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| Number | Title | Issue Date |
| 8183675 | Integrated circuit package-on-package system with anti-mold flash feature An integrated circuit package-on-package system includes: mounting an integrated circuit package system having a mountable substrate over a package substrate with the mountable substrate having a mold structure; forming a package encapsulation having a recess over t... | 05/22/2012 |
| 8174103 | Enhanced architectural interconnect options enabled with flipped die on a multi-chip package A particular chip is designed having a first variant (front side connected chip) of the chip and a second variant (back side connected chip). The first variant of the chip is attached to a carrier. The second variant of the chip is attached to the carrier inverted r... | 05/08/2012 |
| 8174104 | Semiconductor arrangement having specially fashioned bond wires A semiconductor arrangement includes first and second integrated circuits (dies), an electrically conductive intermediate element, and one or more bond conductors. The first and the second integrated circuits are arranged in a package. The first integrated circuit h... | 05/08/2012 |
| 8174105 | Stacked semiconductor package having discrete components A stacked semiconductor package includes a substrate and a plurality of semiconductor dice stacked on the substrate. Each semiconductor die includes a recess, and a discrete component contained in the recess encapsulated in a die attach polymer. The stacked semicond... | 05/08/2012 |
| 8138593 | Packaged microchip with spacer for mitigating electrical leakage between components A packaged microchip has a base, at least one spacer coupled to the base, and first and second microchips mounted to the at least one spacer. The at least one spacer is configured to substantially prevent leakage current between the first and second microchips. ... | 03/20/2012 |
| 8138592 | Planar array contact memory cards A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card ... | 03/20/2012 |
| 8106496 | Semiconductor packaging system with stacking and method of manufacturing thereof A semiconductor package comprises a semiconductor component (e.g., a die) and a via at least partially covered by an encapsulant. The encapsulant forms substantially parallel top and bottom surfaces, with at least part of the via being exposed on the top surface. At... | 01/31/2012 |
| 8049319 | Ultra wideband system-on-package This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the firs... | 11/01/2011 |
| 7989939 | Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package ... | 08/02/2011 |
| 7968989 | Multi-package slot array A multi-package module that includes a multi-layer interconnect structure, a housing structure attached to the multi-layer interconnect structure, and a plurality of integrated circuit packages inserted into slots in the housing structure, and placed into contact wi... | 06/28/2011 |
| 7968988 | Power semiconductor module having a thermally conductive base plate on which at least four substrates are arranged in at least one single row The power semiconductor module (1) has a heat-conducting base plate (11) on which at least three substrates (2, 3, 4, 5, 6, 7) are placed, each substrate supporting at least one power semiconductor component (8, 9) that gives off heat gen... | 06/28/2011 |
| 7964946 | Semiconductor package having discrete components and system containing the package A semiconductor package includes a substrate having contacts, and a discrete component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a... | 06/21/2011 |
| 7952180 | Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit An integrated circuit having an MCM structure, an interface circuit used in the integrated circuit, and an apparatus incorporating the integrated circuit are disclosed. The integrated circuit includes at least two semiconductor devices formed on a common substrate. ... | 05/31/2011 |
| 7911044 | RF module package for releasing stress The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer f... | 03/22/2011 |
| 7893525 | Semiconductor device having an adhesive portion with a stacked structure and method for manufacturing the same It is made possible to restrict warpage at the time of resin cure and achieve a smaller thickness. A semiconductor device includes: a first chip including a MEMS device and a first pad formed on an upper face of the MEMS device, the first pad being electrically conn... | 02/22/2011 |
| 7888784 | Substrate package with through holes for high speed I/O flex cable An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed throu... | 02/15/2011 |
| 7868438 | Multi-chip package for reducing parasitic load of pin Multi-chip package includes first through Nth semiconductor chips, each of which includes an input/output pad, an input/output driver coupled to the input/output pad, and an internal circuit. Each of the first through Nth semiconductor chips includes an internal pad... | 01/11/2011 |
| 7851898 | Multichip package or system-in package Disclosed is a multichip package or system-in package which the logic chip includes a selector circuit which, by transmitting a test mode select signal or a test mode select command to the logic chip, enables access from a logic signal pin connected to the logic chi... | 12/14/2010 |
| 7847383 | Multi-chip package for reducing parasitic load of pin A multi-chip package includes first through Nth semiconductor chips, each of which includes an input/output pad, an input/output driver coupled to the input/output pad, and an internal circuit. Each of the first through Nth semiconductor chips includes an internal p... | 12/07/2010 |
| 7812435 | Integrated circuit package-in-package system with side-by-side and offset stacking An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting ... | 10/12/2010 |
| 7808092 | Semiconductor device with a plurality of ground planes A multi-chip module (MCM) with a plurality of ground planes/layers is provided. Each integrated circuit (IC) chip of the MCM has its own ground plane on a substrate in the MCM. This MCM structure may facilitate separate testing of each IC chip without affecting othe... | 10/05/2010 |
| 7795716 | RF transistor output impedance technique for improved efficiency, output power, and bandwidth An RF/microwave circuit is configured to eliminate the physical constraint that requires a sacrifice of one output series inductor wirebond for each shunt inductor wirebond. The circuit employs a multi-level metalized substrate as part of its output impedance matchi... | 09/14/2010 |
| 7777319 | Three dimensional integrated circuits A three-dimensional semiconductor device, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits; and a third module laye... | 08/17/2010 |
| 7777320 | Quad flat pack in quad flat pack integrated circuit package system An integrated circuit package system includes: providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an inner encapsulation; mountin... | 08/17/2010 |
| 7772683 | Stacked integrated circuit package-in-package system A stacked integrated circuit package-in-package system is provided including forming a substrate having a top surface and a bottom surface, mounting a first device over the top surface, stacking a second device over the first device in an offset configuration, conne... | 08/10/2010 |
| 7759781 | LSI package provided with interface module A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal ... | 07/20/2010 |
| 7728418 | Semiconductor device and manufacturing method thereof A semiconductor device includes a plurality of chips comprising a plurality of first moisture-proof rings individually surrounding said plurality of chips, a second moisture-proof ring surrounding the entire plurality of chips, and a wire for connecting said plurali... | 06/01/2010 |
| 7723831 | Semiconductor package having die with recess and discrete component embedded within the recess A semiconductor package includes a substrate having contacts, and a discrete component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a... | 05/25/2010 |
| 7709941 | Resin-sealed semiconductor device and method of manufacturing the same A semiconductor pellet and chip components are provided on an insulating substrate, and are sealed with a molding resin that is molded by transfer molding. The chip components are positioned so as to surround the semiconductor pellet on all four sides. The lengthwis... | 05/04/2010 |
| 7696615 | Semiconductor device having pillar-shaped terminal A semiconductor device and a method of forming the same are provided. A semiconductor chip included in the semiconductor device includes a pillar-shaped terminal and a pad-shaped terminal in a terminal region. The pillar-shaped terminal is exposed at a first surface... | 04/13/2010 |
| 7687895 | Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also includes an electrically conducting layer, arranged on the at least two semicond... | 03/30/2010 |
| 7675150 | Electric circuit device and related manufacturing method An electric circuit device and related manufacturing method are disclosed as having a case incorporating therein a substrate on which electric circuit elements are mounted. A sealant is filled in the case to cover the electric circuit elements and the substrate and ... | 03/09/2010 |
| 7656015 | Packaging substrate having heat-dissipating structure Provided is a packaging substrate with a heat-dissipating structure, including a core layer with a first surface and an opposite second surface having a first metal layer and a second metal layer respectively. Portions of the first metal layer are exposed from a sec... | 02/02/2010 |
| 7642631 | Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer A packaged semiconductor chip comprising an integrated circuit chip including a low-k dielectric layer and a chip substrate, wherein an edge of the integrated circuit chip has a first edge portion and a second edge portion. At least part of the first edge portion be... | 01/05/2010 |
| 7612443 | Inter-chip communication The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips. ... | 11/03/2009 |
| 7608919 | Interconnect packaging systems The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips. ... | 10/27/2009 |
| 7598605 | Semiconductor device having capacitive insulation means and communication terminal using the device A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically insulates and isolates between the primary and secondary side circuits while... | 10/06/2009 |
| 7595550 | Flex-based circuit module A form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design that is disposed about the form. In a preferred embod... | 09/29/2009 |
| 7592689 | Semiconductor module comprising semiconductor chips and method for producing the same A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the semiconductor module including the active top side of the semiconductor chip(s) and a surface of the plastic housing ... | 09/22/2009 |
| 7579681 | Super high density module with integrated wafer level packages A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packa... | 08/25/2009 |
