Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 7642644 | Packaging for high power integrated circuits A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from t... | 01/05/2010 |
| 7508068 | Semiconductor module and power conversion device One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semico... | 03/24/2009 |
| 7492042 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 02/17/2009 |
| 7489034 | Integrated circuit cooling system and method A system and method for cooling an integrated circuit is provided. One aspect of this disclosure relates to a cooling system that utilizes sound waves to cool a semiconductor structure. The system includes a container to hold at least one semiconductor chip having s... | 02/10/2009 |
| 7432592 | Integrated micro-channels for 3D through silicon architectures Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. ... | 10/07/2008 |
| 7414847 | Heat dissipation device A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module... | 08/19/2008 |
| 7359196 | Dual impeller push-pull axial fan heat sink A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to t... | 04/15/2008 |
| 7342314 | Device having a useful structure and an auxiliary structure The present invention provides a device having a useful structure which is arranged on a substrate and has a useful structure side edge. In addition, an auxiliary structure is arranged on the substrate adjacent to the useful structure, the auxiliary structure having... | 03/11/2008 |
| 7342306 | High performance reworkable heatsink and packaging structure with solder release layer A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are s... | 03/11/2008 |
| 7339787 | Heat sink module for dissipating heat from a heat source on a motherboard A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of th... | 03/04/2008 |
| 7330352 | Interface module-mounted LSI package An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is i... | 02/12/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7288840 | Structure for cooling a surface An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface. ... | 10/30/2007 |
| 7289322 | Heat sink A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin pla... | 10/30/2007 |
| 7280365 | Multi-processor module with redundant power One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the proce... | 10/09/2007 |
| 7227257 | Cooling micro-channels The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same. ... | 06/05/2007 |
| 7224057 | Thermal enhance package with universal heat spreader A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat sprea... | 05/29/2007 |
| 7221566 | System for cooling a processor while reducing air flow noise A system is described for cooling a processor. In one embodiment, a heat sink assembly has a fan and air channels. In addition, a heat sink lid that is configured to cover only a region above the fan is coupled to the heat sink assembly. ... | 05/22/2007 |
| 7211891 | Electronic heat pump device, laser component, optical pickup and electronic equipment There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically a... | 05/01/2007 |
| 7206202 | Electronic apparatus with heat-dissipating structure An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation ... | 04/17/2007 |
| 7205654 | Programmed material consolidation methods for fabricating heat sinks Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that has been fabricated by such processes can have non-linear or convolut... | 04/17/2007 |
| 7202562 | Integrated circuit cooling system and method A system and method for cooling an integrated circuit is provided. One aspect of this disclosure relates to a cooling system that utilizes sound waves to cool a semiconductor structure. The system includes a container to hold at least one semiconductor chip having s... | 04/10/2007 |
| 7196406 | ESD protection apparatus for an electrical device An ESD protection apparatus for an electrical device with a circuit structure having an internal terminal, which is connected to an external terminal of the electrical device via a conductive connection, has a gas-filled cavity, through which the conductive connecti... | 03/27/2007 |
| 7154751 | Interface module-mounted LSI package An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is i... | 12/26/2006 |
| 7131487 | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat a... | 11/07/2006 |
| 7126819 | Chassis air guide thermal cooling solution A chassis air guide thermal cooling solution including a fan to which protruding edges are wedged at wedge grooves of a locating assembly to locate the fan therein, locating notches of a flexible ring are positioned in the locating assembly, an accommodating ring is... | 10/24/2006 |
| 7123484 | Multi-layer and multi-direction fan device A multi-layer and multi-direction radial fan device is disclosed, comprising an upper cover, a tower fan body, a cavity partition and a lower cover. The tower fan body is located in the upper cover, and the tower fan body comprises a first fan layer and a second fan... | 10/17/2006 |
| 7120018 | Mother board with a ventilation-enhancing member A mother board includes a CPU, a suction fan mounted on the CPU for dissipating heat resulting from operation of the CPU, a north bridge chip disposed downstream to the suction fan, a power-consumption component disposed at one side of the CPU, and a ventilation-enh... | 10/10/2006 |
| 7112883 | Semiconductor device with temperature control mechanism A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal heat-conductive medium thermally connected to the first metal heat-conduc... | 09/26/2006 |
| 7105858 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during... | 09/12/2006 |
| 7102226 | Device and method for package warp compensation in an integrated heat spreader A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method ... | 09/05/2006 |
| 7091604 | Three dimensional integrated circuits A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more elec... | 08/15/2006 |
| 7085134 | Dual fan heat sink A heat sink having graduated lengths of fins, with the tallest fins being in the center of the heat sink to provide maximum heat removal from a mated integrated circuit (IC) chip. Dual fans impinge air against the fins, and particularly the tallest fins, to provide ... | 08/01/2006 |
| 7078803 | Integrated circuit heat dissipation system An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attac... | 07/18/2006 |
| 7068515 | Multi-chip module with stacked redundant power Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for provi... | 06/27/2006 |
| 7064955 | Redundant power for processor circuit board One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least one processor coupled to and disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipat... | 06/20/2006 |
| 7061760 | Memory cooler An apparatus for cooling memory modules installed in adjacent sockets on a circuit board is provided. The apparatus includes a fan for directing cooling air through air gaps between adjacent memory modules. The air gaps extend in a longitudinal direction from a firs... | 06/13/2006 |
| 7030482 | Method and apparatus for protecting a die ESD events A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy material is provided on the substrate upon which the microprocessor i... | 04/18/2006 |
| 7028753 | Apparatus to enhance cooling of electronic device An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantit... | 04/18/2006 |
