Did You Know...
...that on Dec. 15, 1836, the Patent Office was completely destroyed by fire? Lost were some 7,000 models, 9,000 drawings, and 230 books plus all records of patent applications and grants.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7431071 | Fluid circuit heat transfer device for plural heat sources A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive ... | 10/07/2008 |
| 7369377 | Snubbers for low temperature power electronics Switching losses and conduction losses are isolated by networks which are partially cryogenic and partially at room temperature. Switching losses are independent of temperature. Advantageously the switching losses are taken in a snubber network at room temperature a... | 05/06/2008 |
| 7304380 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 12/04/2007 |
| 7300821 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 11/27/2007 |
| 7258839 | Temperature controlled microfabricated two-pin liquid sample dispensing system A cooled liquid sample dispensing system comprises a pair of pins for holding a droplet of liquid therebetween and a cooling element. Each pin includes a tip spaced predetermined distance from the other pin to define a sample acquisition region. The pins acquire and... | 08/21/2007 |
| 7232710 | Method of making cascaded die mountings with springs-loaded contact-bond options A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power le... | 06/19/2007 |
| 7224059 | Method and apparatus for thermo-electric cooling Embodiments of the present invention provide a method, apparatus and system for absorbing heat from an active side of a die by a plurality of cold conductive elements embedded in said die, and releasing said absorbed heat by a plurality of hot conductive elements em... | 05/29/2007 |
| 7211891 | Electronic heat pump device, laser component, optical pickup and electronic equipment There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically a... | 05/01/2007 |
| 7206202 | Electronic apparatus with heat-dissipating structure An electronic apparatus with a heat-dissipating structure is disclosed. The electronic apparatus with a heat-dissipating structure comprises a main body having a plurality of apertures, a resilient component having two ends fixed to the main body, and an insulation ... | 04/17/2007 |
| 7193316 | Integrated circuit coolant microchannel with movable portion According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume o... | 03/20/2007 |
| 7121333 | Radiator sheet The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator s... | 10/17/2006 |
| 7091604 | Three dimensional integrated circuits A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more elec... | 08/15/2006 |
| 7084495 | Electroosmotic pumps using porous frits for cooling integrated circuit stacks A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integra... | 08/01/2006 |
| 7082034 | Circuit cooling A housing cover to cause electrical components to engage with at least one component pad of a heat sink, the cover including a projection integrally formed from the housing cover and positioned on the cover for biasing the electrical component against the component ... | 07/25/2006 |
| 7078803 | Integrated circuit heat dissipation system An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attac... | 07/18/2006 |
| 7071553 | Package structure compatible with cooling system The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electri... | 07/04/2006 |
| 7068510 | Dissipating heat reliably in computer systems A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assem... | 06/27/2006 |
| 7038311 | Thermally enhanced semiconductor package A thermally enhanced BGA semiconductor device 10 having a heat sink 12 formed from a single piece of material with an expanded base and a pedestal in contact with a semiconductor chip 11. The pedestal is aligned through a window opening in a sub... | 05/02/2006 |
| 6992382 | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon A method and apparatus for cooling an electronics chip with a cooling plate having integrated micro channels and manifold/plenum made in separate single-crystal silicon or low-cost polycrystalline silicon. Forming the microchannels in the cooling plate is more econo... | 01/31/2006 |
| 6963131 | Integrated circuit system with a latent heat storage module The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage... | 11/08/2005 |
| 6930385 | Cascaded die mountings with spring-loaded contact-bond options A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power le... | 08/16/2005 |
| 6883594 | Cooling system for electronics with improved thermal interface A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat t... | 04/26/2005 |
| 6850549 | Light source device for pumping solid-state laser medium A light source device for pumping a solid-state laser medium of a laser generator, which is compact and capable of economically using LD bars constituting the LD stack with easy maintenance. The light source device is constituted by a plurality of LD modules. Each L... | 02/01/2005 |
| 6793009 | CTE-matched heat pipe A heat pipe having a mounting surface with a coefficient of thermal expansion matching that of silicon is disclosed, the heat pipe including a base containing aluminum nitride, a metal body, and a metal wick. ... | 09/21/2004 |
| 6789610 | High performance cooling device with vapor chamber A low-cost, fan assisting cooling device is disclosed and includes a heat mass, a thermal core, a vapor chamber, and a phase change liquid sealed in the vapor chamber at a low pressure. Waste heat in the thermal core boils the phase change liquid and converts it int... | 09/14/2004 |
| 6742574 | Cooling apparatus A cooling apparatus 1 boiling and condensing refrigerant is constructed to have a stacked construction by stacking a plurality of pressed members 3 and comprises a refrigerant tank portion, a heat exchanging portion and a refrigerant diffusing portion.... | 06/01/2004 |
| 6744136 | Sealed liquid cooled electronic device A liquid cooled electronic device and a method for sealing a liquid cooled electronic device are disclosed. The liquid cooled electronic device has at least one heat generating electronic device suspended in an electrically insulative heat transfer fluid. The heat g... | 06/01/2004 |
| 6714413 | Compact thermosiphon with enhanced condenser for electronics cooling A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises ... | 03/30/2004 |
| 6624523 | Structure and package of a heat spreader substrate A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spre... | 09/23/2003 |
| 6621071 | Microelectronic system with integral cryocooler, and its fabrication and use A microelectronic system includes a substrate that is preferably silicon and a microelectronic device supported on the substrate. The microelectronic device may be a light sensor that include a readout integrated circuit formed in the silicon substrate, a... | 09/16/2003 |
| 6609560 | Flat evaporator A flat evaporator is provided. In the evaporator, a common chamber formed on a substrate with a predetermined diameter and depth for containing a coolant is divided into a vaporization cavity region, a capillary region surrounding the vaporization cavity ... | 08/26/2003 |
| 6588498 | Thermosiphon for electronics cooling with high performance boiling and condensing surfaces A thermosiphon for cooling an electronic device having a mean width of dimension "b" comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom ... | 07/08/2003 |
| 6550531 | Vapor chamber active heat sink A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion.... | 04/22/2003 |
| 6495913 | Semiconductor clamped-stack assembly A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extendi... | 12/17/2002 |
| 6408937 | Active cold plate/heat sink A heat sink apparatus for gathering and dissipating heat from a heat source having a heat source housing includes an impeller chamber having a chamber interior containing a heat transfer fluid and comprising a heat transfer wall for transferring heat from... | 06/25/2002 |
| 6137169 | Heat reduction system for transistor assemblies A power module or other circuit is formed with transistor assemblies, each having one or more semiconductor slices electrically connected to one another and fixed to a supporting system. The supporting system includes a tubular element suited to allow the... | 10/24/2000 |
| 6121995 | Cooling arrangement for electro-optical character generator A character generator for a printer or copier which illuminates a surface of a photoconductor is provided with a cooling device, wherein a line of LEDs is mounted on a bearing surface of a hollow, thin walled profile that runs along the direction of the L... | 09/19/2000 |
| 6091746 | Assembly of cooled laser diode arrays An assembly of N laser diode arrays. Each diode is fitted to the end of a base which forms the anode and is traversed by a hole. The holes of all the bases define a channel for the circulation of fluid for cooling the assembly of diode arrays. Each module... | 07/18/2000 |
| 6031286 | Semiconductor structures containing a micro pipe system therein A semiconductor device or other suitable substrate and method with single or multi layers of buried micro pipes are disclosed. This is achieved by controlling the aspect ratio of trenches as well as controlling the deposition characteristics of the materi... | 02/29/2000 |
| 6018192 | Electronic device with a thermal control capability An electronic device (10) having a thermal control capability is disclosed. The electronic device includes a substrate (16), a signal conductive region (26) disposed on at least a portion of the substrate, the signal conductive region configured to provid... | 01/25/2000 |
