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Neuroimaging as a Marketing Tool
Neuroimaging as a means for validating whether a stimulus such as advertisement, communication, or product evokes a certain mental response such as emotion, preference, or memory, or to predict the consequences of the stimulus on later behavior such as consumption or purchasing.
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| Number | Title | Issue Date |
| 7363701 | Method of making a heat pipe An encapsulated heat pipe is made by placing a removable elongated solid partially within a mold, filling the mold with a solid dielectric material, and removing the elongated solid from the dielectric material defining an elongated cavity that extends within the so... | 04/29/2008 |
| 7365422 | Package of leadframe with heatsinks A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink... | 04/29/2008 |
| 7365425 | Heat radiation structure of semiconductor element and heat sink According to a heat radiation structure of a semiconductor element of the invention, by providing a recess for a thermal conductive sheet on the bottom surface of a mounting seat of a heat sink, disposing the thermal conductive sheet in this recess, and screwing a s... | 04/29/2008 |
| 7365273 | Thermal management of surface-mount circuit devices A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first surface of the substrate, and a cavity is defined by and between the... | 04/29/2008 |
| 7362583 | Thermal management device for multiple heat producing devices A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal s... | 04/22/2008 |
| 7362372 | Video surveillance camera A video surveillance camera comprising an image sensor, first housing, second housing, electronic circuit, and thermal barrier. The image sensor is located in the first housing, and the electronic circuit is located in the second housing. The thermal barrier has fir... | 04/22/2008 |
| 7362577 | Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on t... | 04/22/2008 |
| 7361976 | Data carrier with a module with a reinforcement strip In a lead-frame configuration (60), a module (70) and a data carrier (72), two connecting plates (12, 13) of the module (70), which are each intended for connection to a connecting contact or bump (47, 48) of a chip (41 | 04/22/2008 |
| 7361985 | Thermally enhanced molded package for semiconductors An integrated circuit package (50) is provided which comprises a substrate (20), an integrated circuit (12) mounted on the substrate, and a compressive, thermally conductive interposer (52) mounted on the integrated circuit. ... | 04/22/2008 |
| 7361986 | Heat stud for stacked chip package A semiconductor package assembly is presented. The assembly comprises a first chip and a second chip. The back surfaces of the first and the second chips are thermally attached through a die attach material. The front surface of the first chip is attached to a subst... | 04/22/2008 |
| 7358606 | Apparatus to compensate for stress between heat spreader and thermal interface material A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the ide... | 04/15/2008 |
| 7357173 | Cooling device for a chip and method for its production The invention relates to a cooling device for a chip, in particular a processor, embodied with a number of projections or fins standing essentially normal on a base surface facing away from the chip and which may be fixed to the chip by the base surface on the side ... | 04/15/2008 |
| 7355854 | Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards An apparatus for improved grounding and heat transfer between flange mount field effect transistors and printed wiring boards is provided comprising a cut-out formed in the printed wiring board, extending between its top and bottom surfaces, defining an edge which i... | 04/08/2008 |
| 7352063 | Semiconductor structure that includes a cooling structure formed on a semiconductor surface and method of manufacturing the same A semiconductor device has a semiconductor chip having first and second surfaces; a sealing resin formed over the first surface; and a cooling structure having a first conductive layer formed on the first surface, an n-type semiconductor formed on the first conducti... | 04/01/2008 |
| 7352062 | Integrated circuit package design A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package su... | 04/01/2008 |
| 7345364 | Structure and method for improved heat conduction for semiconductor devices A thermally conductive structure for a semiconductor integrated circuit and a method for making the structure. The structure comprises one or more vertical and/or horizontal thermally conductive elements disposed proximate a device for improving thermal conductivity... | 03/18/2008 |
| 7345885 | Heat spreader with multiple stacked printed circuit boards A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein. ... | 03/18/2008 |
| 7342306 | High performance reworkable heatsink and packaging structure with solder release layer A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are s... | 03/11/2008 |
| 7342307 | Semiconductor device A semiconductor device includes: a package; two semiconductor chip fixing parts located adjacently to each other in the package; and first and the second semiconductor chips, each of which is fixed on the semiconductor chip fixing part and has a field effect transis... | 03/11/2008 |
| 7335983 | Carbon nanotube micro-chimney and thermo siphon die-level cooling A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die. ... | 02/26/2008 |
| 7331377 | Diamond foam spray cooling system A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray assembly, a chamber, a heat spreader and at least one diamond foam section... | 02/19/2008 |
| 7329949 | Packaged microelectronic devices and methods for packaging microelectronic devices Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second ... | 02/12/2008 |
| 7329948 | Microelectronic devices and methods A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When ... | 02/12/2008 |
| 7327028 | Embedded heat spreader for folded stacked chip-scale package In some embodiments, a T-shaped heat spreader may be provided centrally within a folded stacked chip-scale package. The dice may be situated around the T-shaped heat spreader which may be made of high conductivity material. Heat may be dissipated through the T-shape... | 02/05/2008 |
| 7323776 | Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connecte... | 01/29/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7324341 | Electronics assembly and heat pipe device An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed sur... | 01/29/2008 |
| 7323255 | Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member ... | 01/29/2008 |
| 7319590 | Conductive heat transfer system and method for integrated circuits According to an embodiment of the present invention, a system includes an integrated circuit coupled to a circuit board and a heat conducting element having a thermal conductivity of at least 391 W/m*K. The heat conducting element includes a flexible portion dispose... | 01/15/2008 |
| 7317247 | Semiconductor package having heat spreader and package stack using the same A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its lower surface, a heat spreader attached to the rear side of the semicondu... | 01/08/2008 |
| 7317248 | Memory module having memory chips protected from excessive heat The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed circuit board and are contact-connected by the printed circuit board; having a buffer chip for driving the me... | 01/08/2008 |
| 7312525 | Thermally enhanced package for an integrated circuit A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channe... | 12/25/2007 |
| 7312997 | Heat-dissipation device with elastic member and heat-dissipation method thereof The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface ... | 12/25/2007 |
| 7311140 | Heat sink assembly with overmolded carbon matrix A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with... | 12/25/2007 |
| 7309911 | Method and stacked memory structure for implementing enhanced cooling of memory devices A method and structure are provided for implementing enhanced cooling of a plurality of memory devices. The memory structure includes a stack of platters. A sub-plurality of memory devices is mounted on each platter. At least one connector is provided with each plat... | 12/18/2007 |
| 7309918 | Chip package structure This invention relates to a chip package structure comprising of a chip, multiple leads with inner and outer ends, an exposed chip upper surface, an encapsulated body encloses the peripherals of the chip, and multiple conducting wires used to connect electrically th... | 12/18/2007 |
| 7304380 | Integrated circuit cooling and insulating device and method A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Fu... | 12/04/2007 |
| 7304381 | Package and method for attaching an integrated heat spreader In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached t... | 12/04/2007 |
| 7304379 | Semiconductor device with pipe for passing refrigerant liquid A semiconductor device includes 1) a conductive pipe including an inner surface forming an inner space shaping a path of an insulative cooling refrigerant liquid and an outer surface including a plane potion partially formed thereof, 2) a power semiconductor element... | 12/04/2007 |
| 7304849 | Compliant thermal cap for an electronic device A cooling structure for an electronic device comprises a compliant cap preloaded over the electronic device. The compliant cap comprises a horizontal top surface and at least one vertical support for the surface, the vertical support comprising a compliant portion a... | 12/04/2007 |
