Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
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| Number | Title | Issue Date |
| 6307262 | Condensed memory matrix A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curab... | 10/23/2001 |
| 6304445 | Fan heat sink and method A heat sink structure includes a fan, a heat sink and a fan mounting bracket. The heat sink includes a base section having a lower surface and an upper surface. A first fin and a second fin extend from the upper surface of the base section. The fan mounti... | 10/16/2001 |
| 6301115 | Heat sink devices for use in electronic devices A heat sink device for use in desktop electronic devices comprises a heat sink which can be firmly attached to a CPU assembly with extremely great strength. The holes to be formed in the CPU circuit board of the CPU assembly or the heat sink can be made a... | 10/09/2001 |
| 6296048 | Heat sink assembly A heat sink assembly for an electronics assembly, such as an RF power amplifier, includes a pallet, a fin structure, and a hollow base separate from the fin structure. The fin structure may be an integral curved sheet or a modular apparatus comprising a p... | 10/02/2001 |
| 6293331 | Vibration and shock resistant heat sink assembly A vibration and shock resistant heat dissipating device for removing heat from a heat generating object is disclosed. The heat dissipating device includes a retaining clip having a central member and a pair of legs depending downwardly therefrom. An apert... | 09/25/2001 |
| 6288899 | Method and apparatus for heat dissipation in a multi-processor module This invention provides a heat sink for dissipating heat from an electronic component to be cooled by air flow. The heat sink includes a base configured to be mounted to the electronic component to receive heat transferred from the electronic component. T... | 09/11/2001 |
| 6283201 | Heat-radiating structure A heat-radiating structure includes a closed container connected to an end of a thermal pipe that is connected at another end to a heat source. The closed container is made of a heat-conductive material and filled with heat-absorptive ethanol. Outer wall ... | 09/04/2001 |
| 6282092 | Electronic circuit device and method of fabricating the same An electronic circuit device having an improved heat dissipating effect, a small size and a high reliability is provided with a metal substrate having a first surface and a second surface and a case. Electronic parts are mounted on only the first surface ... | 08/28/2001 |
| 6281573 | Thermal enhancement approach using solder compositions in the liquid state Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder compositio... | 08/28/2001 |
| 6278609 | Electronic device having IC card slot An electronic device having an IC card slot into which an IC card is removably inserted. The IC card slot has a slot side connector to which a card side connector of the IC card is electrically connected and a socket formed in an approximately U-shaped. T... | 08/21/2001 |
| 6276448 | Heat-transfer connector A heat-transfer connector 1 comprises a heat-collection side connector half 10, a heat-radiation side connector half 20 and comb-like contacts 25. The heat-collection side connector half 10, which is made of a metal, includes a concave receptive part 10a ... | 08/21/2001 |
| 6273181 | Cooling device for electronic parts of vehicle A case which accommodates electronic control circuit is housed in a housing box. An air passage is formed between the case and a main body of the housing box to introduce cooling air for cooling an electronic control circuit in the case. A heat sink is at... | 08/14/2001 |
| 6273186 | Low-cost, high density, staggered pin fin array A high-density, staggered pin fin array, and a method for manufacturing the pin fin array, are disclosed. The pin fin array includes a plurality of fin members, each having a plurality of elongated, pin-shaped fins arranged in a row; and, at least one con... | 08/14/2001 |
| 6269864 | Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors A heat sink for a microprocessor includes a thermally conductive base having a plurality of fin structures upwardly extending from the thermally conductive base. The plurality of fin structures having a first surface comprising a plurality of surface area... | 08/07/2001 |
| 6269863 | Integrated processor mounting mechanism and heat sink An integrated heat sink/retention mechanism and a method for mounting a processor assembly on a circuit board using such an integrated heat sink/retention mechanism. The method involves attaching an integrated heat sink/retention mechanism onto the circui... | 08/07/2001 |
| 6269003 | Heat dissipater structure An improved structure heat dissipater for computer central processing units (CPU) having heat sink grid elements perforated with through-holes. The structure of the present invention is comprised of a ventilated hood, heat sink grid elements, and a base p... | 07/31/2001 |
| 6263955 | Heat sink with open region A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base w... | 07/24/2001 |
| 6260611 | Heat dissipation module A high watt number heat dissipation module having externally exposed fins is disclosed. The high heat produced by semiconductor operation is dissipated employing the present module, and the packaging rubber body is prevented from overflow. The present mod... | 07/17/2001 |
| 6257327 | Heat sink including pedestal A heat sink including a pedestal. The heat sink is used to dissipate heat from an electrical component such as a processor (e.g., a Pentium.RTM. Pro processor). The pedestal is arranged on the heat sink such that a gap which is formed between a surface of... | 07/10/2001 |
| 6256199 | Integrated circuit cartridge and method of fabricating the same An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially ... | 07/03/2001 |
| 6244331 | Heatsink with integrated blower for improved heat transfer A device that efficiently transfers heat from a heat source. The device includes a heat sink, the heat sink comprising a thermally conductive base, and a plurality of thermally conductive pin fins coupled to the thermally conductive base. A gas source, su... | 06/12/2001 |
| 6243264 | SRAM heat sink assembly and method of assembling A heat sink assembly includes a heat sink, a circuit board and an integrated circuit package. The package is located between the heat sink and the circuit board and attached to a die attach area of the circuit board. A heat sink retainer attached to the h... | 06/05/2001 |
| 6239487 | Lead frame with heat spreader and semiconductor package therewith A lead frame for a chip package includes a heat spreader and permits the mounting of various sized chips on the same sized lead frame. The lead frame includes a plurality of leads having outer portions and inner portions; a heat spreader having a rim port... | 05/29/2001 |
| 6234246 | Heat exchanger for cooling semi-conductor components Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the ... | 05/22/2001 |
| 6234239 | Segmented heat sink A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of ther... | 05/22/2001 |
| 6230789 | Heat dissipating device and method making the same The present invention provides a heat dissipating device and a method for making the same. The heat dissipating device includes an aluminum flat base plate integrally forming a number of studs thereon, an aluminum folded fin with a number of inverted U-sh... | 05/15/2001 |
| 6229216 | Silicon interposer and multi-chip-module (MCM) with through substrate vias An integrated circuit package which includes an integrated circuit that is connected to a silicon substrate. The silicon substrate may have a via. The package may further include a solder bump that is attached to both the integrated circuit and the silico... | 05/08/2001 |
| 6227286 | Heat sink and information processor using heat sink The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a n... | 05/08/2001 |
| 6223814 | Flexible foil finned heatsink structure and method of making same Heatsink structures for integrated circuit chips, chip packages, printed wiring boards and the like are disclosed. The heatsink structures according to the present invention have thin flexible cooling fins which move and vibrate under the flow of a coolin... | 05/01/2001 |
| 6223813 | Ultra high-density, high-performance heat sink An efficient heat sink having a high density of fins and a large effective surface area is formed by coiling a flat strip of thermally conductive material in which teeth or millifins have been formed by a stamping operation, for example. A spacer may be e... | 05/01/2001 |
| 6222260 | Integrated circuit device with integral decoupling capacitor A flat, thin decoupling capacitor is disposed inside an integrated circuit device in a coplanar relationship with a semiconductor chip and a bonding element. When connected to the power and ground plane of a device substrate or in a leadframe device, the ... | 04/24/2001 |
| 6213194 | Hybrid cooling system for electronics module A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from a computer system. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to chang... | 04/10/2001 |
| 6208513 | Independently mounted cooling fins for a low-stress semiconductor package In a semiconductor package, a die has electrical circuits formed on a first side surface. A lead frame for connecting the electrical circuits to a power source is connected to the electrical circuits of the die. A package body made of a dielectric materia... | 03/27/2001 |
| 6205026 | Heat sink retention components and system An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can ... | 03/20/2001 |
| 6202738 | Assembled structure having an enlarged heat transfer area for heat radiation therefrom An assembled structure of laminate plates, wherein a plurality of spaces exists between peripheries of the laminated plates. Thus, the outer surface of the structure is enlarged for improved radiation efficiency.... | 03/20/2001 |
| 6204566 | Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures A semiconductor integrated circuit device includes a semiconductor substrate having a first surface and including electrodes on the first surface of the semiconductor substrate; a glass coating film covering the first surface of the semiconductor substrat... | 03/20/2001 |
| 6201695 | Heat sink for chip stacking applications A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outsi... | 03/13/2001 |
| 6201699 | Transverse mountable heat sink for use in an electronic device The present invention provides a heat sink that, in an advantageous embodiment, includes a spine having a width with first and second opposing sides that are oriented to be abnormal to the substrate when the heat sink is mounted on the substrate. The heat... | 03/13/2001 |
| 6196299 | Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its corners A mechanical assembly for regulating the temperature of a chip is comprised of a heat exchanger which has a face for mating with a planar surface on the chip. A frame is coupled to the heat exchanger such that the face of the heat exchanger is exposed and... | 03/06/2001 |
| 6191945 | Cold plate arrangement for cooling processor and companion voltage regulator A compact cooling method and apparatus arranged for simultaneously drawing heat from both a processor and from the voltage regulator. The invention provides for advantageous arrangement of the voltage regulator and memory proximate to the processor for hi... | 02/20/2001 |
