Class 257/722 - With fins

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the cooling means has fins, i.e.,
No. of patents: 806
Last issue date: 08/10/2010

Number	Title	Issue Date
3952797	Semi conductor cooling system A semi-conductor cooling system formed of a container having a wall portion made of soft yieldable material which is adapted to contact the surface of a semi-conductor device. A porous member is disposed within the container adjacent the inner surface of ...	04/27/1976
3947868	Air-cooled converter assembly, having heat sinks shaped as isosceles triangles An air cooled converter assembly employing disc thyristors in which the disc thyristors are clamped between conducting heat sinks, arranged in pairs side-by-side transversely to their common axis, with the disc thyristor thereby clamped essentially parall...	03/30/1976
3942586	Cooling arrangement for flat semiconductor components An improved cooling arrangement for flat semiconductor components such as disc-type thyristors in which the semiconductor component is clamped between two solid cooling elements with each cooling element carrying at least one heat pipe with attached cooli...	03/09/1976
3940786	Device for connecting leadless integrated circuit package to a printed circuit board This invention relates to a device which electrically connects a leadless integrated circuit package to a printed circuit board. More particularly, the device includes a square frame having a plurality of contacts arranged along each side of the housing. ...	02/24/1976

PatentStorm