Quotables
"The radio craze will die out in time."
Thomas Edison ; 1922
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8120171 | Power drive unit including a heat sink and a fastener A power drive unit is configured to comprise a heat sink, a power module pressed by a press member to the heat sink to be fastened thereto and a spring member that has a substantially circular shape and is installed between the power module and the press member. Wit... | 02/21/2012 |
| 8115303 | Semiconductor package structures having liquid coolers integrated with first level chip package modules Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include st... | 02/14/2012 |
| 7808100 | Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element The invention relates to a power semiconductor module comprising at least one power semiconductor chip, and comprising a pressure apparatus which exerts a pressure on the top side of the power semiconductor chip when the power semiconductor module is fixed to a heat... | 10/05/2010 |
| 7777329 | Heatsink apparatus for applying a specified compressive force to an integrated circuit device An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tighten... | 08/17/2010 |
| 7592698 | Power semiconductor modules having a cooling component and method for producing them An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal molded bodies with a flat portion and a contact device originating at ... | 09/22/2009 |
| 7589418 | Pressure contact power semiconductor module A power semiconductor module in a pressure contact embodiment, for disposition on a cooling component, in which load terminals are formed as metal molded bodies, each with at least one flat portion and having a plurality of contact feet extending from the flat porti... | 09/15/2009 |
| 7518235 | Method and structure to provide balanced mechanical loading of devices in compressively loaded environments An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of co... | 04/14/2009 |
| 7508067 | Semiconductor insulation structure A semiconductor insulation structure is disclosed for a semiconductor module, incorporating therein a semiconductor element, with which an electrically conductive structural body is held in pressured contact via an intervening insulation member. The semiconductor in... | 03/24/2009 |
| 7462934 | Integrated heat sink An integrated heat sink comprises a plurality of heat sink portions. The integrated heat sink provides efficient transfer of heat from a non-planar surface. In an example configuration two heat sinks are integrated to provide a thermal solution for dual bare die sil... | 12/09/2008 |
| 7440284 | Holding device for a heat sink A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of ... | 10/21/2008 |
| 7440276 | Cooling-fan-free system module A cooling-fan-free system module includes a housing unit having a front and a rear case together defining a receiving space therebetween, and the rear case being highly thermal-conductive; a circuit module received in the receiving space of the housing unit and incl... | 10/21/2008 |
| 7436673 | Heat sink fixing assembly A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the e... | 10/14/2008 |
| 7433189 | Electronic device and heat dissipation module thereof A heat dissipation module is suitable for being assembled on a circuit board to dissipate the heat source on the circuit board. The heat dissipation module includes a holding unit, a fan and a cover unit. The holding unit is formed by a holder base and multiple firs... | 10/07/2008 |
| 7433194 | Heat sink fastening assembly A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing p... | 10/07/2008 |
| 7429502 | Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufactu... | 09/30/2008 |
| 7430122 | Electronic device assembly with clips for mounting a heat sink thereon An electronic device assembly includes a PCB (10), a heat sink (30) mounted on the PCB, a back plate (20) attached below the PCB, a fan holder (40) mounted on a top of the heat sink and a fan mounted on the fan holder. The fan holder has ... | 09/30/2008 |
| 7428154 | Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat si... | 09/23/2008 |
| 7427809 | Repairable three-dimensional semiconductor subsystem A tightly packed three-dimensional electronic system or subsystem comprising multiple stacks of semiconductor elements is described. The system is repairable because the elements connect together using re-workable flip chip connectors; each flip chip connector compr... | 09/23/2008 |
| 7426112 | Heat dissipating module A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion ... | 09/16/2008 |
| 7414847 | Heat dissipation device A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module... | 08/19/2008 |
| 7411791 | Extendable heat dissipation apparatus An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base.... | 08/12/2008 |
| 7405938 | Heat sink clip A heat sink assembly (100) and a heat sink clip (20) are provided. The heat sink clip (20) includes a pin (22) and a spring (24) disposed around the pin (22). The pin (22) includes an upper section (22a)... | 07/29/2008 |
| 7405937 | Heat sink module for dual heat sources A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing membe... | 07/29/2008 |
| 7405939 | Fastening device and heat sink assembly using the same A heat sink assembly (100) includes a fastening device (20) and a heat sink (10). The fastening device includes a sleeve (24), a pin (22) received in the sleeve and a biasing means (26) disposed around the sleeve. The sleeve... | 07/29/2008 |
| 7403393 | Apparatus and system for cooling heat producing components An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing circuit board component, and a he... | 07/22/2008 |
| 7403394 | Heatsink locking device A heatsink-locking device that is applied to lock a heatsink to a placement surface having an exothermic component, includes a bottom base fixed on the placement surface to dispose and position the heatsink and having an open hole corresponding to the exothermic com... | 07/22/2008 |
| 7400029 | LED illumination system The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 1... | 07/15/2008 |
| 7400504 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at le... | 07/15/2008 |
| 7397663 | Clip for heat dissipation device A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the su... | 07/08/2008 |
| 7397666 | Wedge lock Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis. ... | 07/08/2008 |
| 7394656 | Heat dissipation device A heat dissipation device (100) includes a base plate (10), a fin assembly (30), at least one heat pipe (40), and a pair of foot members (20) attached to the base plate. The base plate defines a top surface (12). At least on... | 07/01/2008 |
| 7394658 | Heat sink with twist lock mounting mechanism A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securin... | 07/01/2008 |
| 7391613 | Memory module assembly including a clamp for mounting heat sinks thereon A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp ( | 06/24/2008 |
| 7391616 | Plasma display device A plasma display device includes: a Plasma Display Panel(PDP); a chassis base adapted to support the PDP attached to one surface thereof, a plurality of Integrated Circuit (IC) modules respectively included on driving circuit boards attached to another surface of th... | 06/24/2008 |
| 7391615 | Clip for heat sink A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The... | 06/24/2008 |
| 7388747 | Heat plate fixing structure A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing piece, wherein the fixing piece is fixed onto the internal side of the to... | 06/17/2008 |
| 7385818 | Cooling apparatus A cooling apparatus for cooling an electronic device on a substrate, comprising a first heat sink held in contact with the electronic device, but unconnected with the substrate or the electronic device. The first heat sink is held into contact with the electronic de... | 06/10/2008 |
| 7382621 | Video graphics array (VGA) card assembly A VGA card assembly comprises a VGA card (10) having a socket (13) thereon. A GPU (11) is attached on the socket. A base plate (22) is located on the VGA card and contacts with the GPU, for dissipating heat generated by the GPU. A back pl... | 06/03/2008 |
| 7382622 | Heat sink assembly A heat sink has a base (10), a plurality of fins (12, 14) and a central receiving groove (16) in the fins. A first positioning portion (1250) extends from a first fin at a side of the receiving groove and a positioning slot (1256) ... | 06/03/2008 |
| 7382617 | Heat sink assembly A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory mo... | 06/03/2008 |
