA socket with EMI protection A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies in... | 01/30/2007 |
| 7170165 | Circuit board assembly with a brace surrounding a ball-grid array device An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is... | 01/30/2007 |
| 7169234 | Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder A substrate support assembly positively secures a substrate holder support to a rotation shaft with respect to rotationally applied forces. A substrate holder support is configured to have an opening in a socket into which, when aligned with an indentation in the ro... | 01/30/2007 |
| 7166915 | Multi-chip module system Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed with appropriate electrical connections. A variety of different dice m... | 01/23/2007 |
| 7156157 | Cooling mechanism A cooling mechanism according to the present invention comprises a heat conductive unit having a plurality of heat radiating fins extended outward in the radial direction thereof and a fan. The heat radiating fins and the air gaps among the heat radiating fins defin... | 01/02/2007 |
| 7138708 | Electronic system for fixing power and signal semiconductor chips An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes. ... | 11/21/2006 |
| 7127794 | Auto-boating process According to one embodiment of the invention, a method for auto-boating includes supporting a tape substrate having first and second end portions on a boat, sandwiching the first and second end portions between respective ones of a pair of end sleeves and the boat, ... | 10/31/2006 |
| 7115981 | Semiconductor device assemblies including interposers with dams protruding therefrom A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the interposer or other substrate. The interposer may be positioned at le... | 10/03/2006 |
| 7107674 | Method for manufacturing a chip carrier A method of manufacturing an integrated circuit carrier includes providing a substrate. At least one receiving zone for an integrated circuit is demarcated on the substrate. A plurality of island-defining portions is arranged about each of the receiving zones. Rigid... | 09/19/2006 |
| 7105858 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during... | 09/12/2006 |
| 7095113 | Semiconductor device with interlocking clip A semiconductor device is provided having a single-piece clip that interlocks into a lead frame using one or more forks on the clip that mate with one or more corresponding slots in the lead frame. A semiconductor die is mounted to a pad of the lead frame and the cl... | 08/22/2006 |
| 7088074 | System level device for battery and integrated circuit integration A system level device for battery and integrated circuit chip integration comprises at least one battery; at least one integrated circuit chip powered by the at least one battery; and a package connected to any of the at least one battery and the at least one integr... | 08/08/2006 |
