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Pet Toilet-Like Water Disk and Food Storage
One pet-friendly inventor patented "a device for watering pets, e.g., a dog or cat." The device, he helpfully noted, "has the general shape of a toilet."
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| Number | Title | Issue Date |
| 8164170 | Devices with faraday cages and internal flexibility sipes A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber formin... | 04/24/2012 |
| 8120155 | Reduced stiction and mechanical memory in MEMS devices A MEMS device is packaged in a process which hydrogen (H) deuterium (D) for reduced stiction. H is exchanged with D by exposing the MEMS device with a deuterium source, such as deuterium gas or heavy water vapor, optionally with the assistance of a direct or downstr... | 02/21/2012 |
| 8093698 | Gettering/stop layer for prevention of reduction of insulating oxide in metal-insulator-metal device An electronic device includes a first electrode, a second electrode and an insulating layer between the first and second electrodes, which insulating layer may be susceptible to reduction by H2. A gettering layer is provided on and in contact with the fir... | 01/10/2012 |
| 8039940 | Semiconductor storage device, semiconductor device, and manufacturing method therefor According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a package so that a Schottky barrier is formed on the bottom surface. ... | 10/18/2011 |
| 8035209 | Micromechanical device which has cavities having different internal atmospheric pressures A micromechanical device having a substrate wafer has at least one first cavity and one second cavity, the cavities being hermetically separated from each other, the first cavity having a different internal atmospheric pressure than the second cavity. The cavities a... | 10/11/2011 |
| 7968987 | Carbon dioxide gettering for a chip module assembly A chip module assembly includes a CO2 getter exposed through a gas-permeable membrane to a chip cavity of a chip module. One or more chips is/are enclosed within the cavity. The CO2 getter comprises a liquid composition including 1,8-diaza-bicy... | 06/28/2011 |
| 7936056 | Airtight package comprising a pressure adjustment unit An airtight sealed package with a device sealed therein in an airtight manner under vacuum, the device being placed in a space defined in the airtight sealed package by a lid and a substrate, includes at least one pressure adjustment unit provided on at least one of... | 05/03/2011 |
| 7808091 | Wafer structure with discrete gettering material The specification teaches a system for manufacturing microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In an embodiment, a system for manufacturi... | 10/05/2010 |
| 7804164 | Subminiature electronic device having hermetic cavity and method of manufacturing the same The invention discloses a subminiature electronic device with a hermetic cavity and method of manufacturing the same. It particularly relates to a chip type or chip scale packaged electronic device produced in substrate level. Firstly, a sacrificial layer is coated ... | 09/28/2010 |
| 7800209 | Wiring board with conductive wirings and protrusion electrodes A wiring board includes a film base, a plurality of conductive wirings aligned on the film base, and protrusion electrodes formed of a plated metal in the vicinity of end portions of the conductive wirings, respectively. An outer surface at both side portions of the... | 09/21/2010 |
| 7786561 | Encapsulated microcomponent equipped with at least one getter The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1... | 08/31/2010 |
| 7777318 | Wafer level packaging integrated hydrogen getter A wafer-level package that employs one or more integrated hydrogen getters within the wafer-level package on a substrate wafer or a cover wafer. The hydrogen getters are provided between and among the integrated circuits on the substrate wafer or the cover wafer, an... | 08/17/2010 |
| 7763962 | Wafer-level packaging of micro devices An encapsulated device includes a micro device on a substrate, a cover bonded to the substrate thereby forming a chamber to encapsulate the micro device, and a desiccant material on the cover and in the chamber. An anti-stiction material is absorbed in the desiccant... | 07/27/2010 |
| 7566957 | Support device with discrete getter material microelectronic devices The specification teaches a system for manufacturing microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In an embodiment, a system for manufacturi... | 07/28/2009 |
| 7443017 | Package having bond-sealed underbump A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a stand... | 10/28/2008 |
| 7427806 | Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated... | 09/23/2008 |
| 7417307 | System and method for direct-bonding of substrates A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient ... | 08/26/2008 |
| 7408225 | Apparatus and method for forming thin film using upstream and downstream exhaust mechanisms A thin-film formation apparatus possesses a reaction chamber to be evacuated, a placing portion on which a substrate is placed inside the reaction chamber, a gas-dispersion guide installed over the placing portion for supplying a gas onto a substrate surface, a gas-... | 08/05/2008 |
| 7402905 | Methods of fabrication of wafer-level vacuum packaged devices An hermetic, gas filled or vacuum package device and method of making a vacuum package device. The device includes a device layer having one or more Micro Electro-Mechanical Systems (MEMS) devices. The device layer includes one or more electrical leads coupled to th... | 07/22/2008 |
| 7377961 | Hydrogen vent for optoelectronic packages with resistive thermal device (RTD) Thermally tuned lasers may use a resistive thermal device (RTD), sensitive to hydrogen, within a hermetic enclosure. Over time, hydrogen trapped within the enclosure or out gassed from other components within the enclosure may degrade the accuracy of the RTD. A vent... | 05/27/2008 |
| 7362493 | Micromirror and post arrangements on substrates A micromirror of a micromirror array of a spatial light modulator used in display systems comprises a mirror plate attached to a hinge that is supported by two posts formed on a substrate. Also the mirror plate is operable to rotate along a rotation axis that is par... | 04/22/2008 |
| 7332797 | Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold The specification discloses an apparatus comprising a die mounted on a substrate, the die being connected to the substrate by a plurality of wires, and a mold cap encapsulating the die and the plurality of wires, the mold cap comprising an electrically insulating po... | 02/19/2008 |
| 7327019 | Semiconductor device of a charge storage type According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a package so that a Schottky barrier is formed on the bottom surface. ... | 02/05/2008 |
| 7311007 | Pressure sensor The invention provides a pressure sensor with a housing for a pressure sensing arrangement, e.g. a semi-conductor arrangement. The housing consists of a bottom part and an intermediate member with a through hole forming a sidewall of a cavity for the pressure sensin... | 12/25/2007 |
| 7309865 | Electronic device having infrared sensing elements An electronic device according to the present invention includes: a cavity, which is surrounded with a cavity wall portion and which has a reduced pressure; a gettering thin film, which is arranged in the cavity and has the function of adsorbing a surrounding substa... | 12/18/2007 |
| 7286764 | Reconfigurable modulator-based optical add-and-drop multiplexer An optical add and drop multiplexer system comprising a first module for providing a first signal; a second module for providing a second signal; and a modulator for receiving a channel of the first signal at a first location, the first location configured to actuat... | 10/23/2007 |
| 7259505 | OLED display with circular polarizer A top-emitting OLED display that includes a substrate; an array of OLED light emissive elements formed over the substrate; an encapsulating cover located over the OLED light emissive elements; and a circular light polarizer located between the encapsulating cover an... | 08/21/2007 |
| 7229669 | Thin-film deposition methods and apparatuses Described are structures useful in microelectronic or MEMS devices such as atomic clocks, sensors, and RF switches, wherein a first material is deposited onto a substrate to define a first material area of coverage and a second material is deposited over the first m... | 06/12/2007 |
| 7221495 | Thin film precursor stack for MEMS manufacturing This invention provides a precursor film stack for use in the production of MEMS devices. The precursor film stack comprises a carrier substrate, a first layer formed on the carrier substrate, a second layer of an insulator material formed on the first layer, and a ... | 05/22/2007 |
| 7215015 | Imaging system A semiconductor package includes a substrate, and a semiconductor die flip chip mounted to the substrate. The package also includes substrate circuitry on a circuit side of the substrate, die circuitry on a back side of the die, terminal contacts on the die circuitr... | 05/08/2007 |
| 7202549 | Semiconductor device having thin film resistor protected from oxidation A semiconductor device, a method for manufacturing the semiconductor device, and an integrated circuit including the semiconductor device are disclosed. The semiconductor device includes a substrate section, a resistor formed on the substrate section, a metal patter... | 04/10/2007 |
| 7196405 | Silicon package with integral heater A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. A metallic layer of platinum or gold is bonded to an internal surface of the hermetically sea... | 03/27/2007 |
| 7196406 | ESD protection apparatus for an electrical device An ESD protection apparatus for an electrical device with a circuit structure having an internal terminal, which is connected to an external terminal of the electrical device via a conductive connection, has a gas-filled cavity, through which the conductive connecti... | 03/27/2007 |
| 7183637 | Microelectronic mechanical system and methods The current invention provides for encapsulated release structures, intermediates thereof and methods for their fabrication. The multi-layer structure has a capping layer, that preferably comprises silicon oxide and/or silicon nitride, and which is formed over an et... | 02/27/2007 |
| 7180163 | Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices The specification teaches a device for use in the manufacturing of microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In a preferred embodiment th... | 02/20/2007 |
| 7177081 | High contrast grating light valve type device A grating light valve has with a plurality of spaced reflective ribbons are spatially arranged over a substrate with reflective surfaces. The grating light valve is configured to optimized the conditions for constructive and destructive interference with an incident... | 02/13/2007 |
| 7170155 | MEMS RF switch module including a vertical via An apparatus and method to provide a micro-electromechanical systems (MEMS) radio frequency (RF) switch module with a vertical via. The MEMS RF switch module includes a MEMS die coupled to a cap section. The vertical via passes through the cap section to electricall... | 01/30/2007 |
| 7167297 | Micromirror array In order to minimize light diffraction along the direction of switching and more particularly light diffraction into the acceptance cone of the collection optics, in the present invention, micromirrors are provided which are not rectangular. Also, in order to minimi... | 01/23/2007 |
| 7164520 | Packaging for an interferometric modulator A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modul... | 01/16/2007 |
| 7161094 | Modifying the electro-mechanical behavior of devices A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanica... | 01/09/2007 |
