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| Number | Title | Issue Date |
| 7164201 | Semiconductor module with scalable construction A power semiconductor module with a scalable construction, having a base plate or intended for direct mounting on a heat sink. The module has a framelike housing, a cover, terminal elements, extending to the outside of the housing for load contacts and auxiliary con... | 01/16/2007 |
| 7164196 | Semiconductor device A semiconductor device includes a base, a semiconductor element having a plurality of electrodes, a plurality of conductive lines connected to the electrodes of the semiconductor element, plating stubs attached to the conductive lines, and a plurality of wiring laye... | 01/16/2007 |
| 7163841 | Method of manufacturing circuit device To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, af... | 01/16/2007 |
| 7161236 | Bow control in an electronic package A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one or more dice, one or more dice mounted on the substrate and a moldin... | 01/09/2007 |
| 7160757 | Gap control between interposer and substrate in electronic assemblies Electronic assemblies and methods for forming assemblies are described. One embodiment includes a method of forming an electronic assembly, including forming a plurality of first solder bumps on one of a substrate and an interposer. The substrate and interposer are ... | 01/09/2007 |
| 7161235 | Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method therefore A drain electrode wiring conductor through which a main current of a MOS transistor takes the form of a flat board, being inserted into a first side of the frame of a case, and extends along the first side. The source electrode wiring conductor also takes the form o... | 01/09/2007 |
| 7157787 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices A method of vertically stacking wafers is provided to form three-dimensional (3D) wafer stack. Such method comprising: selectively depositing a plurality of metallic lines on opposing surfaces of adjacent wafers; bonding the adjacent wafers, via the metallic lines, ... | 01/02/2007 |
| 7159203 | Differential delay-line A printed circuit board is built including metal traces for a differential clock. Within a break in each metal trace pads for a delay line socket are included along with pads for two 0-ohm resistors in series. In between the two 0-ohm resistors metal traces are buil... | 01/02/2007 |
| 7157646 | Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g... | 01/02/2007 |
| 7157647 | Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same A circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open se... | 01/02/2007 |
| 7157742 | Integrated circuit device An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mec... | 01/02/2007 |
| 7154155 | Wing-shaped surface mount package for light emitting diodes A surface mounted LED package includes a pair of metal contact plates, an LED mounted to one (or both) metal contact plates, and glue encapsulating the LED and holding the LED and both metal contact plates together to form a LED package to be soldered to a motherboa... | 12/26/2006 |
| 7154172 | Integrated circuit carrier An integrated circuit carrier is claimed comprising at least one receiving zone for an integrated circuit. A plurality of island-defining portions, having electrical terminals, is arranged about each of the receiving zones. Rigidity-reducing arrangements are dispose... | 12/26/2006 |
| 7154186 | Multi-flip chip on lead frame on over molded IC package and method of assembly A multichip module package uses bond wire with plastic resin on one side of a lead frame to package an integrated circuit and flip chip techniques to attach one or more mosfets to the other side of the lead frame. The assembled multichip module 30 has an inte... | 12/26/2006 |
| 7154187 | Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device A semiconductor chip is provided comprising a semiconductor substrate on which an integrated circuit is formed. The semiconductor chip, which is provided on the semiconductor substrate in an area array, further comprises a plurality of electrodes electrically couple... | 12/26/2006 |
| 7151306 | Electronic part, and electronic part mounting element and an process for manufacturing such the articles A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 thr... | 12/19/2006 |
| 7146722 | Method of forming a bond pad structure A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, a... | 12/12/2006 |
| 7147977 | Method for fabricating semiconductor device and method for fabricating semiconductor substrate used in the semiconductor device A wafer is held on a pin chuck, and thereafter a design pattern is transferred to the principal surface of the wafer by exposing an exposure light, which passes through a mask having the design pattern, onto the principal surface of the held wafer. The underlying su... | 12/12/2006 |
| 7145223 | Semiconductor device The semiconductor device of this invention includes a first die pad down-set away from boundary portions between inner lead portions and outer lead portions; a first semiconductor chip mounted on the first die pad; a chip-shaped electronic component with a small thi... | 12/05/2006 |
| 7145226 | Scalable microelectronic package using conductive risers This invention relates to an apparatus and methods for increasing the microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package scalability without stressing the carrier substrates and without limiti... | 12/05/2006 |
| 7145224 | Semiconductor device In the semiconductor device, a control power MOSFET chip 2 is disposed on the input-side plate-like lead 5, and the drain terminal DT1 is formed on the rear surface of the chip 2, and the source terminal ST1 and gate terminal GT... | 12/05/2006 |
| 7141868 | Flash preventing substrate and method for fabricating the same A flash preventing substrate and a method for fabricating the same are proposed. A core defined with a plurality of substrate units is prepared. A circuit patterning process is performed to form circuit structures on the core corresponding to the substrate units, pl... | 11/28/2006 |
| 7138706 | Semiconductor device and method for manufacturing the same A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includ... | 11/21/2006 |
| 7135771 | Self alignment features for an electronic assembly Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the substrate and a group of mating bumps on the other of the die and the... | 11/14/2006 |
| 7135770 | Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of suc... | 11/14/2006 |
| 7135763 | Technique for attaching die to leads A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconduct... | 11/14/2006 |
| 7132741 | Semiconductor chip assembly with carved bumped terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an enca... | 11/07/2006 |
| 7132752 | Semiconductor chip and semiconductor device including lamination of semiconductor chips To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side composing the main surface; a second side opposed to the first side; a mai... | 11/07/2006 |
| 7129575 | Semiconductor chip assembly with bumped metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an enca... | 10/31/2006 |
| 7129724 | Plasma probe A plasma probe includes a substrate having substantially the same properties as those of a substrate to be processed, a bottom electrode layer located over the substrate and electrically isolated therefrom, a dielectric layer positioned over the bottom electrode lay... | 10/31/2006 |
| 7129113 | Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 10/31/2006 |
| 7129566 | Scribe street structure for backend interconnect semiconductor wafer integration A method of making a semiconductor device includes forming a wafer having a substrate and an interconnect structure over the substrate. The wafer also includes a plurality of die areas and a street located between a first die area of the plurality and a second die a... | 10/31/2006 |
| 7129573 | System having semiconductor component with encapsulated, bonded, interconnect contacts A semiconductor component includes a die having a pattern of die contacts, and interconnect contacts bonded to the die contacts and encapsulated in an insulating layer. The component also includes terminal contacts formed on tip portions of the interconnect contacts... | 10/31/2006 |
| 7129587 | Semiconductor device, semiconductor package for use therein, and manufacturing method thereof A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the subst... | 10/31/2006 |
| 7126230 | Semiconductor electronic device and method of manufacturing thereof A semiconductor electronic device is described comprising a die of semiconductor material having a plurality of contact pads electrically connected to a support for example through interposition of contact wires, said plurality of contact pads comprising signal pads... | 10/24/2006 |
| 7127269 | Front-end module for multi-band and multi-mode wireless network system A front-end module for multi-band and multi-mode wireless network system is disclosed. The front-end module includes a diversity switch, two channel-separating devices, a plurality of band pass filters, a plurality of baluns, and a plurality of low pass filters. The... | 10/24/2006 |
| 7126195 | Method for forming a metallization layer A method for forming a metallization layer (30). A first layer (14) is formed outwardly from a semiconductor substrate (10). Contact vias (16) are formed through the first layer (14) to the semiconductor substrate (10). A se... | 10/24/2006 |
| 7125751 | Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions Disclosed is a semiconductor device which comprises a semiconductor element having a plurality of electrodes, a plurality of external electrodes disposed around the periphery of the semiconductor element, a fine wire electrically connected between at least one of su... | 10/24/2006 |
| 7126213 | Rectification chip terminal structure A rectification chip terminal structure for soldering a rectification chip on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conducti... | 10/24/2006 |
| 7125748 | Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask A solder mask includes an opening through which intermediate conductive elements may be positioned to connect bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured with corresponding contact ar... | 10/24/2006 |
