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| Number | Title | Issue Date |
| 7288839 | Apparatus and methods for cooling semiconductor integrated circuit package structures Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power densit... | 10/30/2007 |
| 7286361 | Heatsink Disclosed is a heatsink wherein a first bonding part for mounting the semiconductor component on a substrate and a second bonding part for mounting the heatsink on the substrate are soldered to the substrate by a common solder contact, so that the mounting the semic... | 10/23/2007 |
| 7285866 | Surface mounted package with die bottom spaced from support board A semiconductor package according to the present invention includes a metal can which receives in its interior space a MOSFET. The MOSFET so received is oriented such that its drain electrode is facing the bottom of the can and is electrically connected to the same ... | 10/23/2007 |
| 7283365 | Jet impingement cooling apparatus and method A nozzle useful for enhancing localized cooling of electronic elements and the like is provided. The nozzle is mountable on a substantially planar face of a substrate. It is conformed to intercept a fluid flowing across said face and redirect it toward the substrate... | 10/16/2007 |
| 7279916 | Apparatus and test device for the application and measurement of prescribed, predicted and controlled contact pressure on wires The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems. An apparatus for taking advan... | 10/09/2007 |
| 7277291 | Thermal transfer device A thermal conducting device removes heat from a power dissipating device installed within a case, and includes a base coupled to the power dissipating device and a translational portion that is movable in a vertical dimension. The translational portion couples at an... | 10/02/2007 |
| 7271034 | Semiconductor device with a high thermal dissipation efficiency Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting str... | 09/18/2007 |
| 7268427 | Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board A holding fixture that holds a component and mounts the component on an electronic circuit board includes a holding member that holds the component at a side of a first surface of the electronic circuit board, a first fixing member that includes a first base that is... | 09/11/2007 |
| 7269013 | Heat dissipation device having phase-changeable medium therein A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a pe... | 09/11/2007 |
| 7259448 | Die-up ball grid array package with a heat spreader and method for making the same An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is received. A heat spreader has a first surface and a second... | 08/21/2007 |
| 7256491 | Thermal interconnect systems methods of production and uses thereof A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder mate... | 08/14/2007 |
| 7252167 | Electrical apparatus, cooling system therefor, and electric vehicle An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial struct... | 08/07/2007 |
| 7251136 | Heat dissipation device having a ventilating duct A heat dissipation device includes a heat sink (20) having a plurality of fins (26), a fan duct (50), a fan (70) and a mounting bracket (60) for mounting the fan duct and the fan to the heat sink. The fan duct is mounted to a front... | 07/31/2007 |
| 7251134 | Extended fin array An extended fin array has a main heat-dissipation module and an extended heat-dissipation module. The main heat-dissipation module and the extended heat-dissipation module are stacked to increase the effective convective area to increase the heat-dissipation effect.... | 07/31/2007 |
| 7245492 | Heat-dissipating module and structure thereof A heat-dissipating structure. The heat-dissipating structure comprises a plurality of first and second conductive plates. Each first conductive plate has a first base surface, a first reference surface and a first main disturbing portion disposed on the first base s... | 07/17/2007 |
| 7237599 | Cooler with blower comprising heat-exchanging elements A cooler for electronic components comprises a heatsink, a blower, and an electric drive with a rotor and a stator. The heatsink comprises heat-exchanging means, inflow and outflow openings, and a base providing thermal contact with said electronic components and sa... | 07/03/2007 |
| 7236368 | Integral molded heat sinks on DC-DC converters and power supplies A power supply module has a printed circuit board (PCB) containing a plurality of electrical components for converting an input voltage to an output voltage. A heat sink is formed over substantially an entire surface area of the PCB for providing heat dissipation. T... | 06/26/2007 |
| 7235889 | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages The present invention is directed toward systems, packages, and methods for providing improved thermal performance in such packages and systems. Embodiments of the invention include a semiconductor integrated circuit (IC) package having a substrate with a heat sprea... | 06/26/2007 |
| 7233065 | Semiconductor device having capacitors for reducing power source noise A semiconductor device comprises a BGA substrate having one principal plane furnished with a large number of solder balls, the solder balls constituting a ball grid array; a semiconductor chip mounted on another principal plane of the BGA substrate, the semiconducto... | 06/19/2007 |
| 7228889 | Heat dissipation device A heat dissipation device includes a seat, a fin set arranged on the seat, a fan, a fan mounting device having the fan mounted thereto, and a cover covering the fin set. The fan has a portion thereof located above the fin set. An opening is defined in fan mounting d... | 06/12/2007 |
| 7230287 | Chevron CMOS trigate structure Disclosed herein is a structure with two different type tri-gate MOSFETs formed on the same substrate. Each MOSFET comprises a fin with optimal mobility for the particular type of MOSFET. Due to the processes used to form fins with different crystalline orientations... | 06/12/2007 |
| 7227752 | Heat dissipation device A heat dissipation device includes a base, at least one heat pipe having an evaporating section and a condensing section, at least one reinforcing member without phase-change therein, and a plurality of fins. The evaporating section of the heat pipe contacts the bas... | 06/05/2007 |
| 7227257 | Cooling micro-channels The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same. ... | 06/05/2007 |
| 7224057 | Thermal enhance package with universal heat spreader A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat sprea... | 05/29/2007 |
| 7221566 | System for cooling a processor while reducing air flow noise A system is described for cooling a processor. In one embodiment, a heat sink assembly has a fan and air channels. In addition, a heat sink lid that is configured to cover only a region above the fan is coupled to the heat sink assembly. ... | 05/22/2007 |
| 7221567 | Heat sink fan A heat sink fan of the present invention includes a heat sink and an axial flow fan, and the axial flow fan includes a motor, an impeller and a housing. An outer wall surface of a cylindrical portion of the housing is formed with an arm which engages with the heat s... | 05/22/2007 |
| 7218522 | Heat dissipating device A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins... | 05/15/2007 |
| 7213636 | Cooling assembly with impingement cooled heat sink The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of... | 05/08/2007 |
| 7211891 | Electronic heat pump device, laser component, optical pickup and electronic equipment There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically a... | 05/01/2007 |
| 7203064 | Heat exchanger with cooling channels having varying geometry A device may include an integrated circuit chip and channels to carry a coolant. The channels may be proximate to an upper surface of the integrated circuit chip, and the channels may extend along a length of the integrated circuit chip. A density of the channels ma... | 04/10/2007 |
| 7198094 | Finned device for removing heat from an electronic component A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriente... | 04/03/2007 |
| 7196413 | Heat dissipation assembly and method for producing the same A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive gre... | 03/27/2007 |
| 7196904 | IC package with an implanted heat-dissipation fin An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic package, and another end is left outsides for directly heat-exchangi... | 03/27/2007 |
| 7183496 | Soldered heat sink anchor and method of use An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hol... | 02/27/2007 |
| 7183133 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Microelectronic devices with improved heat dissipation, methods of making microelectronic devices, and methods of cooling microelectronic devices are disclosed herein. In one embodiment, the microelectronic device includes a microelectronic substrate having a first ... | 02/27/2007 |
| 7180740 | Method and apparatus for side-type heat dissipation The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite... | 02/20/2007 |
| 7172017 | Heat sink This specification discloses a heat sink for coolers. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat con... | 02/06/2007 |
| 7164582 | Cooling system with submerged fan A cooling system for dissipating heat from a component is disclosed. The cooling system includes a cooling device that includes a core and a plurality of spaced apart fins connected with the core with each fin including at least two vanes. A trailing edge of the fin... | 01/16/2007 |
| 7161804 | Housing structure of electronic device and heat radiation method therefor A sealed housing is provided with a body, a cover, and a movable fin for radiating heat while suppressing a change in internal pressure, and preventing invasion of water vapor or poisonous gas from the exterior to thereby avoid an accident caused by dew condensation... | 01/09/2007 |
| 7154751 | Interface module-mounted LSI package An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is i... | 12/26/2006 |
