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| Number | Title | Issue Date |
| 8183680 | No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages are described. A die-up or die-down package includes an IC die, a die attach pad, a heat spreader cap coupled to the die attac... | 05/22/2012 |
| 8148808 | Partitioning of electronic packages Partitioning electronic sensor packages is provided. The electronic sensor package includes an electronic component, a sensor device, and electrical connections between the electronic component and the sensor device. A dam is written in the electronic sensor package... | 04/03/2012 |
| 8129834 | Integral metal structure with conductive post portions A plurality of FPGA dice is disposed upon a semiconductor substrate. In order to supply the immense power required by the plurality of FPGA dice, power is routed through the semiconductor substrate vertically from thick metal layers and large integral metal structur... | 03/06/2012 |
| 8120160 | Integrated circuit device including a bifunctional core material in a chamber A method is disclosed for forming a chamber in an electronic device, including the steps of preparing an outer surface on a solidified core material, the solidified core material in a depression formed in a substrate. The method further includes establishing a layer... | 02/21/2012 |
| 8110911 | Semiconductor chip package with post electrodes A first wiring pattern is formed on a surface of a first support plate; a semiconductor chip is disposed on the first wiring pattern; and electrode terminals of the semiconductor chip are electrically connected to the first wiring pattern at required positions. Post... | 02/07/2012 |
| 8106501 | Semiconductor die package including low stress configuration A semiconductor die package. The semiconductor die package comprises a semiconductor die and a molded clip structure comprising a clip structure and a first molding material covering at least a portion of the clip structure. The first molding material exposes an out... | 01/31/2012 |
| 8058718 | Package substrate embedded with semiconductor component A package substrate embedded with a semiconductor component includes a substrate, a semiconductor chip, a first dielectric layer, a first circuit layer and first conductive vias. The substrate is formed with an opening for allowing the semiconductor chip to be secur... | 11/15/2011 |
| 8053884 | Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it A power semiconductor module comprising a housing of a first plastic, at least one substrate carrier with a circuit constructed thereon and electric terminating elements extending therefrom. The housing includes attachment means for its permanent connection with the... | 11/08/2011 |
| 8026587 | Semiconductor package including top-surface terminals for mounting another semiconductor package A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die ... | 09/27/2011 |
| 8008767 | Semiconductor device The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of the... | 08/30/2011 |
| 8004075 | Semiconductor power module including epoxy resin coating Use of Pb-free solder has become essential due to the environmental problem. A power module is formed by soldering substrates with large areas. It is known that in Sn-3Ag-0.5Cu which hardly creeps and deforms with respect to large deformation followed by warpage of ... | 08/23/2011 |
| 7989944 | Method for embedding a component in a base A method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around ... | 08/02/2011 |
| 7973403 | Adhesive sheet for light-emitting diode device and light-emitting diode device [Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises... | 07/05/2011 |
| 7964954 | Integrated circuit having a semiconductor sensor device with embedded column-like spacers An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor region arranged in the interior of the housing. The sensor housing has an... | 06/21/2011 |
| 7956451 | Packages for encapsulated semiconductor devices and method of making same A semiconductor device package comprises a container having a base and side walls of an electrically insulating material. A semiconductor device chip is disposed on the base, and a lead frame extends through the side walls. At least one electrical conductor couples ... | 06/07/2011 |
| 7952184 | Distributed semiconductor device methods, apparatus, and systems Some embodiments include a device having a number of memory cells and associated circuitry for accessing the memory cells. The memory cells of the device may be formed in one or more memory cell dice. The associated circuitry of the device may also be formed in one ... | 05/31/2011 |
| 7928553 | Power electronic device An electronic device and method is disclosed. In one embodiment, a method includes providing an electrically insulating substrate. A first electrically conductive layer is applied over the electrically insulating substrate. A first semiconductor chip is placed over ... | 04/19/2011 |
| 7902653 | Semiconductor module A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal f... | 03/08/2011 |
| 7872343 | Dual laminate package structure with embedded elements An interconnect structure (i.e., an interposer) which is mounted and electrically connected to a bottom semiconductor package substrate either prior or subsequent to such bottom substrate being populate with one or more electronic components. Subsequently, a top sem... | 01/18/2011 |
| 7843054 | Chip package and manufacturing method thereof A chip package including a circuit substrate, a chip, a B-staged adhesive layer, a leadframe, a number of first bonding wires, a number of second bonding wires, and a number of third bonding wires. The chip is disposed on the circuit substrate. The B-staged adhesive... | 11/30/2010 |
| 7829996 | Film structure and electronic device housing utilizing the same An electronic device housing includes a substrate, a film structure, and a protective film. The film structure includes an adhesive film, a film stack, and a protective film. The adhesive film is deposited onto the substrate. The film stack is deposited onto the adh... | 11/09/2010 |
| 7763965 | Stress relief structures for silicon interposers An electronic device and method of making the device. The device includes: a carrier; a silicon interposer connected to a top surface of the carrier, the interposer having wires extending from a top surface of the interposer, through the interposer, to a bottom surf... | 07/27/2010 |
| 7750456 | Printed circuit board and method of manufacturing semiconductor package using the same Provided is a printed circuit board having a structure that can prevent the generation of cracks around a rectangular hole and a method of manufacturing a printed circuit board for a semiconductor package. The printed circuit board includes a base substrate in which... | 07/06/2010 |
| 7737544 | Sensor system having a substrate and a housing, and method for manufacturing a sensor system A sensor system having a substrate and a housing and a method for manufacturing a sensor system are provided, the housing essentially completely enclosing the substrate in a first substrate region, the housing in a second substrate region being provided at least par... | 06/15/2010 |
| 7732909 | Method for embedding a component in a base A method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around ... | 06/08/2010 |
| 7687899 | Dual laminate package structure with embedded elements An interconnect structure (i.e., an interposer) which is mounted and electrically connected to a bottom semiconductor package substrate either prior or subsequent to such bottom substrate being populate with one or more electronic components. Subsequently, a top sem... | 03/30/2010 |
| 7683470 | LED package A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The CO... | 03/23/2010 |
| 7675156 | Electrical component An electrical component, e.g., a press-in diode, is provided, which is suited for high currents and which ensures reverse-polarity protection. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. In t... | 03/09/2010 |
| 7671461 | Method and system for hermetically sealing packages for optics A system for hermetically sealing devices. The system includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also inc... | 03/02/2010 |
| 7667314 | Integrated circuit package system with mold lock subassembly An integrated circuit package system includes: providing a substrate; attaching an integrated circuit over the substrate; attaching an integrated circuit subassembly system having a perforated interposer over the substrate with the perforated interposer having a slo... | 02/23/2010 |
| 7656018 | Package for an electronic component and method for its production A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the... | 02/02/2010 |
| 7646088 | Adhesive sheet for light-emitting diode device and light-emitting diode device [Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises a ther... | 01/12/2010 |
| 7646089 | Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the firs... | 01/12/2010 |
| 7622801 | Thin planar semiconductor device A thin, planar semiconductor device having electrodes on both surfaces is disclosed. This semiconductor device is provided with an IC chip and a wiring layer having one side that is electrically connected to surface electrodes of the IC chip. On this surface of the ... | 11/24/2009 |
| 7514777 | Power semiconductor module A power semiconductor module of the present invention comprises: a heat sink 1; a circuit substrate 2 mounted on the heat sink 1; a conductive pattern 10 provided on the circuit substrate 2; a low dielectric constant film 11... | 04/07/2009 |
| 7495328 | Micromechanical component A micromechanical component has a structure such that a material flow is guided from at least one preferred direction for the purpose of uniformly enveloping the micromechanical component. ... | 02/24/2009 |
| 7489031 | High power radiation emitter device and heat dissipating package for electronic components The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at leas... | 02/10/2009 |
| 7482683 | Integrated circuit encapsulation system with vent An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mount... | 01/27/2009 |
| 7442653 | Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass An exemplary manufacturing method of an inter-metal dielectric of a semiconductor device according to an embodiment of the present invention includes forming a first silicon-rich oxide (SRO) layer on a silicon substrate provided with or otherwise having a copper lin... | 10/28/2008 |
| 7428255 | Semiconductor laser A semiconductor laser is constituted by a die pad and a plurality of leads formed by a plate-shaped lead frame that are integrally supported by a resin portion made of a mold resin, and a laser chip is mounted thereon through a sub-mount. The die pad and the tips of... | 09/23/2008 |
