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| Number | Title | Issue Date |
| 8174102 | Semiconductor device A semiconductor device including: a substrate formed with a concave portion at one surface thereof; and a first semiconductor chip provided in the concave portion of the substrate and is adhered to the substrate by an underfill in the concave portion, wherein the co... | 05/08/2012 |
| 8159057 | Semiconductor device and manufacturing method therefor The mounting height of a semiconductor device is reduced. A wiring substrate has an upper surface with multiple bonding leads formed therein and a lower surface with multiple lands formed therein. This wiring substrate is a multilayer wiring substrate and multiple w... | 04/17/2012 |
| 8138591 | Integrated circuit package system with stacked die An integrated circuit package system comprising forming a trace frame including: fabricating a sacrificial substrate; forming a first series of bonding pads along a length of the sacrificial substrate; forming a second series of the bonding pads along a width of the... | 03/20/2012 |
| 8129830 | Electronic component package and method of manufacturing the same, and electronic component device An electronic component package, includes a package substrate portion constructed by a silicon substrate in which a through hole is provided, an insulating layer formed on both surface sides of the silicon substrate and an inner surface of the through hole, and a th... | 03/06/2012 |
| 8125064 | Increased I/O semiconductor package and method of making same In accordance with the present invention, there is provided a semiconductor package and a fabrication method thereof. The semiconductor package is provided with a substrate made of metal, thereby improving efficiency of thermal emission from a semiconductor die moun... | 02/28/2012 |
| 8093699 | Circuit device with circuit board and semiconductor chip mounted thereon A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on ano... | 01/10/2012 |
| 8093700 | Packaging millimeter wave modules A module, which in one embodiment may be a packaged millimeter waver module, includes a semiconductor lid portion; a packaging portion attached to the lid portion, wherein the packaging portion comprises a plurality of vias, a carrier portion, wherein a first semico... | 01/10/2012 |
| 8084850 | Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages According to an example embodiment, a semiconductor chip package includes a substrate comprising a substrate body having a first main surface, a second main surface, and a cavity that defines an opening in the first main surface, and a layer of electrically conducti... | 12/27/2011 |
| 8039941 | Circuit board, lead frame, semiconductor device, and method for fabricating the same A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first si... | 10/18/2011 |
| 7994618 | Sensor module and method for manufacturing same A sensor module has a carrier substrate having a bottom side and a top side, a sensor chip arranged on the top side of the carrier substrate and having a pressure-sensitive active area, a signal-processing chip arranged on the top side of the carrier substrate next ... | 08/09/2011 |
| 7973399 | Embedded chip package An embedded chip package includes a substrate, a semiconductor structure, an encapsulating material layer and a plurality of conductive vias. Herein the substrate includes at least a dielectric layer and at least a patterned circuit layer disposed on the dielectric ... | 07/05/2011 |
| 7973398 | Embedded chip package structure with chip support protruding section An embedded chip package structure is proposed. The embedded chip package structure includes a supporting board with a protruding section, a semiconductor chip formed on the protruding section of the supporting board, a dielectric layer formed on the supporting boar... | 07/05/2011 |
| 7960820 | Semiconductor package A semiconductor package in which an electronic device chip is provided in a cavity of a silicon substrate stacked product constituted by stacking a plurality of silicon substrates. ... | 06/14/2011 |
| 7960821 | Dummy vias for damascene process An integrated circuit device and method of making the integrated circuit device are disclosed. An exemplary apparatus includes: a semiconductor layer; and a dielectric layer on the semiconductor layer, the dielectric layer having conductive vias and dummy vias forme... | 06/14/2011 |
| 7956448 | Stacked structures and methods of fabricating stacked structures A stacked structure includes a first substrate bonded to a second substrate such that a first pad structure of the first substrate contacts a second pad structure of the second substrate. A transistor gate is formed over the second substrate, and a first conductive ... | 06/07/2011 |
| 7932589 | Semiconductor device and method for manufacturing the same A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric ... | 04/26/2011 |
| 7928548 | Silicon heat spreader mounted in-plane with a heat source and method therefor A heat spreader attached to a heat source that includes a semiconductor chip includes a silicon structure that provides a plurality of heat flux paths, including a lateral, in-plane heat flux path. The heat spreader is mounted in-plane with the heat source. ... | 04/19/2011 |
| 7898071 | Apparatus and method for housing micromechanical systems An apparatus for housing a micromechanical system includes a substrate with a surface on which the micromechanical system is formed, a transparent cover and a dry film layer arrangement between the surface of the substrate and the transparent cover. The dry film lay... | 03/01/2011 |
| 7863719 | Wafer level chip scale package A semiconductor device of the invention includes a semiconductor substrate having a first insulating section formed on one surface thereof. A first conductive section is disposed on the one surface of the semiconductor substrate. A second insulating section is super... | 01/04/2011 |
| 7859091 | Manufacturing methods for semiconductor device with sealed cap A semiconductor device includes: a first substrate made of semiconductor and having first regions, which are insulated from each other and disposed in the first substrate; and a second substrate having electric conductivity and having second regions and insulation t... | 12/28/2010 |
| 7847382 | Integrated circuit packaging system with package stacking and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed; forming a hole through the encapsulation with the hole not exposing the integra... | 12/07/2010 |
| 7838976 | Semiconductor device having a semiconductor chip enclosed by a body structure and a base In inlets used for ID tags and the like, a defective connection between an integrated circuit part and an antenna is suppressed by improvement of tolerance for a bending or a pressing pressure. The integrated circuit part includes a semiconductor chip and a multilay... | 11/23/2010 |
| 7834438 | Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device According to a sealed structure 60 constituted by anodically bonding a silicon board 20 and a glass plate 40, an upper opening of a recessed portion 22 is sealed in an airtight state by the glass plate 40 by bonding an upper face o... | 11/16/2010 |
| 7834439 | Semiconductor module and method of manufacturing the same A semiconductor module preferably includes a semiconductor package and a printed circuit board (PCB). The semiconductor package can include an outer terminal. The PCB can include a terminal land that is electrically connected to the outer terminal. The PCB preferabl... | 11/16/2010 |
| 7812434 | Wafer level package with die receiving through-hole and method of the same The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer f... | 10/12/2010 |
| 7800210 | Semiconductor device It is an aspect of the embodiments discussed herein to provide a semiconductor device including: a substrate; a base on the substrate; an integrated circuit chip on the base; and a ball grid array type package material made of a resin and encapsulating the integrate... | 09/21/2010 |
| 7772682 | Moisture protection metal enclosure The present invention provides a substantially hermetically sealed enclosure about an active device area of a semiconductor substrate. The enclosure is created by forming a guard ring around the active device area on the substrate, and forming a metal panel over and... | 08/10/2010 |
| 7608918 | Semiconductor device A semiconductor device is provided which comprises a heat-radiative support plate 5; and first and second semiconductor elements 1 and 2 mounted and layered on support plate 5 for alternate switching of first and second semiconductor elem... | 10/27/2009 |
| 7598604 | Low profile semiconductor package A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor element are stacked to expose each electrode pad and bonded while faci... | 10/06/2009 |
| 7586181 | Semiconductor device and method for manufacturing A semiconductor device and method has trenches for raising reliability. An electrode pad, with a protective film and an interlayer film which form an opening on top, are on a substrate. A rewiring pattern in contact with the electrode pad at this opening is on top o... | 09/08/2009 |
| 7579680 | Packaging system for semiconductor devices A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that has pre-formed gull-wing leads only on the source/gate side of the chi... | 08/25/2009 |
| 7535089 | Monolithically integrated light emitting devices Methods and structures for monolithically integrating monocrystalline silicon and monocrystalline non-silicon materials and devices are provided. In one structure, a monolithically integrated semiconductor device structure comprises a silicon substrate and a first m... | 05/19/2009 |
| 7508057 | Electronic component device An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post connected to the through electrode is provided upright on an upper side o... | 03/24/2009 |
| 7466019 | Rectangular semi-conducting support for microelectronics and method for making same The semi-conducting support comprises a graphite substrate having a front surface and a rear surface and at least a first stack arranged on the front surface of the substrate. The first stack successively comprises a single-crystal diamond layer, an electrically ins... | 12/16/2008 |
| 7443681 | Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a thermal conductive supporter for dissipating heat generated by a signal t... | 10/28/2008 |
| 7443016 | Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is f... | 10/28/2008 |
| 7432533 | Encapsulation of electronic devices with shaped spacers An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles comprise a base and an u... | 10/07/2008 |
| 7432593 | Semiconductor package assembly and method for electrically isolating modules A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394. ... | 10/07/2008 |
| 7429501 | Lid and method of employing a lid on an integrated circuit A lid having a plurality of recesses at the edges of the lid to provide an improved adhesive bond between the lid and a substrate of an integrated circuit is disclosed. The plurality of recesses may be a castellation comprising a collection of semi-circular cuts int... | 09/30/2008 |
| 7414663 | Imaging element, imaging device, camera module and camera system The method for manufacturing a camera module of the present invention includes forming a bump on each electrode portion of an imaging element. Next, a through hole is formed in a substrate. The imaging element is then mounted on a first side of the substrate having ... | 08/19/2008 |
