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Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 7061102 | High performance flipchip package that incorporates heat removal with minimal thermal mismatch A semiconductor flipchip package includes a central cavity area on the first major side for receiving a flipchip die therein. The package substrate is substantially made from a single material that serves as the support and stiffener and provides within the cavity f... | 06/13/2006 |
| 7060747 | Chain extension for thermal materials A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G′ of the ... | 06/13/2006 |
| 7061022 | Lateral heat spreading layers for epi-side up ridge waveguide semiconductor lasers Disclosed are a semiconductor device and method of manufacturing the same comprising a substrate, a mesa region adjacent to the substrate, an electroplated metal layer, for reducing the thermal resistance of the device, surrounding the mesa region, an insulator laye... | 06/13/2006 |
| 7061104 | Apparatus for conditioning power and managing thermal energy in an electronic device In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device.... | 06/13/2006 |
| 7057894 | Computer system with a liquid-cooling thermal module having a plurality of pumps A computer system includes a processor for processing data, a storage unit for storing data, and a liquid cooling thermal module for dissipating heat generated by the processor. The thermal module has a liquid coolant carrying pipe adjacent to the processor for cond... | 06/06/2006 |
| 7057897 | Means for securing a cooling device Means for securing a cooling device includes a main body attached to the cooling device and at least a secure unit. The main body provides at least an axial hole corresponding to the secure unit. The secure unit provides a secure component, which is disposed in the ... | 06/06/2006 |
| 7053493 | Semiconductor device having stiffener A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coeffic... | 05/30/2006 |
| 7049697 | Process for making fine pitch connections between devices and structure made by the process A semiconductor device structure including fine-pitch connections between chips is fabricated using stud/via matching structures. The stud and via are aligned and connected, thereby permitting fine-pitch chip placement and electrical interconnections. A chip support... | 05/23/2006 |
| 7049695 | Method and device for heat dissipation in semiconductor modules A structure and method are provided for dissipating heat from a semiconductor device chip. A first layer of a dielectric material (e.g. polyimide) is formed on a front side of a heat spreader (typically Si). A plurality of openings are formed through this first laye... | 05/23/2006 |
| 7049696 | IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device A connection structure including an IC chip, a substrate disposed with a conductive layer, and a heat-radiating mechanism that is mounted on the substrate, disposed between the IC chip and the substrate, and dissipates heat of the IC chip, wherein terminals of the I... | 05/23/2006 |
| 7045890 | Heat spreader and stiffener having a stiffener extension A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate. ... | 05/16/2006 |
| 7046420 | MEM micro-structures and methods of making the same A device comprising an array of free metal ribbons that are coupled to a substrate through ceramic support structures is disclosed. The device is preferably an optical MEM device, wherein a first set of free metal ribbons are configured to move relative to a second ... | 05/16/2006 |
| 7042729 | Thermal interface apparatus, systems, and fabrication methods An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material. ... | 05/09/2006 |
| 7042084 | Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core A semiconductor package substrate has top and bottom surface buildup layers disposed on a thermally conductive substrate core. A portion of the substrate core may be exposed at a top surface of the package substrate to allow a heat spreader to be thermally coupled t... | 05/09/2006 |
| 7038313 | Semiconductor device and method of manufacturing the same A semiconductor device includes a circuit board formed of an insulator substrate and having conductor patterns on both surfaces thereof, a semiconductor chip bonded to the circuit board with one of the conductor patterns therebetween, and a radiator base bonded to t... | 05/02/2006 |
| 7036219 | Method for manufacturing a high-efficiency thermal conductive base board A method for manufacturing a high-efficiency thermal conductive base board for electrical connection with an electronic component includes the steps of: (a) placing a metal substrate in an electrolytic bath; (b) oxidizing the metal substrate in the electrolytic bath... | 05/02/2006 |
| 7038305 | Package for integrated circuit die An integrated circuit device package and method of assembling same is disclosed. The device package includes an interposer ring substrate having a hollowed out center mounted on a die attach pad, a die mounted substantially in the center of the die attach pad such t... | 05/02/2006 |
| 7038311 | Thermally enhanced semiconductor package A thermally enhanced BGA semiconductor device 10 having a heat sink 12 formed from a single piece of material with an expanded base and a pedestal in contact with a semiconductor chip 11. The pedestal is aligned through a window opening in a sub... | 05/02/2006 |
| 7038312 | Die-up ball grid array package with attached stiffener ring An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second s... | 05/02/2006 |
| 7032392 | Method and apparatus for cooling an integrated circuit package using a cooling fluid A method and apparatus for cooling an integrated circuit die. An integrated circuit package comprises an integrated circuit die. A cooling fluid makes contact with the integrated circuit die. In one embodiment, an interposer is disposed between the integrated circui... | 04/25/2006 |
| 7034390 | Semiconductor package having multi-signal bus bars A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is couple... | 04/25/2006 |
| 7035104 | Apparatus for heat transfer and critical heat flux enhancement An apparatus for cooling single and multiple high-flux and ultra-high-flux heat dissipating devices, comprising a liquid coolant module having a base plate and a cover plate defining therebetween a liquid coolant chamber with a liquid coolant inlet port and a liquid... | 04/25/2006 |
| 7032207 | Method of designing semiconductor integrated circuit with accurate capacitance extraction A semiconductor integrated circuit includes a block having a first border edge on which an external connection terminal is provided and a second border edge on which no external connection terminal is provided, a wiring prohibited area which extends a first distance... | 04/18/2006 |
| 7031162 | Method and structure for cooling a dual chip module with one high power chip Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mat... | 04/18/2006 |
| 7030482 | Method and apparatus for protecting a die ESD events A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy material is provided on the substrate upon which the microprocessor i... | 04/18/2006 |
| 7031163 | Mechanical cooling fin for interconnects In one embodiment, an integrated circuit includes an electrically active interconnect line within a dielectric layer having a top and bottom surface, the bottom surface of the dielectric layer being coupled to the top surface of a substrate underlying the dielectric... | 04/18/2006 |
| 7030487 | Chip scale packaging with improved heat dissipation capability A chip scale packaging with improved heat dissipation capability is disclosed. A chip or die is adhered to the first surface of a packaging substrate having a plurality of metalized through holes thereon. A functional solder ball array is implanted on the second sur... | 04/18/2006 |
| 7030496 | Semiconductor device having aluminum and metal electrodes and method for manufacturing the same A semiconductor device includes a semiconductor substrate; an aluminum electrode disposed on the substrate; a protection film disposed on the aluminum electrode; an opening disposed on the protection film for exposing the aluminum electrode; and a metal electrode di... | 04/18/2006 |
| 7031156 | Reduced package volume convectively cooled sealed electrical system and method A sealed modular control and monitoring system is provided which affords location of electrical control and monitoring components adjacent to an application. The system comprises modular components which are mounted on a shared thermal base. The base is sealed to th... | 04/18/2006 |
| 7031160 | Magnetically enhanced convection heat sink A magnetically enhanced convection heat sink comprises a heat sink member for dissipating heat from a heat source. A magnetic source creates a magnetic field concentrated at a first location, the intensity of the magnetic field decreasing from the first location to ... | 04/18/2006 |
| 7030317 | Electronic assembly with stacked integrated circuit die An electronic assembly with a plurality of stacked integrated circuit (IC) die includes a base substrate, a first IC die, a second IC die, a signal routing first interconnect and a signal routing second interconnect. The first interconnect is partially positioned be... | 04/18/2006 |
| 7028753 | Apparatus to enhance cooling of electronic device An electronic device has at least one component that is capable of generating a quantity of heat. The electronic device further has an air-moving device and an air duct. The air moving device is capable of creating a flow of air that removes a portion of the quantit... | 04/18/2006 |
| 7030472 | Integrated circuit device having flexible leadframe An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface a... | 04/18/2006 |
| 7030483 | Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application One embodiment of the invention includes a thermal interface material. The thermal interface material includes a polymer matrix; a plurality of fusible particles dispersed within the polymer matrix; and a plurality of non-fusible particles dispersed within the polym... | 04/18/2006 |
| 7030474 | Plastic integrated circuit package and method and leadframe for making the package Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the... | 04/18/2006 |
| 7027202 | Silicon substrate as a light modulator sacrificial layer An optical MEM device is fabricated with a patterned device layer formed on a silicon wafer. Preferably, the patterned device layer is patterned with plurality of ribbons and/or access trenches. The central portion of the ribbon is released from the silicon wafer us... | 04/11/2006 |
| 7026711 | Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA) A microelectronic package comprising a device substrate having first and second opposing surfaces and comprising a plurality of microelectronic devices. The microelectronic package also includes a plurality of electrically conductive members coupled to corresponding... | 04/11/2006 |
| 7026719 | Semiconductor package with a heat spreader A semiconductor package with a heat spreader is described, including a first chip, a second chip, a heat spreader and a substrate. The first chip has an active surface over which the second chip is attached. The heat spreader is attached over the first chip. The fir... | 04/11/2006 |
| 7022549 | Method for connecting an integrated circuit to a substrate and corresponding arrangement An integrated circuit, in particular from a chip, a wafer or a hybrid, to a substrate. A package is provided for the integrated circuit, which has a connection side, on which there are provided a plurality of connection regions for connection to the substrate. A cor... | 04/04/2006 |
| 7023172 | Motor controller An electric motor control apparatus of this invention estimates changes in temperature of a semiconductor device to compute temperature change amplitude 108 based on an output current signal 105 computed from a current flowing through the semiconductor... | 04/04/2006 |
