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| Number | Title | Issue Date |
| 6690087 | Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a struct... | 02/10/2004 |
| 6667546 | Ball grid array semiconductor package and substrate without power ring or ground ring A ball grid array semiconductor package is proposed, wherein at least a chip is mounted on a substrate, and signal pads on the chip are electrically connected to signal fingers on the substrate by bonding wires. A power plate and a ground plate are each a... | 12/23/2003 |
| 6667548 | Diamond heat spreading and cooling technique for integrated circuits A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which... | 12/23/2003 |
| 6664649 | Lead-on-chip type of semiconductor package with embedded heat sink A lead-on-chip type of semiconductor package with an embedded heat sink is constructed on a leadframe including an outer-lead portion, an inner-lead portion, and a downset bond-finger portion. A semiconductor chip is arranged on a back side of the inner-l... | 12/16/2003 |
| 6645612 | High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them The present invention relates to a method for making a hexagonal boron nitride slurry and the resulting slurry. The method involves mixing from about 0.5 wt. % to about 5 wt. % surfactant with about 30 wt. % to about 50 wt. % hexagonal boron nitride powde... | 11/11/2003 |
| 6646341 | Heat sink apparatus utilizing the heat sink shroud to dissipate heat In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. ... | 11/11/2003 |
| 6627997 | Semiconductor module and method of mounting In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the semiconductor chips are covered with a single heat spread plate, and the whole space around the semiconductor chips, sandwiched between ... | 09/30/2003 |
| 6627981 | Resin-packaged semiconductor device A plurality of leads are arrayed around an island (1) to which a semiconductor chip (3) is bonded. A plurality of first wires (4) interconnects each electrode terminal of the semiconductor chip (3) and each of the plurality of leads (2), while a second wi... | 09/30/2003 |
| 6624523 | Structure and package of a heat spreader substrate A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spre... | 09/23/2003 |
| 6616999 | Preapplicable phase change thermal interface pad A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a porti... | 09/09/2003 |
| 6614107 | Thin-film heat sink and method of manufacturing same A thin-film heat sink comprises a heat sink film functioning as a heat sink and a bonding film for bonding the heat sink film to a base. The bonding film is an aluminum oxide (Al2 O3) film formed using the CVD method and the heat sin... | 09/02/2003 |
| 6611057 | Semiconductor device attaining both high speed processing and sufficient cooling capacity A semiconductor device includes two or more semiconductor modules which are stacked up into three-dimensional structure. Each semiconductor module includes a wiring board, one or more IC chips which are mounted on the wiring board, and one or more heat si... | 08/26/2003 |
| 6608379 | Enhanced chip scale package for flip chips A chip scale package (CSP) comprises a flip chip and chip carrier with features to enhance its electrical and thermal performance. The flip chip connects to the chip carrier through alternating signal and ground connections. Top layer routing on the chip ... | 08/19/2003 |
| 6607942 | Method of fabricating as grooved heat spreader for stress reduction in an IC package A new design is provided for the heat spreader of a semiconductor package. Grooves are provided in a surface of the heat spreader, subdividing the heat spreader for purposes of stress distribution into four or more sections. This division of the heat spre... | 08/19/2003 |
| 6597063 | Package for semiconductor power device and method for assembling the same A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating sub... | 07/22/2003 |
| 6596565 | Chip on board and heat sink attachment methods A process for forming a thermally enhanced Chip On Board semiconductor device (10) with a heat sink (30) is described. In one aspect, a thermally conducting filled gel elastomer material (50) or a silicon elastomeric material or elastomeric material, if t... | 07/22/2003 |
| 6590281 | Crack-preventive semiconductor package A QFN semiconductor package and a fabrication method thereof are proposed, wherein a lead frame having a plurality of leads is adopted, and each lead is formed at its inner end with a protruding portion. A wire bonding region and a bump attach region are ... | 07/08/2003 |
| 6586834 | Die-up tape ball grid array package An integrated circuit package including a flexible circuit tape having a flexible polyimide tape laminated to a conductor layer, a plurality of blind holes extending through the flexible tape to the conductor layer and a plurality of through holes extendi... | 07/01/2003 |
| 6586845 | Semiconductor device module and a part thereof A semiconductor device module includes one or a plurality of semiconductor devices, each including a semiconductor element having first and second surfaces, pads formed on the first surface on which electrode terminals are also formed and curved, flexible... | 07/01/2003 |
| 6586835 | Compact system module with built-in thermoelectric cooling An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory... | 07/01/2003 |
| 6576497 | Chip-type electronic component A ceramic substrate having two side surfaces in a lengthwise direction and two side surfaces in a widthwise direction intersecting each other. The ceramic substrate also includes at least one flat surface in a thicknesswise direction. Internal electrode f... | 06/10/2003 |
| 6574107 | Stacked intelligent power module package A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently s... | 06/03/2003 |
| 6573596 | Non-rectangular thermo module wafer cooling device using the same A non-rectangular thermo module is formed by disposing a plurality of Peltier devices between a pair of heat radiating plates, wherein the heat radiating plate has a circular or straight outer peripheral contour portion and inner peripheral contour portio... | 06/03/2003 |
| 6574106 | Mounting structure of semiconductor device A mounting structure for a semiconductor device of the present invention includes a substrate, a semiconductor device, a plurality of connecting members and a member. The substrate has a first surface and a plurality of pads on the first surface. The semi... | 06/03/2003 |
| 6555200 | Method of making semiconductor devices, semiconductor device, circuit board, and electronic apparatus A method of making semiconductor devices comprising the steps of: preparing non-defective individual film packages having good quality, wherein leads are formed and a semiconductor chip is mounted on each of the film packages; attaching each of the non-de... | 04/29/2003 |
| 6545351 | Underside heat slug for ball grid array packages An integrated circuit package which includes an integrated circuit that is attached to a first side of a substrate. The package may also have a solder ball and a heat slug that are both attached to a second side of the substrate. The heat slug and solder ... | 04/08/2003 |
| 6541854 | Super low profile package with high efficiency of heat dissipation A super low profile package with high efficiency of heat dissipation comprises the substrate, the heat sink, the die, the wires and the plastic mold. The heat sink adheres to the ground ring by the extending part of the heat sink, and the first surface of... | 04/01/2003 |
| 6542371 | High thermal conductivity heat transfer pad A thermal pad for use in facilitating heat flow between a heat source surface and a heat sink surface includes a carbon fiber fabric that is impregnated with a thermal substance.... | 04/01/2003 |
| 6538308 | Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided between first radiation block and cooling block. The press-fitt... | 03/25/2003 |
| 6534861 | Ball grid substrate for lead-on-chip semiconductor package A package substrate suitable for use with a ball grid array according to the invention includes an electrically and thermally conductive heat sink having a top surface and a bottom surface, the heat sink having a slot formed therethrough which opens onto ... | 03/18/2003 |
| 6531770 | Electronic part unit attached to a circuit board and including a cover member covering the electronic part An electronic part unit comprises an electronic part body which has a semiconductor chip and a plurality of external connection electrodes electrically connected to the semiconductor chip and in which the semiconductor chip is encapsulated such that the e... | 03/11/2003 |
| 6528878 | Device for sealing and cooling multi-chip modules According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover coveri... | 03/04/2003 |
| 6521982 | Packaging high power integrated circuit devices The invention provides a method and apparatus for electrically connecting the die of a high power semiconductor device to a substrate with a conductive strap such that the connection is resistant to the shear stresses resulting with changes in temperature... | 02/18/2003 |
| 6519154 | Thermal bus design to cool a microelectronic die A novel thermal bus is shown that more effectively transmits heat away from a die of an IC. The innovative thermal bus is capable of transmitting heat to other heat dissipating devices such as heat sinks, which eventually transmit the heat out to ambient.... | 02/11/2003 |
| 6515859 | Heat sink alignment A heat sink alignment apparatus having an internal chamber with a plurality of heat sinks placed at an angled relationship to one another creating a tunnel through which air streams flows. At least one heat source is attached to a heat sink. A plurality o... | 02/04/2003 |
| 6507101 | Lossy RF shield for integrated circuits A low-cost EMI shield that fits around an integrated circuit package to absorb electromagnetic energy and dissipate it as heat. The shield is not ohmically conductive so it may contact electrically active conductors without affecting the operation of the ... | 01/14/2003 |
| 6501171 | Flip chip package with improved cap design and process for making thereof Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are fil... | 12/31/2002 |
| 6498390 | Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing An integrated circuit package which may have a thermally conductive tape that attaches a thermal element to a package housing. The housing encloses an integrated circuit that is mounted to a substrate. The thermally conductive tape may be configured to co... | 12/24/2002 |
| 6495913 | Semiconductor clamped-stack assembly A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extendi... | 12/17/2002 |
| 6492739 | Semiconductor device having bumper portions integral with a heat sink A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor ch... | 12/10/2002 |
