Did You Know...
...In 1790, the cost to obtain a patent was between $4 and $5.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8143717 | Surface mount package with ceramic sidewalls A package for use in encapsulating an electronic device is disclosed. The package includes a dielectric frame having first and second sides with a pair of apertures extending through the dielectric frame. These apertures are separated by a raised shelf span extendin... | 03/27/2012 |
| 8134232 | Heat dissipation for integrated circuit A packaged integrated circuit having a thermal pathway to exhaust heat from the integrated circuit. The integrated circuit is disposed on a package substrate, with an encapsulant disposed around the integrated circuit. A heat sink is disposed at least partially with... | 03/13/2012 |
| 8120172 | Semiconductor device having improved heat sink The semiconductor device includes a substrate, a first semiconductor element, a second semiconductor element, a first heat sink and a second heat sink. The first and the second semiconductor elements are provided on the substrate. The maximum power consumption of th... | 02/21/2012 |
| 8093715 | Enhancement of thermal interface conductivities with carbon nanotube arrays A method of forming a well-anchored carbon nanotube (CNT) array, as well as thermal interfaces that make use of CNT arrays to provide very high thermal contact conductance. A thermal interface is formed between two bodies by depositing a continuous array of carbon n... | 01/10/2012 |
| 8080872 | Surface mount package with high thermal conductivity A package for use in encapsulating an electronic device is disclosed. In some embodiments, the package includes the following: a dielectric frame having first and second sides, an aperture, a raised shelf portion defined along an internal perimeter of the dielectric... | 12/20/2011 |
| 8080871 | Carbon nanotube-based structures and methods for removing heat from solid-state devices One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantiall... | 12/20/2011 |
| 8072061 | Semiconductor device with cooling element Some embodiments discussed herein include a semiconductor having a source region, a drain region and an array of fins operatively coupled to a gate region controlling current flow through the fins between the source region and the drain region. The semiconductor als... | 12/06/2011 |
| 8049330 | Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels A structure of light emitting diode (LED) wafer-level chip scale packaging (WL-CSP) is disclosed. The process of making the same is also provided in this invention. The LED CSP utilizes the through hole metal filling to enhance heat conduction between the LED die an... | 11/01/2011 |
| 8039953 | System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed bet... | 10/18/2011 |
| 7989949 | Heat extraction from packaged semiconductor chips, scalable with chip area A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103a and 104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height co... | 08/02/2011 |
| 7898079 | Nanotube materials for thermal management of electronic components A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a flexible member made from an array of interweaving carbon nanotubes. The heat-... | 03/01/2011 |
| 7884469 | Semiconductor package having a bridged plate interconnection A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, and a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metallized source contacts. A bridged source plate interconnecti... | 02/08/2011 |
| 7838988 | Stud bumps as local heat sinks during transient power operations A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plur... | 11/23/2010 |
| 7786571 | Heat-conductive package structure A heat-conductive package structure includes a carrier board having a first surface and an opposing second surface and formed with a through opening passing the carrier board; a first heat-conductive structure including a heat-conductive hole in the through opening,... | 08/31/2010 |
| 7781885 | Optoelectronic semiconductor package and method for attaching heat dissipation element thereto An optoelectronic semiconductor package for packaging a heat source capable of emitting light includes a base, a seal member, and a plurality of heat-dissipation elements. The base carries and touches the heat source and has a plurality of openings formed thereon, a... | 08/24/2010 |
| 7759790 | Lidless semiconductor cooling A system for cooling a semiconductor includes a heat sink in thermal contact with the semiconductor, a thermal interface material (TIM) layer disposed between the heat sink and the semiconductor, and a picture frame support disposed between a substrate of the semico... | 07/20/2010 |
| 7656029 | Cut-out heat slug for integrated circuit device packaging In a package, a heat slug, encapsulated by molding compound, encases an integrated circuit device (IC). In an example embodiment, a semiconductor package structure comprises a substrate having conductive traces and pad landings. The conductive traces have pad landin... | 02/02/2010 |
| 7629684 | Adjustable thickness thermal interposer and electronic package utilizing same An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively transferring heat from the chip to the heatsink. The interposer incl... | 12/08/2009 |
| 7586191 | Integrated circuit apparatus with heat spreader An integrated circuit apparatus with heat removal has an electrical interconnection network. The electrical interconnection network has a plurality of electrically and thermally conductive vias in electrical communication with terminals of at least one semiconductor... | 09/08/2009 |
| 7557442 | Power semiconductor arrangement A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is in thermal contact with the other side of the substrate, at least one... | 07/07/2009 |
| 7521794 | Intrinsic thermal enhancement for FBGA package A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconducto... | 04/21/2009 |
| 7443023 | High capacity thin module system Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry ... | 10/28/2008 |
| 7443683 | Cooling apparatus for electronic devices In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core s... | 10/28/2008 |
| 7439618 | Integrated circuit thermal management method and apparatus An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over th... | 10/21/2008 |
| 7436669 | 3D multi-layer heat conduction diffusion plate A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material c... | 10/14/2008 |
| 7429502 | Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufactu... | 09/30/2008 |
| 7427807 | Chip heat dissipation structure and manufacturing method This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste hea... | 09/23/2008 |
| 7425762 | Electronic apparatus The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a... | 09/16/2008 |
| 7416789 | Refractory metal substrate with improved thermal conductivity A substrate for semiconductor and integrated circuit components including: a core plate containing a Group VIB metal from the periodic table of the elements and/or an anisotropic material, having a first major surface and a second ... | 08/26/2008 |
| 7405448 | Semiconductor device having a resistance for equalizing the current distribution A first insulating substrate is formed on a heat sink, and a semiconductor element is formed thereon. An insulating resin casing is formed so as to cover the first insulating substrate and the semiconductor element. A second insulating substrate is mounted inside th... | 07/29/2008 |
| 7400040 | Thermal interface apparatus, systems, and methods An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion suffici... | 07/15/2008 |
| 7400035 | Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ... | 07/15/2008 |
| 7397119 | Wafer-level diamond spreader An embodiment of the present invention is a technique to heat spread at wafer level. A silicon wafer is thinned. A chemical vapor deposition diamond (CVDD) wafer processed. The CVDD wafer is bonded to the thinned silicon wafer to form a bonded wafer. Metallization i... | 07/08/2008 |
| 7391067 | Hybrid microwave integrated circuit An integrated microwave transistor amplifier includes a AlGaN/GaN active transistor arrangement on a thinned Si 1-mil heat spreader. Elongated, plated-through vias extend from the source portions of the transistor arrangement through the spreader to a thick gold sup... | 06/24/2008 |
| 7381346 | Thermal interface material A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface mat... | 06/03/2008 |
| 7378730 | Thermal interconnect systems methods of production and uses thereof Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated ... | 05/27/2008 |
| 7375424 | Wirebonded device packages for semiconductor devices having elongated electrodes A device package includes at least one semiconductor device having at least one electrode of an elongated length. The device package also includes at least one conductive pad that extends parallel to the elongated length of the electrode. A terminal lead may be inte... | 05/20/2008 |
| 7372147 | Supporting a circuit package including a substrate having a solder column array A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package i... | 05/13/2008 |
| 7371696 | Carbon nanotube structure and method of vertically aligning carbon nanotubes A Carbon NanoTube (CNT) structure includes a substrate, a CNT support layer, and a plurality of CNTs. The CNT support layer is stacked on the substrate and has pores therein. One end of each of the CNTs is attached to portions of the substrate exposed through the po... | 05/13/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
