Class 257/700 - Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the housing or package combined with
No. of patents: 1610
Last issue date: 05/07/2013

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Number	Title	Issue Date
7939935	Electronic device substrate, electronic device and methods for fabricating the same A core substrate-less electronic device is fabricated by using an electronic device substrate 10. The electronic device substrate 10 a metal core substrate 11, and an external connection wiring layer 100 provided on the metal core substra...	05/10/2011
7939936	Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit A semiconductor package includes a wiring board having a plurality of first electrode pads exposed on a top surface thereof, and a plurality of second electrode pads exposed on a bottom surface thereof, and the first electrode pads are electrically connected to the ...	05/10/2011
7932595	Electronic component package comprising fan-out traces A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t...	04/26/2011
7928558	Production of an electrical component and component An electrical component includes a base body made using ceramic, metallization surfaces that at least partly define component structures on the base body, a passivation layer that is electrically insulating and over a surface of the base body, solder contacts on the...	04/19/2011
7919851	Laminate substrate and semiconductor package utilizing the substrate A laminated substrate and the semiconductor package utilizing the substrate are revealed. The laminated substrate primarily comprises a core layer, a first metal layer and a first solder mask disposed on the bottom surface of the core layer, and a second metal layer...	04/05/2011
7911049	Electrically optimized and structurally protected via structure for high speed signals An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitanc...	03/22/2011
7906842	Wafer level system in package and fabrication method thereof There is provided a system-in-package (SiP), which includes a substrate obtained by cutting a wafer for each unit system; one or more first electronic devices mounted on the substrate by a heat radiation plate; a plurality of interlayer dielectrics sequentially form...	03/15/2011
7902662	Power core devices and methods of making thereof A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is po...	03/08/2011
7893528	Package structure of compound semiconductor device and fabricating method thereof A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating di...	02/22/2011
7888789	Transfer material used for producing a wiring substrate A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring patt...	02/15/2011
7884466	Semiconductor device with double-sided electrode structure and its manufacturing method According to the present invention, a recess portion is formed in a package substrate which is formed of a multilayer organic substrate having a multilayer wiring, and an LSI chip is accommodated within the recess portion. Wiring traces are formed on the upper surfa...	02/08/2011
7880296	Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon The present invention provides a chip carrier structure having a semiconductor chip embedded therein and a protective metal layer formed thereon and a fabrication method thereof. The chip carrier structure includes a chip-embedded carrier structure, and a metal laye...	02/01/2011
7880297	Semiconductor chip having conductive member for reducing localized voltage drop A semiconductor chip includes a die mounted on a packaging substrate. The die includes a semiconductor substrate; inter-metal dielectric layers on the semiconductor substrate; levels of metal interconnection, wherein at least two potential equivalent metal traces ar...	02/01/2011
7872347	Larger than die size wafer-level redistribution packaging process Methods, systems, and apparatuses for integrated circuit packages, and processes for forming the same, are provided. In one example, an integrated circuit (IC) package includes an integrated circuit die, a layer of insulating material, a redistribution interconnect ...	01/18/2011
7863729	Circuit board structure embedded with semiconductor chips A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow c...	01/04/2011
7863728	Semiconductor module including components in plastic casing A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package mo...	01/04/2011
7843057	Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parall...	11/30/2010
7838982	Semiconductor package having connecting bumps A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals containing a smaller amount of lead, while at the same time achievin...	11/23/2010
7821122	Method and system for increasing circuitry interconnection and component capacity in a multi-component package A method and system for fabricating a interconnect substrate for a multi-component package is disclosed. The multi-component package includes at least one die and a package substrate. The method and system include providing an insulating base and providing at least ...	10/26/2010
7800216	Multilayer printed wiring board An IC chip for a high frequency region, particularly, a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer is formed at a thickness of 30 μm on a core substrate and a conductive circuit on an interlayer resin in...	09/21/2010
7800217	Power semiconductor device connected in distinct layers of plastic A power semiconductor device and a method for its production. The power semiconductor device has at least one power semiconductor chip, which has on its top side and on its back side large-area electrodes. The electrodes are electrically in connection with external ...	09/21/2010
7795722	Substrate strip and substrate structure and method for manufacturing the same A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask. The core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top sur...	09/14/2010
7786569	Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection The semiconductor device concerning the present invention has a wiring substrate, a semiconductor chip, under-filling resin, a reinforcement ring, a heat spreader, a power supply pattern and a wiring layer under surface via land which are formed on the wiring substr...	08/31/2010
RE41511	Semiconductor device having a thin-film circuit element provided above an integrated circuit In a semiconductor device, re-wiring is provided on a circuit element formation region of a semiconductor substrate. A columnar electrode for connection with a circuit board is provided on the rewiring. A first insulating film is provided over the semiconductor subs...	08/17/2010
7777328	Substrate and multilayer circuit board A substrate includes a inorganic material base board has a recess and at least one penetration hole provided around the recess, and a semiconductor device accommodated in the recess and including at least one electrode pad provided on a surface of the semiconductor ...	08/17/2010
7763969	Structure with semiconductor chips embeded therein An embedded semiconductor chip structure and a method for fabricating the same are proposed. The structure comprises: a carrier board, therewith a plurality of through openings formed in the carrier board, and through trenches surrounding the through openings in the...	07/27/2010
7763968	Semiconductor device featuring large reinforcing elements in pad area In a semiconductor device, a plurality of interconnections are formed in an interconnection formation insulating interlayer, and a plurality of reinforcing elements are substantially evenly formed in blank areas of the interconnection insulating interlayer in which ...	07/27/2010
7759787	Packaging substrate having pattern-matched metal layers A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and comple...	07/20/2010
7759786	Electronic circuit chip, and electronic circuit device and method for manufacturing the same An insulating layer 12 is formed as a surface layer of electronic circuit chip 10. A conductor interconnect 14 is formed in the insulating layer 12. The conductor interconnect 14 is exposed in the surface of the insulating layer	07/20/2010
7750461	Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulati...	07/06/2010
7745924	Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wirin...	06/29/2010
7737547	Dummy buried contacts and vias for improving contact via resistance in a semiconductor device A semiconductor device includes a semiconductor substrate having a plurality of conductive layers. The device further includes buried contacts and buried vias, which connect the interconnect layers respectively. At least one of the contacts and vias are dummy contac...	06/15/2010
7728423	Semiconductor device having step-wise connection structures for thin film elements A plurality of IC regions are formed on a semiconductor wafer, which is cut into individual chips incorporating ICs, wherein wiring layers and insulating layers are sequentially formed on a silicon substrate. In order to reduce height differences between ICs and scr...	06/01/2010
7723838	Package structure having semiconductor device embedded within wiring board In a semiconductor device, via holes are formed around a chip buried in a package, one end of a conductor filled in the via hole is covered with a pad portion exposed to the outside, and a wiring layer connected to the other end of the conductor is formed. The porti...	05/25/2010
7723839	Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device A semiconductor device includes: a base substrate; a semiconductor chip formed on the base substrate in such a manner that an adhesive layer is interposed between the semiconductor chip and the base substrate; a resin layer covering at least a portion of the semicon...	05/25/2010
7719105	High speed electrical interconnects and method of manufacturing thereof A high speed electrical interconnection system is provided. The interconnection system comprises one or more electrical signal lines, or differential pairs of signal lines, and an inhomogeneous dielectric system. The dielectric system further comprises a homogeneous...	05/18/2010
7714431	Electronic component package comprising fan-out and fan-in traces A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t...	05/11/2010
7714430	Substrate with lossy material insert In one embodiment, the present invention includes a semiconductor package with lossy material inserts. The lossy material inserts may reduce electronic noise such as package resonance. Other embodiments are described and claimed. ...	05/11/2010
7705445	Semiconductor package with low and high-speed signal paths The semiconductor package includes two electrical contacts and a semiconductor device coupled to opposing sides of a substrate. The substrate defines at least one via extending at least partially there through. The semiconductor device includes a semiconductor low-s...	04/27/2010
7701051	Power semiconductor module A power semiconductor module (1) has power semiconductor components (2, 4, 6, 8, 10, 12) arranged on a substrate (14), at least one portion of which components is connected in parallel and arranged symmetrically on the substrate (14). A s...	04/20/2010

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Class 257/700 - Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)