Quotables
"To place a man in a multi-stage rocket and project him into the controlling gravitational field of the moon where the passengers can make scientific observations, perhaps land alive, and then return to earth--all that constitutes a wild dream worthy of Jules Verne. I am bold enough to say that such a man-made voyage will never occur regardless of all future advances."
Lee deForest, American radio pioneer ; 1957
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| Number | Title | Issue Date |
| 5016086 | IC card An IC card having a connection portion, a changeover switch and card-shaped memory means in which an integrated circuit is accommodated within a prescribed case and has a processor and memory. Lead portions for connecting contact pins of said connecting p... | 05/14/1991 |
| 5014114 | High speed, high density semiconductor memory package with chip level repairability A packaging structure mounts integrated circuit chips in a nested, cavity-up configuration, so as to permit access to the modules for reworkability, but without the use of a separate printed circuit board for support and interconnect among the modules. Ea... | 05/07/1991 |
| 5001829 | Method for connecting a leadless chip carrier to a substrate A Leadless Chip Carrier (LCC) is mounted on a circuit board on elongated solder posts to provide clearance between the LCC and the board. The process for producing solder posts involves the deposition of a temporary stencil surrounding the conductive pads... | 03/26/1991 |
| 4994902 | Semiconductor devices and electronic system incorporating them An electronic system having a first and a second semiconductor device acting as a microprocessor and a coprocessor, respectively, disposed linearly on a mounting board. The external pins common to both the first and the second semiconductor device are con... | 02/19/1991 |
| 4994895 | Hybrid integrated circuit package structure A hybrid integrated circuit including: a circuit substrate on which at least one of an active and passive semiconductor element is formed; a lead frame having a plurality of leads and a support plate with an opening formed therein, and supporting the circ... | 02/19/1991 |
| 4992851 | Characteristic impedance-correct chip carrier for microwave semiconductor components In a chip carrier for microwave components with an electrically conductive support and with a dielectric substrate, the electrical leads should be able to be impedance-matched in a simple manner. Such a chip carrier should be easy to insert in a microwave... | 02/12/1991 |
| 4984051 | Semiconductor device having directly connected source terminal The present invention relates to an improvement in an electrode structure of a semiconductor device having a MOSFET chip, wherein a source terminal is directly connected to a source electrode of the semiconductor device so that the source terminal overlap... | 01/08/1991 |
| 4972043 | Multi-lead hermetic power package with high packing density An hermetic package for power semiconductor devices is disclosed. The package includes a generally rectangular cavity with leads extending through the walls thereof. The bottom of the cavity is defined by a base which includes a pair of mounting tabs prot... | 11/20/1990 |
| 4965653 | Semiconductor device and method of mounting the semiconductor device The present invention discloses a suitable mounting of a wafer scale LSI (wafer scale integration) (WSI) in which a slit formed in a wafer is fit to a connector, a U-shaped reinforcing rubber member is disposed at the circumferential edge of the wafer, or... | 10/23/1990 |
| 4958200 | Overcurrent protection circuit for semiconductor device A semiconductor device in which at least a part of each of the current flow paths extending from the electrode pads of the semiconductor chip to the outer terminals of the semiconductor package is made of superconducting material. During operation, when a... | 09/18/1990 |
| 4951011 | Impedance matched plug-in package for high speed microwave integrated circuits A TO can-style plug-in package employs a pin/glass interface. In a first embodiment the pin/glass seal interface has a center pin of reduced diameter embedded in a smaller outer diameter, lower dielectric constant glass than a conventional TO-can. The gla... | 08/21/1990 |
| 4942456 | Plastic packaged device having a hollow portion enclosing a chip element A plastic packaged device comprises a chip element mounted on a supporting member, and covered by a hollow portion. The supporting member has a wall portion at least partially surrounding the chip element. As the hollow portion ends at the wall portion, s... | 07/17/1990 |
| 4933744 | Resin encapsulated electronic devices Resin encapsulated electronic devices are provided by encapsulating so-called flat-shaped, plate-like, or angular-shaped electronic devices with a resin composition containing rubber-like particles preferably having an average particle size of 150 μm or ... | 06/12/1990 |
| 4930857 | Hybrid package arrangement A package arrangement is disclosed which utilizes a multi-layer ceramic (MLC) component subassembly member which extends beyond the periphery of the package sidewalls. The MLC member constains a number of bondpad sites formed on its inner layers to provid... | 06/05/1990 |
| 4907061 | Electronic device The electronic device relating to the invention is that in which an electrode is formed on the rear side surface of a semiconductor element, a circuit wiring and an external electrode connected electrically to one end of the circuit wiring are formed on t... | 03/06/1990 |
| 4903114 | Resin-molded semiconductor A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are ... | 02/20/1990 |
| 4899209 | Resin sealed semiconductor device This invention provides a resin sealed IC regulator, which comprises a first connecting terminal electrically connected to a generator, a second connecting terminal electrically connected to a device other than the generator, a monolithic IC which control... | 02/06/1990 |
| 4899208 | Power distribution for full wafer package A full wafer packing technique for semiconductor devices is provided. The semiconductor wafer is mounted on a substrate wherein the coefficient of thermal expansion of the substrate is matched to that of the wafer. The wafer is also provided with at least... | 02/06/1990 |
| 4897708 | Semiconductor wafer array A wafer array comprising a plurality of wafers of semiconductor material are stacked one on top of another. Through holes are provided in the wafers and electrically conductive liquid is inserted in the through holes for interconnecting all of the wafers.... | 01/30/1990 |
| 4885629 | Semiconductor apparatus A semiconductor apparatus having a plurality of electrodes comprises two external terminals provided for each electrode for being coupled to an input signal.... | 12/05/1989 |
| 4868634 | IC-packaged device An IC-packaged device comprises a lower plate which has wiring patterns at least on an upper surface; an upper plate which has upper surface wiring patterns and at least an opening hole and are superimposed on the lower plate when used; and a plurality of... | 09/19/1989 |
| 4860445 | Method of mounting electrical contacts in connector body In a method of fixing an electrical contact into a connector body, said connector body having at least one relatively thin-walled portion including a plurality of transversely extending slots, each of said slots including oppositely disposed wings upstand... | 08/29/1989 |
| 4852250 | Hermetically sealed package having an electronic component and method of making Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which ... | 08/01/1989 |
| 4805006 | Light receiving element A light receiving element is formed by a plurality of light receiving cells connected in series with one another and arranged for optical coupling to a light source, the cells having respectively a surface area varied depending on light input intensity fr... | 02/14/1989 |
| 4734749 | Semiconductor mesa contact with low parasitic capacitance and resistance Method of manufacturing silicon mesa diodes from a wafer of silicon. The surface of the wafer is coated with a first layer of silicon nitride and a second layer of silicon oxide. By masking and etching procedures, silicon nitride is left only on the porti... | 03/29/1988 |
| 4715115 | Package for water-scale semiconductor devices The invention is a method of packaging whole or large silicon wafers that provides support for the wafer, eliminates thermally or package-induced wafer strain, and allows selection of a mounting substrate material that provides optimal heat conduction.... | 12/29/1987 |
| 4713730 | Microwave plug-in signal amplifying module solderment apparatus A drop-in module in an RF frequency amplifier circuit is illustrated having space feedback between the gate and drain terminals, and having a unique mounting technique for electrically connecting the source terminals to the ground plane on the opposite si... | 12/15/1987 |
| 4685998 | Process of forming integrated circuits with contact pads in a standard array An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads,... | 08/11/1987 |
| 4510677 | Cases with flat terminal lugs for medium power semi-conductor components and a process for manufacturing same A case, manufactured and possibly stored in a semi-finished condition, comprising connecting lugs disposed flat after being sealed in a block of plastic material. Only then are the lugs cut out and bored if necessary, to a chosen shape and then, if need b... | 04/16/1985 |
| 4275410 | Three-dimensionally structured microelectronic device A large scale parallel architecture in which many parallel channels numbering 102 or more operate simultaneously to create a natural and efficient organization for processing two-dimensional arrays of data. The architecture comprises a pluralit... | 06/23/1981 |
| 3996659 | Bonding method for semiconductor device manufacture An improved method of semiconductor device manufacture is provided in which the surfaces of glass sealed feed-through terminals are mechanically abraded to a uniform matte finish prior to plating and subsequent assembly. The mechanical abrasion, which in ... | 12/14/1976 |
