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| Number | Title | Issue Date |
| 4160992 | Plural semiconductor devices mounted between plural heat sinks A microwave semiconductor device with improved thermal properties is disclosed wherein multiple active semiconductor bodies are disposed between two electrically and thermally isolated heat sinks. Two separate thermal paths are provided for heat produced ... | 07/10/1979 |
| 4150393 | High frequency semiconductor package A low parasitic microwave transistor package is provided including a metal header formed from a base member and having a cylindrical center portion; a metallized ceramic insulator formed in an annular ring which is attached to the metal header and surroun... | 04/17/1979 |
| 4145708 | Power module with isolated substrates cooled by integral heat-energy-removal means The evaporating area of a heat pipe or thermosiphon evaporator is used as the thermal sink for one face of an electrically isolated substrate upon the opposite face of which are mounted and interconnected one or more power semiconductors and other compone... | 03/20/1979 |
| 4141136 | Method of fabricating semiconductor devices with a low thermal resistance and devices obtained by the method A method of fabricating highly miniaturized semiconductor devices which must be electrically but not thermally insulated from ground, by replacing the conventional disk of beryllium oxide with a portion of the substrate itself so as to decrease the therma... | 02/27/1979 |
| 4132856 | Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby A process of packaging an electronic integrated circuit which comprises a film carrier having metallized connector leads formed thereon to provide the connector leads for the integrated circuit (a hermetically sealed bumped die); gang-bonding the die to s... | 01/02/1979 |
| 4124864 | Plastic encapsulated semiconductor devices A plastic packaged semiconductor device having a heat sink includes a semiconductor device which requires ultrasonically bonded leads. External leads are attached to the heat sink and have end portions to which ultrasonic bonds can be made. The lead end p... | 11/07/1978 |
| 4117508 | Pressurizable semiconductor pellet assembly Disclosed is a semiconductor body mounted on an electrically-insulative, thermally-conductive plate which also carries metallized contacts electrically connected to the various contact areas associated with the semiconductor body. A protective one-piece i... | 09/26/1978 |
| 4103321 | Composite electric circuit structure of a printed circuit and heat generating discrete electrical component To prevent failure of solder connections between projecting pins from discrete electrical components, such as power transistors, and printed circuit paths formed on an insulated substrate, the space between the semiconductor and an attached cooling plate ... | 07/25/1978 |
| 4081825 | Conduction-cooled circuit package A circuit package exhibiting an excellent heat transfer path from a semiconductor chip or other heat-generating device to the heat-sink can or cover of the package. A heat-conducting pad is metallurgically bonded to either said cover or a surface of said ... | 03/28/1978 |
| 4079410 | Semiconductor rectifier device with improved cooling arrangement An improved semiconductor rectifier arrangement of the type in which two ncapsulated rectifier elements, each having at least one pn-junction, are each fastened, via respective metal contact discs and in a manner that insulates the rectifier elements ele... | 03/14/1978 |
| 4074342 | Electrical package for LSI devices and assembly process therefor An electrical package for Large Scale Integrated (LSI) devices includes a carrier having (a) thermal expansion similar to a semiconductor, (b) a standard array of terminal pins (100 or more) and (c) a circuit transposer that is (i) a semiconductor materia... | 02/14/1978 |
| 4067041 | Semiconductor device package and method of making same The specification discloses a semiconductor device package which includes a conductive heat sink support member which is bonded to a planar face of a ceramic body. A conductive pattern is formed on a second planar face of the ceramic body and includes at ... | 01/03/1978 |
| 4047197 | Housing and lead structure for a series connected semiconductor rectifier arrangement A semiconductor rectifier arrangement in which two semiconductor rectifier evices which each have at least one pn junction are fastened with their connecting components to one side of a common metallic base plate in an electrically isolated but thermally c... | 09/06/1977 |
| 4000509 | High density air cooled wafer package having improved thermal dissipation A high density low profile air cooled wafer package including flip chip and embedded logic or memory islands upon a wafer package mounted within a heat dissipating cover having improved thermal dissipation. Heat dissipation is achieved through a thermal g... | 12/28/1976 |
| 3996603 | RF power semiconductor package and method of manufacture High frequency power transistor carriers are made by bonding a metalized ceramic base to a lead frame strip, cutting the lead frame strip to isolate the base and collector leads while still maintaining the transistor carriers in strip form, and subsequent... | 12/07/1976 |
| 3943556 | Method of making a high frequency semiconductor package A method for manufacturing a low cost high frequency transistor package including a metal header, a metallized apertured ceramic insulator affixed to the header, a metallized beryllia insulator, and two cylindrical bonding rails within the aperture of the... | 03/09/1976 |
| 3936866 | Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate Integrated circuit chips are mounted in electronic assemblies with the chip terminal pads "up" or on the opposite side of the chip from the substrate of the circuit board. The lower chip surface is bonded either directly to the heat-conducting substrate o... | 02/03/1976 |
