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| Number | Title | Issue Date |
| 8138590 | Integrated circuit package system with wire-in-film encapsulation An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; preforming a wire-in-film encapsulation having a cavity; pressing the wire-in-film encapsulation over the carrier and the integrated circuit with the cav... | 03/20/2012 |
| 8129829 | Package substrate having embedded photosensitive semiconductor chip and fabrication method thereof A packaging substrate with an embedded photosensitive semiconductor chip and a method for fabricating the same are provided. The method includes the steps of: disposing the semiconductor chip in an through cavity of a core board with the photosensitive portion of th... | 03/06/2012 |
| 8102039 | Semiconductor device and manufacturing method thereof This invention is directed to offer a package type semiconductor device that can realize a smaller size device and its manufacturing method as well as a small stacked layer type semiconductor device and its manufacturing method. A device component 1 and a pad... | 01/24/2012 |
| 8049318 | Semiconductor light emitting device The semiconductor device includes a support substrate 101 on which a semiconductor element 105 to be mounted, a covering member 102 disposed to the support substrate via a bonding member, and a space 107 is defined between the covering me... | 11/01/2011 |
| 8039939 | Embedded wiring board, semiconductor package including the same and method of fabricating the same Provided are an embedded wiring board and a method of manufacturing the same. The embedded wiring board includes: a printed circuit board (PCB) including a first surface and a second surface, the first surface having a concave portion; through electrodes penetrating... | 10/18/2011 |
| 8035208 | Integrated circuit package Package for an integrated circuit (IC), includes a housing (3) of a first material having two major surfaces (4, 5). The major surfaces are substantially parallel to each other. Furthermore, a lead frame (6) is present for carrying the IC (2 | 10/11/2011 |
| 8008762 | Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semi... | 08/30/2011 |
| 7989938 | Semiconductor device for fingerprint recognition A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reli... | 08/02/2011 |
| 7989937 | Package structure and manufacturing method thereof A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a chip and a packing material layer. The substrate has a top surface and a lateral surface. The top surface is connected with the lateral surface. The ch... | 08/02/2011 |
| 7973397 | Package substrate having embedded semiconductor chip and fabrication method thereof A packaging substrate having a semiconductor chip embedded and a fabrication method thereof are provided. The method includes forming a semiconductor chip in a through cavity of a core board and exposing a photosensitive portion of the semiconductor chip from the th... | 07/05/2011 |
| 7968986 | Lid structure for microdevice and method of manufacture A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared transmitting, hermetic lid for a microdevice. The lid may be manufactured by first forming small, subwavelen... | 06/28/2011 |
| 7964945 | Glass cap molding package, manufacturing method thereof and camera module A glass cap molding package includes a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; an... | 06/21/2011 |
| 7928547 | Optical semiconductor device An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the pack... | 04/19/2011 |
| 7915722 | Information sensing device with electroconductive structure and molded body surrounding each other An information sensing device includes a substrate, one information sensing chip, one electroconductive structure and a molded body. An electrical output portion including output connections is formed on the substrate. The information sensing chip is electrically co... | 03/29/2011 |
| 7898069 | Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate A semiconductor system having a substrate (101) including a rigid insulating interposer (110) with a high modulus and a top (140) and a bottom (150) low-modulus tape with flip-attached semiconductor chips (120, 130). The assembled ... | 03/01/2011 |
| 7898070 | Image sensor package and fabrication method thereof The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of ... | 03/01/2011 |
| 7872338 | Microelectromechanical device packages with integral heaters A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between w... | 01/18/2011 |
| 7812433 | Package structure and electronic device using the same A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is used for receiving a first signal. The chip module includes a substrate, a heat sink and a fir... | 10/12/2010 |
| 7791184 | Image sensor packages and frame structure thereof A semiconductor package such as an image sensor package. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in preci... | 09/07/2010 |
| 7786560 | MEMS package structure A package structure including a chip, a lid, a substrate, a plurality of wires, an encapsulant, and a moisture resistive layer is provided. The chip has an active area where at least one MEMS device is disposed. The lid is covered on the chip, and the substrate is u... | 08/31/2010 |
| 7768112 | Semiconductor package fabricated by cutting and molding in small windows A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the ... | 08/03/2010 |
| 7719097 | Semiconductor device having transparent member A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member sealing an edge surface of the transparent member and an edge part of... | 05/18/2010 |
| 7701044 | Chip package for image sensor and method of manufacturing the same A chip package for an image sensor includes a first semiconductor chip having a first surface where a photographing device and a first circuit pattern are formed and a second surface that is opposite to the first surface where a second circuit pattern is formed. The... | 04/20/2010 |
| 7638865 | Sensor package A sensor package includes an image sensing chip having a front surface, a plurality of bumps, a glass cover plate, and a connector. The plurality of bumps are formed on the front surface, and are electrically connected to the image sensing chip. The glass cover plat... | 12/29/2009 |
| 7612442 | Semiconductor device With this semiconductor device, the distortion and cracking of a thinned portion of a semiconductor substrate are prevented to enable high precision focusing with respect to a photodetecting unit and uniformity and stability of high sensitivity of the photodetecting... | 11/03/2009 |
| 7605456 | Inverter unit To provide an inverter unit with excellent manufacturing performance and with current carrying capacity increased and size reduced by further increasing the cooling efficiency of a power efficiency device. The inverter unit includes: a semiconductor chip cons... | 10/20/2009 |
| 7605455 | Semiconductor device With this semiconductor device, the distortion and cracking of a thinned portion of a semiconductor substrate are prevented to enable high precision focusing with respect to a photodetecting unit and uniformity and stability of high sensitivity of the photodetecting... | 10/20/2009 |
| 7554184 | Image sensor chip package A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area ( | 06/30/2009 |
| 7550831 | Electronic device and semiconductor device An electronic device has a substrate, a conductive layer and a substrate mounted portion. The substrate has a circuit portion used from 60 GHz to 80 GHz. The conductive layer is provided directly on a face of the substrate that is opposite side of the circuit portio... | 06/23/2009 |
| 7547962 | Chip package with a ring having a buffer groove that surrounds the active region of a chip A chip package including a package substrate, a chip, several bonding wires, a flash-resisting ring and a molding compound. The package substrate includes a carrying surface and several contacts disposed on the carrying surface. The chip is disposed on the carrying ... | 06/16/2009 |
| 7528472 | Chip package mechanism A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the target surface and surrounds the chip. A gap for receiving the chip is ... | 05/05/2009 |
| 7521783 | Ultra thin image sensor package structure and method for fabrication An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip suppo... | 04/21/2009 |
| 7521782 | Optical device package structure An LED is mounted on a mounting portion of a lead frame with its light-emitting portion facing an aperture. Wires that connect the LED to lead portions of the lead frame are placed on the side on which the LED is mounted. A light-transmitting resin, which transmits ... | 04/21/2009 |
| 7511367 | Optical device and method for fabricating the same An optical device includes: a base 10; an optical element chip 5 mounted on the base 10; an integrated circuit chip 50 bonded to the back surface of the optical element chip 5; and a transparent member (window member 6). An ... | 03/31/2009 |
| 7495325 | Optical die-down quad flat non-leaded package An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead fr... | 02/24/2009 |
| 7482682 | Micro-device packaging In one embodiment, a package for a micro-device includes a substrate, a transparent material covering the substrate, and a bond ring bonding the transparent material to the substrate. The bond ring comprises a silicon oxide layer on one of the substrate or the trans... | 01/27/2009 |
| 7476961 | Method and apparatus for forming a DMD window frame with molded glass An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. ... | 01/13/2009 |
| 7466018 | MEMS device wafer-level package A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies wh... | 12/16/2008 |
| 7443017 | Package having bond-sealed underbump A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a stand... | 10/28/2008 |
| 7443038 | Flip-chip image sensor packages The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an ... | 10/28/2008 |
