Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 8174116 | Spacer, and its manufacturing method Provided are a spacer capable of avoiding a poor connection due to the suction of solder when the clearance width between a soldered semiconductor device and a printed circuit board is made constant, and a manufacturing method for the spacer. The spacer includes an ... | 05/08/2012 |
| 8154118 | Semiconductor device A semiconductor device (10) includes: an base substance (15) having a ferromagnetic material; a first semiconductor chip (11) and a second semiconductor chip (12) installed on the base substance (15); a first coil (131) inst... | 04/10/2012 |
| 8148816 | Semiconductor device A semiconductor device in which a plurality of semiconductor chips is stacked. A first semiconductor chip is stacked in a region, on a second semiconductor chip, in which a circuit that generates noise is not disposed within said second semiconductor chip, and a wir... | 04/03/2012 |
| 8148815 | Stacked field effect transistor configurations An improved organization for a MOSFET pair mounts first and second FET dies in an overlying or stacked relationship to reduce the surface area ‘footprint’ of the MOSFET pair. The source and drain of a high side FEThigh and a low side FETlow | 04/03/2012 |
| 8148817 | Multi-die DC-DC buck power converter with efficient packaging A DC-DC buck converter in multi-die package is proposed having an output inductor, a low-side Schottky diode and a high-side vertical MOSFET controlled by a power regulating controller (PRC). The multi-die package includes a first die pad with the Schottky diode pla... | 04/03/2012 |
| 8138600 | Semiconductor device and method of manufacturing the same A semiconductor device is provided, which is capable of improving mounting flexibility relatively and increasing general versatility, as well as realizing heat radiation characteristics and low on-resistance. Moreover, the semiconductor device is provided, which is ... | 03/20/2012 |
| 8125080 | Semiconductor power module packages with simplified structure and methods of fabricating the same Provided are semiconductor power module packages, which are structurally simplified by bonding electrodes onto substrates, and methods of fabricating the same. An exemplary package includes a substrate and semiconductor chips disposed on a top surface of the substra... | 02/28/2012 |
| 8115304 | Method of implementing a discrete element in an integrated circuit A method of implementing a discrete component in an integrated circuit package is described. The method includes steps of coupling the discrete component to a surface of a substrate of the integrated circuit package, coupling an integrated circuit die to the surface... | 02/14/2012 |
| 8110921 | Semiconductor package and method of manufacturing the same A plurality of semiconductor devices having different thicknesses from each other and having respective electrode terminals are fixed on a surface of the support plate through a resin layer in such a manner that terminal surfaces of the electrode terminals are on th... | 02/07/2012 |
| 8110920 | In-package microelectronic apparatus, and methods of using same A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate.... | 02/07/2012 |
| 8106506 | Electronic component An electronic component has an element body, and a plurality of external electrodes formed on one principal face of the element body. Each external electrode has a first electrode layer joined to the one principal face of the element body, and a second electrode lay... | 01/31/2012 |
| 8089147 | IMS formed as can for semiconductor housing An insulated metal substrate composite has a patterned conductive layer on one surface and receives one or more electrodes of MOSFETs or other die on the patterned segments which lead to the edge of the IMS. The outer periphery of the IMS is cupped or bent to form a... | 01/03/2012 |
| 8067835 | Method and apparatus for manufacturing semiconductor module Disclosed herewith is a semiconductor module manufacturing apparatus capable of reducing occurrence of warping of the wiring substrate, etc., as well as occurrence of failures of bonding between the wiring substrate and semiconductor chips, etc. without lowering the... | 11/29/2011 |
| 8044508 | Method and apparatus for integrated-circuit battery devices A combined battery and device apparatus and associated method. This apparatus includes a first conductive layer, a battery comprising a cathode layer; an anode layer, and an electrolyte layer located between and electrically isolating the anode layer from the cathod... | 10/25/2011 |
| 8035224 | Semiconductor device A semiconductor package includes a semiconductor chip having an integrated circuit, a functional element electrically coupled with the integrated circuit, and an array of contact elements connected with the integrated circuit and the functional element. The function... | 10/11/2011 |
| 8018054 | Semiconductor die package including multiple semiconductor dice A semiconductor die package. The semiconductor die package includes a leadframe structure comprising a first die attach pad, and a second die attach pad laterally spaced from the first die attach pad, a first side and a second side opposite to the first side. The se... | 09/13/2011 |
| 8018055 | Semiconductor apparatus with decoupling capacitor A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power... | 09/13/2011 |
| 7989950 | Integrated circuit packaging system having a cavity An integrated circuit packaging system includes: attaching a carrier, having a carrier top side and a carrier bottom side, and an interconnect without an active device attached to the carrier bottom side; and forming a first encapsulation, having a cavity, around th... | 08/02/2011 |
| 7973405 | Integrated circuit for driving semiconductor device and power converter An integrated circuit for driving a semiconductor device, which is adaptable for demands, such as a higher output (larger current), a higher voltage, and a smaller loss, and has a small size, is produced at a low cost, and has high reliability. A power converter inc... | 07/05/2011 |
| 7956459 | Semiconductor device and method of assembly An encapsulated leadless semiconductor package comprises a first semiconductor die and a second semiconductor die which are electrically connected by a bond wire. The lower surface of the first semiconductor die and the lower surface of the second semiconductor die ... | 06/07/2011 |
| 7952195 | Stacked packages with bridging traces A microelectronic assembly that includes a first microelectronic element having a first rear surface. The assembly further includes a second microelectronic element having a second rear surface. The second microelectronic element is attached to the first microelectr... | 05/31/2011 |
| 7948078 | Semiconductor device A semiconductor device has a package structure provided with leads that are external connection terminals. A base substance is an island, and at least the surface thereof is formed of a conductive material. A semiconductor substrate is mounted on the surface of the ... | 05/24/2011 |
| 7906846 | Semiconductor device for implementing signal transmission and/or power supply by means of the induction of a coil A plurality of LSI chips (1) are stacked on an interposer (2). Signal coils (1b) for signal transmission are formed on the circuit formation surfaces of LSI chips (1) that are formed using silicon substrates (1a). The... | 03/15/2011 |
| 7902664 | Semiconductor package having passive component and semiconductor memory module including the same Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and ... | 03/08/2011 |
| 7888796 | Controller chip mounted on a memory chip with re-wiring lines A semiconductor device with semiconductor chips stacked thereon is provided. The semiconductor device is reduced in size and thickness. In a first memory chip and a second memory chip, first pads of the first memory chip located at a lower stage and hidden by the se... | 02/15/2011 |
| 7884470 | Semiconductor packages with stiffening support for power delivery Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an electrical conductor. To this purpose, the package stiffener and the ... | 02/08/2011 |
| 7875975 | Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag An electronic circuit having at least one electronic component comprised of an organic material, and arranged between at least two layers forming a barrier, wherein the layers protect the at least one component against an influence of light, air or liquid. ... | 01/25/2011 |
| 7863736 | Semiconductor device and signal terminating method thereof A semiconductor device may include a semiconductor chip including a signal terminating resistor coupled between a signal input pad and a first ground voltage pad, a semiconductor package including a signal input terminal and a first ground voltage terminal, the sign... | 01/04/2011 |
| 7851908 | Semiconductor device A semiconductor device is disclosed. One embodiment provides a module including a first carrier having a first mounting surface and a second mounting surface, a first semiconductor chip mounted onto the first mounting surface of the first carrier and having a first ... | 12/14/2010 |
| 7843060 | Droop-free high output light emitting devices and methods of fabricating and operating same Light emitting devices include a semiconductor light emitting diode that is configured to operate at a substantially droop-free quantum efficiency while producing warm white light output of at least about 100 lumens/cool white light output of at least about 130 lume... | 11/30/2010 |
| 7834450 | Semiconductor package having memory devices stacked on logic device A semiconductor package includes a base substrate, a logic device with a serializer/deserializer (SerDes), a plurality of odd memory devices disposed on a lower surface of the logic device and operatively stack-connected with the SerDes, and a plurality of even memo... | 11/16/2010 |
| 7830003 | Mechanical isolation for MEMS devices A device according to the present invention includes a MEMS device supported on a first side of a die. A first side of an isolator is attached to the first side of the die. A package is attached to the first side of the isolator, with at least one electrically condu... | 11/09/2010 |
| 7825508 | Multi-die DC-DC buck power converter with efficient packaging A DC-DC buck converter in multi-die package is proposed having an output inductor, a low-side Schottky diode and a high-side vertical MOSFET controlled by a power regulating controller (PRC). The multi-die package includes a first die pad with the Schottky diode pla... | 11/02/2010 |
| 7825509 | Transducer package with transducer die unsupported by a substrate A surface mountable transducer package is provided, the design of which allows a thin package profile to be achieved. An encapsulation layer bonds to a surface of each of the terminal pads and encapsulates a portion of the transducer and at least a portion of the si... | 11/02/2010 |
| 7821128 | Power semiconductor device having lines within a housing A power semiconductor device has a semiconductor chip stack and lines within a housing. The lines electrically connect large-area contact regions of power semiconductor device components within the housing to one another. In this case, at least one of the lines has ... | 10/26/2010 |
| 7808102 | Multi-die DC-DC boost power converter with efficient packaging A DC-DC boost converter in multi-die package is proposed having an output Schottky diode and a low-side vertical MOSFET controlled by a power regulating controller (PRC). The multi-die package includes a single die pad with the Schottky diode placed there on side by... | 10/05/2010 |
| 7808103 | Leadless package Provided is a semiconductor package, and in particular a semiconductor package which is capable of electrically connecting to the outside without a lead. The leadless package includes a plurality of lower conducting layer patterns disposed separately from one anothe... | 10/05/2010 |
| 7804171 | Techniques for packaging a multiple device component A technique for packaging multiple devices to form a multi-chip module. Specifically, a multi-chip package is coupled to an interposer to form the multi-chip module. The multi-chip package includes a plurality of integrated circuit chips coupled to a carrier. The ch... | 09/28/2010 |
| 7800224 | Power device package A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first ... | 09/21/2010 |
| 7800223 | Chip-scale monolithic load switch for portable applications A chip-scale package houses a monolithic semiconductor die containing first and second lateral metal oxide semiconductor field effect transistors (MOSFETs) formed on a surface of the semiconductor die. The MOSFETs are formed using a lateral double diffused metal oxi... | 09/21/2010 |
