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| Number | Title | Issue Date |
| 8159066 | Semiconductor package having a heat dissipation member A semiconductor package having a heat dissipation member capable of efficiently conveying excess heat away from semiconductor chips is presented. The semiconductor package includes a semiconductor chip, through-electrodes, and a heat dissipation member. The semicond... | 04/17/2012 |
| 8125078 | Semiconductor element cooling structure A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling t... | 02/28/2012 |
| 8030762 | Light emitting diode package having anodized insulation layer and fabrication method therefor An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light... | 10/04/2011 |
| 8018053 | Heat transfer device One example discloses a heat transfer device that can comprise a semiconductor material having a first region and a second region. The first region and the second region are doped to propel a charged carrier from the first region to the second region. The heat trans... | 09/13/2011 |
| 8008768 | Semiconductor device having heat radiating configuration A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes: a casing, a board and a semiconductor chip. The chip includes: an element part; a heat sink bonded to the element part; an insulting layer located on the ... | 08/30/2011 |
| 7932597 | Semiconductor device and manufacturing method thereof A BGA substrate which has a back surface to which a heat radiating plate is attached and an opening for accommodating a relay wiring substrate therein, which is provided in the center of its surface, is used. The relay wiring substrate to which an ASIC chip and a me... | 04/26/2011 |
| 7859104 | Thermal interface material having carbon nanotubes and component package having the same A thermal interface material includes a carbon nanotube array, a transition structure, and a matrix. The carbon nanotube array includes a plurality of carbon nanotubes. The transition structure covers at least a part of the surfaces of carbon nanotubes. The matrix e... | 12/28/2010 |
| 7709952 | Light emitting diode package An LED package is improved in heat radiating performance. The LED package includes a package substrate having heat radiating means; a heat radiating layer arranged on the package substrate with an area at least larger than a mounting area of a light emitting diode c... | 05/04/2010 |
| 7652373 | Power delivery using an integrated heat spreader An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by... | 01/26/2010 |
| 7586190 | Optoelectronic component and a module based thereon An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External e... | 09/08/2009 |
| 7545034 | Thermal energy removal structure and method An electrical structure including a first substrate comprising a plurality of electrical components, a first thermally conductive film layer formed over and in contact with a first electrical component of the plurality of electrical components, a first thermally con... | 06/09/2009 |
| 7470983 | Semiconductor device reducing warping due to heat production A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between thermal expansion of the semiconductor element and thermal expansion o... | 12/30/2008 |
| 7453145 | Electronics unit An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a... | 11/18/2008 |
| 7443023 | High capacity thin module system Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry ... | 10/28/2008 |
| 7439614 | Circuit device with dummy elements In a manufacturing method of a hybrid integrated circuit device 10 according to the present invention, a first dummy pattern D1 is provided on a first wiring layer 18A. Furthermore, a second dummy pattern D2 is provided on a second wiring... | 10/21/2008 |
| 7436060 | Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the substrate. The die is electrically connected with electrical connection... | 10/14/2008 |
| 7431071 | Fluid circuit heat transfer device for plural heat sources A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive ... | 10/07/2008 |
| 7427566 | Method of making an electronic device cooling system A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrific... | 09/23/2008 |
| 7417312 | Use of solder paste for heat dissipation A circuit board includes at least one trace having at least one heat spreader disposed thereon, the heater spreader being formed of a solidified paste, such as a paste that includes a mixture of binder particles and filler particles, or a solder paste. As an example... | 08/26/2008 |
| 7417299 | Direct connection multi-chip semiconductor element structure A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit struc... | 08/26/2008 |
| 7400035 | Semiconductor device having multilayer printed wiring board A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed ... | 07/15/2008 |
| 7400506 | Method and apparatus for cooling a memory device A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is op... | 07/15/2008 |
| 7397664 | Heatspreader for single-device and multi-device modules A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider p... | 07/08/2008 |
| 7382618 | Heat dissipating apparatus for computer add-on cards A heat dissipating apparatus for dissipating heat generated by a VGA card includes a heat sink and a retention assembly. The heat sink includes a base located on the add-on card, a plurality of fins, a fan for blowing air toward the fins and a cover for covering the... | 06/03/2008 |
| 7372147 | Supporting a circuit package including a substrate having a solder column array A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package i... | 05/13/2008 |
| 7372151 | Ball grid array package and process for manufacturing same A process for manufacturing an integrated circuit package includes forming a plurality of solder balls on a first surface of a substrate and mounting a semiconductor die to the substrate such that bumps of the semiconductor die are electrically connected to conducti... | 05/13/2008 |
| 7369411 | Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assem... | 05/06/2008 |
| 7365418 | Multi-chip structure A multi-chip structure at least including a first chip, a second chip and a first thermal-conductive layer is provided. The first chip has a first surface and a plurality of first pads disposed on the first surface. The second chip has a second surface facing the fi... | 04/29/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7362582 | Cooling structure using rigid movable elements A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for ... | 04/22/2008 |
| 7362578 | Heat sink fastening system A heat sink assembly for removing heat from an electronic component includes a retention clip having a central body and a securing member extending from the central member. The central member has an opening there through, and the securing member is configured to sec... | 04/22/2008 |
| 7358605 | Heat dissipation structure for electronic device A heat dissipation structure for an electronic device comprises a plurality of covering members made of a compressed wooden material, and a metal heat dissipation frame held between the covering members, and a portion of the heat dissipation frame is exposed outside... | 04/15/2008 |
| 7359201 | Heat-generating electronic part cover and cover mounting method A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body (20) of rectangular prism shape having a top wall (23), bottom wall (24), side walls, op... | 04/15/2008 |
| 7355855 | Compliant thermal interface structure utilizing spring elements A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a ... | 04/08/2008 |
| 7355276 | Thermally-enhanced circuit assembly A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit assembly. The circuit assembly comprises a substrate, a thermally-conduct... | 04/08/2008 |
| 7355854 | Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board, extending between its top and bottom surfaces, defining an edge which i... | 04/08/2008 |
| 7348664 | Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compress... | 03/25/2008 |
| 7342304 | Semiconductor package with heat dissipating structure A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a su... | 03/11/2008 |
| 7342294 | SOI bipolar transistors with reduced self heating A bipolar transistor includes a collector located over a substrate; and a heat conductive path connecting the substrate to the collector. The heat conductive path is filled with a heat conductive material such as metal or polysilicon. In one embodiment the heat cond... | 03/11/2008 |
