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An armor with rollers is provided that enables a user to move in all positions by rolling on a hard and smooth surface while constantly varying his bearing points on the ground.
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| Number | Title | Issue Date |
| 6498395 | Heat sink with cooling fins for semiconductor package An apparatus for cooling a semiconductor package and preventing heat concentration at the central part of a heat sink includes a heat sink for cooling mounted on a semiconductor package and a fan installed over the heat sink. The heat sink includes a base... | 12/24/2002 |
| 6495913 | Semiconductor clamped-stack assembly A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extendi... | 12/17/2002 |
| 6496404 | Memory system for use on a circuit board in which the number of loads is minimized A memory system is disclosed. The memory system comprises a circuit board and at least two memory devices mounted on the circuit board. Each of the at least two memory devices includes a plurality of pins for receiving and providing signals. At least a fi... | 12/17/2002 |
| 6482520 | Thermal management system The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a t... | 11/19/2002 |
| 6483169 | Extruded heat spreader An extruded heat exchanger that reduces manufacturing costs and material waste, without compromising heat spreading effects. The heat exchanger has an upper surface that is thermally coupled to a heat sink. Two sidewalls extend only from opposite edges of... | 11/19/2002 |
| 6480383 | Electronic component cooling apparatus An electronic component cooling apparatus capable of firmly mounting a fan unit mounting frame on a heat sink without increasing mechanical strength of the fan unit mounting frame. The fan unit mounting frame includes a pair of mounting legs provided ther... | 11/12/2002 |
| 6476484 | Heat sink dissipator for adapting to thickness change of a combination of a CPU and a CPU carrier A heat sink dissipater includes a retaining device and a heat dissipater. A plurality of fins and a plurality of pads or recesses are integrally formed on the top surface of the heat dissipater. A plurality of resilient legs extend inward from the sides o... | 11/05/2002 |
| 6473306 | Heat sink assembly retainer for electronic integrated circuit package A retainer device (1) for fastening a heat sink (2) to a printed circuit board module (3). The heat sink comprises a base plate (22) and a plurality of upwardly extending fins (24). The retainer device comprises an operation lever (14), a fastening frame ... | 10/29/2002 |
| 6469898 | Heat dissipating device A heat dissipating device for cooling an electrical component is disclosed that includes a heat sink base. A plurality of helicoid pins is fixed to the heat sink base and extends therefrom. In one preferred embodiment, the helicoid pins have a diameter of... | 10/22/2002 |
| 6466444 | Heat sink A heat sink including a first and a second group of heat dissipating members integrally formed and extending upwardly from a base portion. The first group of heat dissipation members includes a plurality of fin-shaped members each having main heat dissipa... | 10/15/2002 |
| 6466441 | Cooling device of electronic part having high and low heat generating elements The cooling device of an electronic part including a substrate and first and second electronic elements. The first element (processor) is higher than the second element, and the first element generates more heat than the second element. A cooling device i... | 10/15/2002 |
| 6462948 | Thermal management system for a multiple processor computer appliance A system and method for cooling multiple microprocessors located on a circuit board containing disk drives, memory and other components. This cooling system and method utilizes a blower connected to an air duct. The air duct is divided into several channe... | 10/08/2002 |
| 6460609 | Heat sink for facilitating air flow A heat sink (20) includes a chassis (23), and a plurality of fins (25) extending upwardly from the chassis. The chassis includes a platform (27) and a guide portion (29) extending horizontally from. an end portion of the platform. The guide portion has to... | 10/08/2002 |
| 6459580 | Cooling system for removing heat from an object A cooling system for providing rapid and uniform cooling of a variety of objects. The cooling system utilizes a fan that cooperates with a heat sink to provide an active heat sink. Additionally, the arrangement of the heat sink and the fan provide a relat... | 10/01/2002 |
| 6459577 | Thermal chimney for a computer A heat removal system for a computer comprising a casing enclosing a hard drive and a microprocessor, the casing including an opening in an exterior surface thereof; a heat sink positioned between the hard drive and the microprocessor, the heat sink being... | 10/01/2002 |
| 6453987 | Unitary heat-dissipating fin strip unit with straight strip portions and U-shaped strip portions A unitary heat-dissipating fin strip unit includes a series of straight strip portions, each adjacent pair of which define a heat-dissipating space therebetween, and a plurality of bridging units disposed respectively within the heat-dissipating spaces. E... | 09/24/2002 |
| 6449161 | Heat sink for chip stacking applications A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outsi... | 09/10/2002 |
| 6449160 | Radiation fin assembly for heat sink or the like A radiation fin assembly formed of a number of radiation fins connected in parallel, each radiation fin having a plurality of flat peripheral connecting strips, each flat connecting strip having a hook hole and an arrowhead-like hook portion; the arrowhea... | 09/10/2002 |
| 6449157 | IC package assembly with retention mechanism A retention mechanism (6, 6') for an LGA package assembly (1, 1') consists of a spring clip (60, 60') and a lever (62, 62') both attached to a heat sink (5, 5'). The spring clip has a biasing strip (612, 612') and a pair of opposite engaging legs (610, 61... | 09/10/2002 |
| 6449156 | Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling m... | 09/10/2002 |
| 6449151 | Heat sink assembly having fastening means for attaching fan to heat sink A heat sink assembly includes a heat sink (10), a frame (30), a fan (50), and a fastener (70). The heat sink has a pair of diagonally opposite vertical poles (20). An annular step (201) is formed on each pole at a position higher than a top extremity of f... | 09/10/2002 |
| 6446707 | Active heat sink structure with directed air flow An active heat sink structure includes at least one heat sink. Each heat sink includes a heat sink base having a top surface with a top surface periphery and a top surface center, and an oppositely disposed bottom surface. The heat sink may be described i... | 09/10/2002 |
| 6439299 | Heatsink apparatus A heatsink apparatus has a construction which produces a high heat-radiating effect even if the apparatus is designed to be compact or to have a small thickness. The heatsink apparatus includes a base plate to which a heat-generating body may be connected... | 08/27/2002 |
| 6434005 | Power converter packaging A power converter includes a housing, heat generating circuitry in the housing, and a heat conducting metal sheath on the outside of the housing. The housing has an elongated-box shape including two relatively smaller ends and four relatively larger sides... | 08/13/2002 |
| 6424532 | Heat sink and memory module with heat sink A memory module 10 is fitted with a "cover and heat sink" 5 having a U-shape in cross section in such a manner that the memory module 10 is inserted into a U-shaped deep recess of the "cover and heat sink" 5, and all packaged memory ICs 3 and the other co... | 07/23/2002 |
| 6424530 | Clip for heat sink A clip (10) securing a heat sink (20) to a heat-generating device (40) for removing heat therefrom comprises a body (12) and a pair of arms (14, 16) extending from the body. The body is positioned in a groove of the heat sink, for pressing the heat sink a... | 07/23/2002 |
| 6423570 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s). A portion of the encapsulation material is removed to expose a back s... | 07/23/2002 |
| 6422307 | Ultra high fin density heat sink for electronics cooling The present invention is directed to liquid-cooled or air-cooled metallic heat sinks formed as unibody structures that include a planar base and upright fins. The fins are located on one side of the heat sink and the ratio of fin spacing to fin height is ... | 07/23/2002 |
| 6419007 | Heat sink-equipped cooling apparatus A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arra... | 07/16/2002 |
| 6415852 | Heat sink assembly A heat sink assembly (1) includes a heat sink (10), and a fan (20) attached to the heat sink. The fan is box-shaped, and defines two recesses (24) in each of two opposite side walls (22) thereof. The heat sink includes a base (12) and a plurality of paral... | 07/09/2002 |
| 6418020 | Heat dissipation device with ribbed fin plates A heat dissipation device includes a thermally conductive base plate and a plurality of thermally conductive fin plates that are in thermal communication with the base plate. Each adjacent pair of the fin plates defines a channel therebetween, through whi... | 07/09/2002 |
| 6412546 | Heat dissipation device for integrated circuits A heat dissipation device includes a heat sink (80) and an assembling device for securing the heat sink to a, chip (90) mounted on a printed circuit board (100). The heat sink has a pair of ears (82) each defining an aperture (84) therein. The assembling ... | 07/02/2002 |
| 6411513 | Compliant thermal interface devices and method of making the devices A compliant, thermally conductive interface device for use between two surfaces, such as a component and a heat sink surface, that can accommodate a range of gap distances and angular misalignment (tilt). The device is comprised of a plurality of foils (2... | 06/25/2002 |
| 6411511 | Motherboard heat sink passage and support board An industrial computer motherboard heat sink passage and support board having one insertion piece and an opening recessed frame facing the heat sink to accommodate the heat sink on the motherboard with both wings of said recessed frame merely contacting t... | 06/25/2002 |
| 6411510 | Heat sink-equipped cooling apparatus A heat sink-equipped cooling apparatus capable of exhibiting increased cooling performance and durability and being reduced in dimensions in a radial direction thereof. A heat sink includes a radiation fin unit including a plurality of radiation fins arra... | 06/25/2002 |
| 6408934 | Cooling module A cooling module is disclosed which comprises a plate, a flat heat pipe, a directional motor, and a fin structure, wherein at least a part of the heat pipe is embedded into the plate while being flush with plate, and the heat pipe is disposed close to a h... | 06/25/2002 |
| 6407920 | Heat-dissipating assembly and process for assembling the same A heat-dissipating assembly for removing a portion of heat from a heat-generating device includes a fan and a heat sink. The fan has holes. The heat sink has a base in contact with a surface of the heat-generating device, and first fins and second fins ex... | 06/18/2002 |
| 6407917 | Fluid flow management system A fluid flow management system for enhancing cooling of a circuit pack. The system includes a bar extending transverse to the direction of fluid flow. The bar breaks up the otherwise laminar flow into a turbulent flow.... | 06/18/2002 |
| 6404634 | Single piece heat sink for computer chip A heat sink device for transferring heat from a computer chip is comprised of a base, a core and an array of fins that are in the form of a single, unitary piece. In a particularly preferred embodiment of this invention, the array of fins is comprised of ... | 06/11/2002 |
| 6404632 | Mechanical configuration for retaining inboard mounting hardware on finned heat dissipating devices A method and apparatus to retain mounting hardware on a heat-sink or heat-pipe. One embodiment of the invention involves a method to assemble a component having a heat dissipation device with a plurality of heat dissipation fins on a substrate. A second e... | 06/11/2002 |
