Bizarre Patents
A portable partition for use in an automobile having a seat with a seat bench and a seat backrest.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 6963133 | Semiconductor device and method for manufacturing semiconductor device A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating sheets, and a mold resin covering the chip, the heat sinks, and the s... | 11/08/2005 |
| 6963130 | Heatsinking and packaging of integrated circuit chips A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit board and enclosing the exposed semiconductor die. The exposed surfac... | 11/08/2005 |
| 6963132 | Integrated semiconductor device having co-planar device surfaces The present invention provides a method of forming an integrated semiconductor device, and the device so formed. An active surface of at least two semiconductor devices, such as semiconductor chips, are temporarily mounted onto an alignment substrate. A support subs... | 11/08/2005 |
| 6963131 | Integrated circuit system with a latent heat storage module The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage... | 11/08/2005 |
| 6960824 | Structure and method for fabrication of a leadless chip carrier Structure and method for fabrication of a leadless chip carrier have been disclosed. A disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die. The disclosed embodiment also comprises a printed circuit board attached to a bo... | 11/01/2005 |
| 6960825 | Semiconductor device having radiation structure A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protrud... | 11/01/2005 |
| 6961244 | Switching power supply A switching power supply includes a switching circuit, a main transformer, a rectifier circuit, and an output smoothing circuit, which are mounted on a base plate. Voltage transformation of an inputted direct current voltage is performed through collaboration among ... | 11/01/2005 |
| 6961245 | High frequency module There is presented a high frequency module, in which a recess 2a for mounting power amplifier device is formed on a lower surface of a dielectric substrate 2, and a recess 2b for mounting surface acoustic wave filter is formed on a... | 11/01/2005 |
| 6958517 | Compact, all-layers-programmable integrated circuit arrangements A programmable integrated circuit (IC) arrangement includes at least one input/output terminal, at least two receiver/source terminals for selectable electrical connection to the at least one input/output terminal, and a plurality of layers electrically interconnect... | 10/25/2005 |
| 6958536 | Microelectronic packages having rail along portion of lid periphery The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peri... | 10/25/2005 |
| 6956284 | Integrated circuit stacking system and method The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules... | 10/18/2005 |
| 6956285 | EMI grounding pins for CPU/ASIC chips An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of... | 10/18/2005 |
| 6956741 | Semiconductor package with heat sink A semiconductor package with a heat sink is provided, having a substrate formed with at least one opening penetrating therethrough. A heat sink is mounted on a surface of the substrate same as for forming solder balls and seals one end of the opening by a thermally ... | 10/18/2005 |
| 6954360 | Thermally enhanced component substrate: thermal bar An IC package dissipates thermal energy using thermal bars. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material... | 10/11/2005 |
| 6953227 | High-power multi-device liquid cooling A cooling system is presented. The system includes a cooling circuit and at least one electronic component coupled to a surface. One or more heat dissipation structures are in thermal contact with the at least one electronic component. At least one sliding seal mech... | 10/11/2005 |
| 6951243 | Axially tapered and bilayer microchannels for evaporative coolling devices The invention consists of an evaporative cooling device comprising one or more microchannels whose cross section is axially reduced to control the maximum capillary pressure differential between liquid and vapor phases. In one embodiment, the evaporation channels ha... | 10/04/2005 |
| 6951411 | Light beam generation, and focusing and redirecting device An improved light beam generation and focusing device (15, 50) has a light source (16, 51) constructed and arranged to emit at least one beam of light (20), and a lens assembly (17, 19, 56) constructed and arranged to focus the at least o... | 10/04/2005 |
| 6950305 | Overmolded device with contoured surface An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional electronic devices. The three dimensional features are designed to be mol... | 09/27/2005 |
| 6949838 | Integrated circuit device The present invention includes integrated circuit devices, synchronous-link dynamic random access memory devices, methods of forming an integrated circuit device and methods of forming a synchronous-link dynamic random access memory edge-mounted device. According to... | 09/27/2005 |
| 6949824 | Internal package heat dissipator A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be installed between an integrated circuit and a substrate before packaging. The package is formed from molded epoxy formed around the integrat... | 09/27/2005 |
| 6947286 | Stack up assembly A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that t... | 09/20/2005 |
| 6946190 | Thermal management materials A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a di... | 09/20/2005 |
| 6946729 | Wafer level package structure with a heat slug A wafer level package structure and a method for packaging said wafer level package structure are described. The wafer level package structure at least comprises a die, a heat slug covering said die, a carrier for supporting said heat slug and said die, a plurality ... | 09/20/2005 |
| 6946730 | Semiconductor device having heat conducting plate A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating sheets, and a mold resin covering the chip, the heat sinks, and the s... | 09/20/2005 |
| 6944025 | EMI shielding apparatus An electromagnetic shielding structure is provided for a microprocessor or other electronic device that emits electromagnetic radiation. The structure includes a heat sink with an integrally formed depending skirt, and a conductive, compressible polymer is applied t... | 09/13/2005 |
| 6943443 | Electronic circuit device including metallic member having installation members Bumps are formed on electrodes of semiconductor elements, and moreover, the semiconductor elements with the bumps are electrically connected to metallic members having installation members, whereby wiring lines are eliminated. Stray inductance and conduction resista... | 09/13/2005 |
| 6943436 | EMI heatspreader/lid for integrated circuit packages An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board. ... | 09/13/2005 |
| 6940164 | Power module A power module incorporates a switching semiconductor element and a smoothing capacitor and includes a metallic base plate dissipating heat produced by the switching semiconductor element and the smoothing capacitor. The metallic base plate is thermally separated in... | 09/06/2005 |
| 6940162 | Semiconductor module and mounting method for same In a multi chip module of a structure wherein a plurality of bare or packaged semiconductor chips are mounted on a single wiring board and upper surfaces of the semiconductor chips are covered with a single heat spread plate, the whole space around the semiconductor... | 09/06/2005 |
| 6940720 | Integrated circuit having a thermally shielded electric resistor trace An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the electric resistor trace to the substrate. The present invention is based on ... | 09/06/2005 |
| 6936501 | Semiconductor component and method of manufacture A semiconductor component having a lid for protecting a semiconductor chip and a method for manufacturing the semiconductor component. The semiconductor chip has an active surface and a mounting surface. It is flip-chip mounted to a support substrate so the active s... | 08/30/2005 |
| 6933603 | Multi-substrate layer semiconductor packages and method for making same A device, comprising a first substrate having a transmission line formed on a surface thereof and a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and the secon... | 08/23/2005 |
| 6933616 | Multi-chip module packaging device using flip-chip bonding technology The present invention discloses a multi-chip module packaging device which has outward extension portions of under bump metallurgies (UBM) for satisfying the bonding area requirement during wire bonding operation. Therefore, chips have electrical connections with me... | 08/23/2005 |
| 6933619 | Electronic package and method of forming An electronic package and method of making same in which a thermally conductive member is in thermally conductive communication with a semiconductor chip encapsulated within a dielectric material that surrounds portions of a thermally conductive member, semiconducto... | 08/23/2005 |
| 6933602 | Semiconductor package having a thermally and electrically connected heatspreader Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The substrate includes at least one electrical ground plane and includes a plurality solder balls formed on a... | 08/23/2005 |
| 6934154 | Micro-channel heat exchangers and spreaders Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC ... | 08/23/2005 |
| 6933443 | Method for bonding ceramic to copper, without creating a bow in the copper An electronic device and method of forming said device are presented, in which the device comprises a base having a pair of elongate flanges and a channel portion defined therebetween, wherein the channel portion has a substantially planar first surface, and wherein... | 08/23/2005 |
| 6927891 | Tilt-able grating plane for improved crosstalk in 1×N blaze switches A light modulator includes elongated elements arranged parallel to each other. Each elongated element includes a light reflective planar surface with the light reflective planar surfaces configured in a first grating plane. A support structure is coupled to the elon... | 08/09/2005 |
| 6924559 | Electronic device with heat conductive encasing device The invention relates to the field of electronic devices with a thermally conducting encapsulant for draining away some of the energy dissipated by the electronic components contained in the electronic device. This is an electronic device comprising: a circuit (7... | 08/02/2005 |
| 6921974 | Packaged device with thermal enhancement and method of packaging A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation. ... | 07/26/2005 |
