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| Number | Title | Issue Date |
| 8076774 | Transistor clamping device A transistor-clamping device for a transistor is provided with a holding block and a spring. The holding block engages over the transistor, so that the spring is pre-tensioned. A pressure plate is provided between the holding block and the transistor. The spring fix... | 12/13/2011 |
| 8053889 | Semiconductor module A semiconductor module including a module body and a shock absorbing member on an exposed surface of the module body is provided. The module body may include at least one semiconductor package on a substrate and the exposed surface of the module body may include exp... | 11/08/2011 |
| 8053888 | System for clamping heat sink A system for clamping a heat sink that prevents excessive clamping force is provided. The system may include a heat sink, a semiconductor device, a printed circuit board, and a cover. The semiconductor device may be mounted onto the circuit board and attached to the... | 11/08/2011 |
| 8008769 | Heat-dissipating semiconductor package structure and method for manufacturing the same A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of... | 08/30/2011 |
| 7919856 | Package mounted module and package board module A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for suppo... | 04/05/2011 |
| 7880299 | Semiconductor device The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. The semiconductor device includes a semiconductor module in which a semiconductor element is s... | 02/01/2011 |
| 7843058 | Flip chip packages with spacers separating heat sinks and substrates A package structure includes a substrate; a die over and flip bonded on the substrate; a heat sink over the die; and one or more spacer separating the heat sink from the substrate. ... | 11/30/2010 |
| 7838987 | Electronic device, standoff member, and method of manufacturing electronic device An electronic device comprises a semiconductor device having a package substrate with bumps. The semiconductor device is bonded to a mounting substrate by flip-chip bonding. A standoff member supports the package substrate on the mounting substrate with a predetermi... | 11/23/2010 |
| 7745929 | Semiconductor device and method for producing the same A semiconductor device (1) has a semiconductor component (2), a first electrode (6) and a control electrode (7) being arranged on the top side (4). The semiconductor device (1) furthermore has a circuit carrier (3) ha... | 06/29/2010 |
| 7723844 | Heat dissipation device having a locking device A heat dissipation device includes a heat sink, a retention module and a locking device for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat-generating component. The retention module includes a bottom wall and... | 05/25/2010 |
| 7675164 | Method and structure for connecting, stacking, and cooling chips on a flexible carrier A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one com... | 03/09/2010 |
| 7646093 | Thermal management of dies on a secondary side of a package An apparatus including a first die mounted on a primary side of an electronic package and a second die mounted on a secondary side of the electronic package between the electronic package and a printed circuit board. The apparatus further comprising a thermal compon... | 01/12/2010 |
| 7602060 | Heat spreader in a flip chip package A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface material disposed in thermal conductive communication with the die and a ... | 10/13/2009 |
| 7576429 | Packaged semiconductor device with dual exposed surfaces and method of manufacturing The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite ends of the device through a nonconductive molding material used to p... | 08/18/2009 |
| 7498673 | Heatplates for heatsink attachment for semiconductor chips An apparatus for heatsink attachment. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includ... | 03/03/2009 |
| 7443026 | IC chip package having force-adjustable member between stiffener and printed circuit board An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an undersid... | 10/28/2008 |
| 7440284 | Holding device for a heat sink A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of ... | 10/21/2008 |
| 7436670 | Heat sink retaining device A heat sink retaining device for attaching a heat sink on a chip unit is provided, which includes a retaining component and a rotating component. The retaining component is locked to the heat sink in a state of pressing by a hook portion thereof, and the rotating co... | 10/14/2008 |
| 7436673 | Heat sink fixing assembly A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the e... | 10/14/2008 |
| 7433194 | Heat sink fastening assembly A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing p... | 10/07/2008 |
| 7429792 | Stack package with vertically formed heat sink A stack package includes a base substrate having connection pads on an upper surface thereof and ball lands on a lower surface thereof; at least two semiconductor chps stacked by intervening a spacer on the base substrate and defined with through-holes for electrica... | 09/30/2008 |
| 7430122 | Electronic device assembly with clips for mounting a heat sink thereon An electronic device assembly includes a PCB (10), a heat sink (30) mounted on the PCB, a back plate (20) attached below the PCB, a fan holder (40) mounted on a top of the heat sink and a fan mounted on the fan holder. The fan holder has ... | 09/30/2008 |
| 7426112 | Heat dissipating module A heat dissipating module includes a releasing member, a heat pipe, which has a first end connected to the releasing member and a second end attached to the top surface of a thermal chip on a circuit board, and a fastening member, which has a protruded arch portion ... | 09/16/2008 |
| 7414844 | Liquid cooled heat sink with cold plate retention mechanism A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient col... | 08/19/2008 |
| 7414847 | Heat dissipation device A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module... | 08/19/2008 |
| 7411791 | Extendable heat dissipation apparatus An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base.... | 08/12/2008 |
| 7409751 | Clip for heat sink A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting me... | 08/12/2008 |
| 7409752 | Structure of holding mechanism with rotatable knob for radiator A structure of a holding mechanism with a rotatable bidirectional knob suitable for securing a radiator is disclosed. The holding mechanism comprises a pressure-bearing unit, a buckling element and an operation assembly. The buckling element and the pressure-bearing... | 08/12/2008 |
| 7405938 | Heat sink clip A heat sink assembly (100) and a heat sink clip (20) are provided. The heat sink clip (20) includes a pin (22) and a spring (24) disposed around the pin (22). The pin (22) includes an upper section (22a)... | 07/29/2008 |
| 7400506 | Method and apparatus for cooling a memory device A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is op... | 07/15/2008 |
| 7397666 | Wedge lock Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis. ... | 07/08/2008 |
| 7397664 | Heatspreader for single-device and multi-device modules A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider p... | 07/08/2008 |
| 7397663 | Clip for heat dissipation device A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the su... | 07/08/2008 |
| 7394656 | Heat dissipation device A heat dissipation device (100) includes a base plate (10), a fin assembly (30), at least one heat pipe (40), and a pair of foot members (20) attached to the base plate. The base plate defines a top surface (12). At least on... | 07/01/2008 |
| 7394658 | Heat sink with twist lock mounting mechanism A heat sink with a twist lock mounting mechanism. An electronic device may be mounted to the heat sink without the use of external fasteners, such as screws or rivets. Instead of using external fasteners, the heat sink includes resilient mounting flanges for securin... | 07/01/2008 |
| 7391615 | Clip for heat sink A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The... | 06/24/2008 |
| 7391616 | Plasma display device A plasma display device includes: a Plasma Display Panel(PDP); a chassis base adapted to support the PDP attached to one surface thereof, a plurality of Integrated Circuit (IC) modules respectively included on driving circuit boards attached to another surface of th... | 06/24/2008 |
| 7391613 | Memory module assembly including a clamp for mounting heat sinks thereon A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp ( | 06/24/2008 |
| 7388747 | Heat plate fixing structure A heat plate fixing structure is provided, suitable for being used in the heatsink structure of the heating element for an electronic device, which is provided with a support part and a fixing piece, wherein the fixing piece is fixed onto the internal side of the to... | 06/17/2008 |
| 7385825 | Heat dissipation device A heat dissipation device includes a heat sink defining a pair of cutouts at two opposite sides thereof. The heat sink includes two pads fixed in the cutouts, respectively. Each pad defines a slot therein. A retention module supports the heat sink thereon, and exten... | 06/10/2008 |
