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| Number | Title | Issue Date |
| 8183681 | Semiconductor device A semiconductor device which includes a semiconductor chip; an electrically conductive base electrode bonded to the lower surface of the chip by a first bonding member; an electrically conductive lead electrode bonded to the upper surface of the chip by a second bon... | 05/22/2012 |
| 8164173 | Panel, semiconductor device and method for the production thereof A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side... | 04/24/2012 |
| 8089144 | Semiconductor device and method for manufacturing the same A semiconductor device includes: a sensor including a sensor structure on a first side of the sensor and a periphery element surrounding the sensor structure; and a cap covering the sensor structure and having a second side bonded to the first side of the sensor. Th... | 01/03/2012 |
| 8076769 | Semiconductor device and manufacturing method of semiconductor device A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member... | 12/13/2011 |
| 8058719 | Integrated circuit with flexible planer leads A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress allow direct mounting of the device to a member, and withstand extreme thermal cycli... | 11/15/2011 |
| 8030749 | Semiconductor device A semiconductor device includes a resin case, a plurality of external connection terminals fixedly provided on the resin case, and at least one semiconductor element provided in the resin case. At least one terminal block has at least one wiring terminal for electri... | 10/04/2011 |
| 8022529 | Semiconductor device and method for manufacturing the same A semiconductor device having a through electrode excellent in performance as for an electrode and manufacturing stability is provided. There is provided a through electrode composed of a conductive small diameter plug and a conductive large diameter plug on a semic... | 09/20/2011 |
| 8018042 | Integrated circuit with flexible planar leads A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress, allowing direct mounting of the device to a member and able withstand extreme therm... | 09/13/2011 |
| 7843055 | Semiconductor device having an adhesion promoting layer and method for producing it A semiconductor device and a method for producing it is disclosed. In one embodiment, an adhesion-promoting layer having nanoparticles is arranged between a circuit carrier and a plastic housing composition for the purpose of enhanced adhesion. ... | 11/30/2010 |
| 7816777 | Semiconductor-element mounting substrate, semiconductor device, and electronic equipment A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductor... | 10/19/2010 |
| 7816778 | Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same A device is disclosed which includes a flexible material including at least one conductive wiring trace, a first die including at least an integrated circuit, the first die being positioned above a portion of the flexible material, and an encapsulant material that c... | 10/19/2010 |
| 7759784 | 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in ... | 07/20/2010 |
| 7750457 | Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus A semiconductor apparatus of the present invention includes: (i) a wire substrate having an insulating substrate in which a plurality of wire patterns are provided, (ii) a semiconductor element installed on the wire substrate with the insulating resin interposed the... | 07/06/2010 |
| 7692280 | Portable object connectable package A portable object connectable package for an electronic device comprises: semiconductor die package, having a top surface and an opposite bottom surface, and a connector body mechanically supported by the semiconductor die package. The bottom surface includes a plur... | 04/06/2010 |
| 7683471 | Display driver integrated circuit device, film, and module A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of outp... | 03/23/2010 |
| 7586185 | Semiconductor device having a functional surface A semiconductor device for fingerprint sensors reduces a mounting area of the semiconductor device and improves a processing capacity of assembling and testing process. The semiconductor device has a functional surface that provides a predetermined function. A semic... | 09/08/2009 |
| 7573130 | Crack trapping and arrest in thin film structures The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure sandwiched between said plates. ... | 08/11/2009 |
| 7541671 | Organic electronic devices having external barrier layer An organic device package includes a flexible substrate having a topside and a bottom side. Further, the organic device package includes an organic electronic device having a first side and a second side disposed on the topside of the flexible substrate. In addition... | 06/02/2009 |
| 7535092 | Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment An electronic device includes a pair of members which are connected to each other by a connecting portion layer interposed between connecting portions respectively formed thereon and which have thermal expansion coefficients different from each other. The connection... | 05/19/2009 |
| 7525187 | Apparatus and method for connecting components An apparatus for connecting at least two components contains a lower die and an upper die. The lower die has the components which are to be connected, with the first component supporting the at least second component with an at least partial overlap relative to the ... | 04/28/2009 |
| 7511368 | Carrier device for electronic chip A surface mount electronic chip (10) is mounted on a holder (70) and electrically connected to holder terminals (74,76, 80) by the use of a carrier device (30). The carrier device has clips (36) mounted on walls of the carrier fram... | 03/31/2009 |
| 7498669 | Semiconductor device A rectify element as a semiconductor device has a disk section, a first solder part, a buffer plate, a second solder part, a semiconductor chip, and a lead, and a sealing member with which the semiconductor chip is sealed. A cylindrical concave part is formed at one... | 03/03/2009 |
| 7476964 | High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing A semiconductor device is shown and described which includes a metal can that receives a semiconductor die in an interior thereof. The metal can has a recess formed on a top portion thereof. The recess provides rigidity to the top portion of the metal can which allo... | 01/13/2009 |
| 7443018 | Integrated circuit package system including ribbon bond interconnect An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on... | 10/28/2008 |
| 7413975 | Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment A first conductive layer is formed. An insulating layer is formed so that at least a part of the insulating layer is disposed on the first conductive layer. A second conductive layer is formed so that at least a part of the second conductive layer is disposed on the... | 08/19/2008 |
| 7408251 | Semiconductor packaging device comprising a semiconductor chip including a MOSFET A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing member, the semiconductor chip having a source electrode and a gate ... | 08/05/2008 |
| 7405470 | Adaptable electronic storage apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semicon... | 07/29/2008 |
| 7397066 | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/... | 07/08/2008 |
| 7371609 | Stacked module systems and methods The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical f... | 05/13/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7348664 | Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device A semiconductor device comprises a semiconductor die, first and second electrically-conductive leads and first and second thermal elements. The die comprises first and second surfaces. The first lead is held in contact with the first surface of the die by a compress... | 03/25/2008 |
| 7345368 | Semiconductor device and the manufacturing method for the same A semiconductor device has a semiconductor substrate having first and second surface, a first resin film formed on the first surface of the semiconductor substrate and a second resin film formed on the second surface of the semiconductor substrate. A projection elec... | 03/18/2008 |
| 7339118 | Printed wiring board and method for manufacturing the same In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive ... | 03/04/2008 |
| 7335970 | Semiconductor device having a chip-size package Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided i... | 02/26/2008 |
| 7335975 | Integrated circuit stacking system and method The present invention stacks packaged integrated circuits into modules that conserve PWB or other board surface area. The invention provides techniques and structures for aggregating chip scale-packaged integrated circuits (CSPs) or leaded packages with other CSPs o... | 02/26/2008 |
| 7327022 | Assembly, contact and coupling interconnection for optoelectronics A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active components. This platform provides optical coupling and chip-to-chip ... | 02/05/2008 |
| 7323358 | Method and system for sizing a load plate A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is adjusted to cause the load plate to provide a target load when installed... | 01/29/2008 |
| 7312520 | Interface module for connecting LSI packages, and LSI-incorporating apparatus An interface module for connecting LSI packages includes a connecting member which is to be mounted on an LSI package including an LSI chip and which includes lines to be electrically connected to the LSI package, an optoelectronic transducer which is mounted on the... | 12/25/2007 |
| 7310458 | Stacked module systems and methods The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be em... | 12/18/2007 |
| 7294919 | Device having a complaint element pressed between substrates A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a s... | 11/13/2007 |
