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| Number | Title | Issue Date |
| 8188595 | Two-phase cooling for light-emitting devices System, method, and apparatus for two phase cooling in light-emitting devices are disclosed. In one aspect of the present disclosure, an apparatus includes a light-emitting device and a two-phase cooling apparatus coupled to the light-emitting device. The coupling o... | 05/29/2012 |
| 8183686 | Semiconductor device Between a logic LSI (4) arranged on one side of a DRAM (1) and jointed to the DRAM and a radiating member (6) arranged on the other side of the DRAM (1) for irradiating the heats of the DRAM (1) and the logic LSI (4), there ... | 05/22/2012 |
| 8164183 | Integrated circuit cooling device A pump having: a cavity formed inside an insulating substrate, the upper part of the substrate being situated near the cavity having an edge; a conductive layer covering the inside of the cavity up to the edge and optionally covering the edge itself; a flexible memb... | 04/24/2012 |
| 8049329 | Wafer stacked package waving bertical heat emission path and method of fabricating the same A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the s... | 11/01/2011 |
| 8044506 | Thermal-emitting memory module, thermal-emitting module socket, and computer system The invention provides a thermal-emitting memory module, a thermal-emitting module socket, and a computer system comprising the thermal-emitting memory module and the thermal-emitting module socket. An embodiment of the thermal-emitting module includes: a module sub... | 10/25/2011 |
| 8026597 | Fluid cooled encapsulated microelectronic package An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor ch... | 09/27/2011 |
| 8022535 | Systems, devices, and methods for semiconductor device temperature management Devices, systems, and methods for semiconductor die temperature management are described and discussed herein. An IC device is described that includes at least one intra-die cooling structure. In an embodiment, the IC device includes a semiconductor die formed of in... | 09/20/2011 |
| 7999375 | Electronic device with integrated micromechanical contacts and cooling system An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals... | 08/16/2011 |
| 7956458 | Metal clad fiber optics for enhanced heat dissipation An integrated optical I/O and semiconductor chip with a direct liquid jet impingement cooling assembly are disclosed. Contrary to other solutions for packaging an optical I/O with a semiconductor die, this assembly makes use of a metal clad fiber, e.g. copper, which... | 06/07/2011 |
| 7928565 | Semiconductor device with a high thermal dissipation efficiency A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting materi... | 04/19/2011 |
| 7884468 | Cooling systems for power semiconductor devices A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first c... | 02/08/2011 |
| 7872349 | Integrated coolant circuit arrangement, operating method and production method An integrated circuit arrangement and method of fabricating the integrated circuit arrangement is provided. At least one integrated electronic component is arranged at a main area of a substrate. The component is arranged in the substrate or is isolated from the sub... | 01/18/2011 |
| 7859103 | Semiconductor module and inverter device A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow fo... | 12/28/2010 |
| 7855449 | Cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The ceramic plate (15) is adapted for forming an in... | 12/21/2010 |
| 7834448 | Fluid cooled semiconductor power module having double-sided cooling A semiconductor power module includes one or more power semiconductor power devices sandwiched between a fluid conducting base and a fluid conducting cover joined to the base. Fluid coolant entering the base diverges into a first flow path through the base and a sec... | 11/16/2010 |
| 7816786 | Semiconductor unit, and power conversion system and on-vehicle electrical system using the same A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insula... | 10/19/2010 |
| 7800220 | Power electronics assembly with cooling element The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substra... | 09/21/2010 |
| 7795726 | Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semicond... | 09/14/2010 |
| 7763973 | Integrated heat sink for a microchip In an embodiment, an integrated heat sink for a microchip includes a substrate having a plurality of interconnected electronic devices formed in a plurality of layers. At least one heat sink element is interposed within the layers and includes a microchannel to prov... | 07/27/2010 |
| 7755186 | Cooling solutions for die-down integrated circuit packages Systems for cooling the backside of a semiconductor die located in a die-down integrated circuit (IC) package are described. The IC package is attached to the topside of a printed circuit board (PCB) with the backside of the die residing below the topside surface of... | 07/13/2010 |
| 7755185 | Arrangement for cooling a power semiconductor module An arrangement for cooling a power semiconductor module, the power semiconductor module having a substrate with a ceramic plate and may have a metallization thereon, the arrangement has a container for the intake of a coolant with a heat-conducting plate; the heat-c... | 07/13/2010 |
| 7705448 | Semiconductor device for pipe for passing refrigerant liquid A semiconductor device includes 1) a conductive pipe including an inner surface forming an inner space shaping a path of an insulative cooling refrigerant liquid and an outer surface including a plane potion partially formed thereof, 2) a power semiconductor element... | 04/27/2010 |
| 7679184 | Semiconductor device having high cooling efficiency and method for manufacturing the same A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cool... | 03/16/2010 |
| 7663230 | Methods of forming channels on an integrated circuit die and die cooling systems including such channels A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels. ... | 02/16/2010 |
| 7656028 | System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic device A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound tha... | 02/02/2010 |
| 7652372 | Microfluidic cooling of integrated circuits A microchannel cooling system used to cool integrated circuits may include a number of microchannels which may be subject to bubble blockage. When bubble formation or nucleation occurs due to heating, the bubbles may become trapped within the microchannels. A valve ... | 01/26/2010 |
| 7626261 | Wafer stacked package having vertical heat emission path and method of fabricating the same A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the s... | 12/01/2009 |
| 7608924 | Liquid cooled power electronic circuit comprising stacked direct die cooled packages A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stac... | 10/27/2009 |
| 7592697 | Microelectronic package and method of cooling same A microelectronic package comprises a chip stack (110) that includes a substrate (111), a first die (112) over the substrate and a second die (113) over the first die, a first underfill layer (114) between the substrate and the fir... | 09/22/2009 |
| 7582962 | Heat dissipation device A heat dissipation device comprises a multilayer substrate, a channel formed in the multilayer substrate, and tubes disposed within the channel, the tubes suitable for removing heat from a heat generating device located adjacent to the multilayer substrate. ... | 09/01/2009 |
| 7560813 | Chip-based thermo-stack A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through chip connection including a bounding material having an inner and outer perimeter, the inner perimeter defining an inter... | 07/14/2009 |
| 7538425 | Power semiconductor package having integral fluid cooling A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The se... | 05/26/2009 |
| 7538426 | Cooling system of power semiconductor module A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor module, and a controller which estimates a change of a heat transfer coef... | 05/26/2009 |
| 7538427 | Microchannel structure and manufacturing method therefor, light source device, and projector A microchannel structure that has plural microchannels through which fluid flows, including: a housing section formed in a block; and a pipe array arranged in the housing section and formed by stacking plural pipes. ... | 05/26/2009 |
| 7498672 | Micropin heat exchanger An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. ... | 03/03/2009 |
| 7485957 | Fluid cooled encapsulated microelectronic package An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor ch... | 02/03/2009 |
| 7466023 | Semiconductor light emitting device and plant cultivating system Guard electrodes 2 which are electrically connected with a conductive portion of a cooling water passage 23 through connection lines 3 are respectively provided in the middle of a water inlet pipe 1 connected with a water inlet master pip... | 12/16/2008 |
| 7449776 | Cooling devices that use nanowires Different types of cooling devices using nanowires are described. For example, a cooling device may include a plurality of diamond nanowires coupled to a surface. The diamond nanowires conduct heat energy from the surface and dissipate the heat energy into a neighbo... | 11/11/2008 |
| 7440278 | Water-cooling heat dissipator A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the f... | 10/21/2008 |
| 7439617 | Capillary underflow integral heat spreader A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of t... | 10/21/2008 |
