Bizarre Patents
Cloaking System Using Optoelectronically Controlled Camouflage
A Cloaking System designed to operate in the visible light spectrum, utilizes optoelectronics and/or photonic components to conceal an object within it.
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| Number | Title | Issue Date |
| 8178958 | Semiconductor device having antenna and method for manufacturing thereof The present invention provides an antenna in that the adhesive intensity of a conductive body formed on a base film is increased, and a semiconductor device including the antenna. The invention further provides a semiconductor device with high reliability that is fo... | 05/15/2012 |
| 8120154 | Interconnection of lead frame to die utilizing flip chip process Embodiments in accordance with the present invention relate to techniques which avoid the problems of deformation in the shape of a solder connection in a flip chip package, resulting from solder reflow. In one embodiment, a solder-repellent surface is created adjac... | 02/21/2012 |
| 8097939 | Semiconductor memory card The semiconductor memory card related to the present invention is arranged with a plurality of semiconductor memory packages, a controller chip which controls the plurality of semiconductor memory packages, and a substrate mounted with the plurality of semiconductor... | 01/17/2012 |
| 8030745 | ID chip and IC card The present invention provides an ID chip or an IC card in which the mechanical strength of an integrated circuit can be enhanced without suppressing a circuit scale. An ID chip or an IC card of the present invention has an integrated circuit in which a TFT (a thin ... | 10/04/2011 |
| 8018038 | IC card with terminals for direct access to internal components An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural con... | 09/13/2011 |
| 8000091 | Electrophoretic display apparatus An electrophoretic display apparatus includes a display module and a case. The display module includes a flexible array substrate, a front plane laminate, a driving circuit and a flexible printed circuit board. The flexible array substrate has a display area and a p... | 08/16/2011 |
| 7994617 | Semiconductor device An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an inte... | 08/09/2011 |
| 7982295 | Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and ... | 07/19/2011 |
| 7982296 | Methods and devices for fabricating and assembling printable semiconductor elements The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide rang... | 07/19/2011 |
| 7973396 | Electronic price tag device, pop device, management system for electronic price tag device, and method and program for controlling management system for electronic price tag device The present invention provides a solution to the following problem: when using an electronic price tag device attached to a POP panel, an advertising content of the POP panel may be inconsistent with a price displayed on the electronic price tag device, and such inc... | 07/05/2011 |
| 7964944 | System on package of a mobile RFID interrogator The present invention is to implement a SOP of a mobile RFID interrogator. The substrate has external connection terminal patterns on a first surface of a substrate and circuit wiring patterns on a second surface of the substrate. a high frequency front-end part, a ... | 06/21/2011 |
| 7952179 | Semiconductor package having through holes for molding back side of package A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the hole... | 05/31/2011 |
| 7939923 | Memory card and method for manufacturing memory card A memory card includes a circuit board, a first semiconductor chip mounted on the circuit board with a bump sandwiched between the first semiconductor chip and the circuit board, a second semiconductor chip mounted on the circuit board with a bump sandwiched between... | 05/10/2011 |
| 7923830 | Package-on-package secure module having anti-tamper mesh in the substrate of the upper package A package-on-package (POP) secure module includes a first ball grid array (BGA) package and a second BGA package. The first BGA includes an array of bond balls that is disposed on a side of a substrate member, and an array of lands that is disposed on the opposite s... | 04/12/2011 |
| 7884456 | Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is f... | 02/08/2011 |
| 7868437 | Mounting structure for IC tag and IC chip for mounting A mounting structure for an IC tag where an IC chip for mounting (10) is mounted so as to be electrically connected to antenna patterns (44a), (44b). The assembly process that mounts the IC chip for mounting (10) on the ante... | 01/11/2011 |
| 7863718 | Electronic tag chip In order to extend the communication distance of an electronic tag chip, it is required to reduce power consumption of the electronic tag chip. After having formed capacitors and diodes on an SOI (Silicon on Insulator), remove a silicon substrate of the SOI. It beco... | 01/04/2011 |
| 7816774 | Flexible semiconductor device and identification label A flexible device has an integrated circuit and an antenna incorporated or directly coupled to an interconnect structure of the integrated circuit. The interconnect structure extends outside of the active area. An electrically insulating or dielectric layer is prese... | 10/19/2010 |
| 7808090 | Wireless chip An ID tag capable of communicating data wirelessly, the size of which is reduced, and where the size of an IC chip is reduced, a limited area of the chip is effectively used, current consumption is reduced, and communication distance is prevented from decreasing. Th... | 10/05/2010 |
| 7804163 | Seamless secured digital card manufacturing methods with male guide and female switch A secured digital (SD) card including a bottom plastic piece having a plurality of lateral sides, said bottom plastic piece further having a cavity interposed along said plurality of lateral sides, in accordance with an embodiment of the present invention. The SD ca... | 09/28/2010 |
| 7795715 | Leadframe based flash memory cards A leadframe design for forming leadframe-based semiconductor packages having curvilinear shapes is disclosed. The leadframes may each include one or more curvilinear slots corresponding to curvilinear edges in the finished and singulated semiconductor package. After... | 09/14/2010 |
| 7795714 | Two step molding process secured digital card manufacturing method and apparatus A molded secured digital (SD) card having a bottom plastic piece having a plurality of lateral sides, said bottom plastic piece further having a cavity interposed along said plurality of lateral sides, in accordance with an embodiment of the present invention. The m... | 09/14/2010 |
| 7777317 | Card and manufacturing method The invention relates to a card for contactless data and/or energy transmission by means of external devices, containing a multilayer card body which has a substrate layer for accommodating an antenna coil having exposed coil connections on a top side of the substra... | 08/17/2010 |
| 7768110 | Nonvolatile memory apparatus An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural con... | 08/03/2010 |
| 7768111 | Card adapter for use with a storage apparatus A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semicon... | 08/03/2010 |
| 7679174 | Semiconductor device and memory card using the same A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit boar... | 03/16/2010 |
| 7663214 | High-capacity memory card and method of making the same A memory card assembly with a simplified structure. The memory card assembly has a memory card assembly a printed wiring board substrate and at least one integrated circuit unit mounted and electrically connected to the printed wiring board substrate. A rigid ring i... | 02/16/2010 |
| 7659606 | Contacting unit Disclosed is a contacting unit, with plug-in card-shaped housing, having a base plate and a cover plate, between which a slit-like plug-in channel opening on one end of the housing is formed to receive a chip card, and which is provided on the other side with a conn... | 02/09/2010 |
| 7659607 | Accessible electronic storage apparatus for use with support frame A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semicon... | 02/09/2010 |
| 7656014 | Semiconductor device and method for manufacturing same A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection le... | 02/02/2010 |
| 7652359 | Article having display device It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a disp... | 01/26/2010 |
| 7652360 | Electronic device and method of manufacturing the same An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube. ... | 01/26/2010 |
| 7646085 | Semiconductor device with power source feeding terminals of increased length A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enou... | 01/12/2010 |
| 7642630 | Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom An electronic device, such as a mini card, has an inlay substrate for the electronic device. The inlay includes a substrate layer, a communication interface having a first metallization supported by the substrate layer, a hole or a hole location area, for attachment... | 01/05/2010 |
| 7633145 | Semiconductor device with antenna and separating layer The invention provides a semiconductor device which can reliably restrict transmission/reception of signals or a power source voltage between a reader/writer when peeled off after stuck to an object. The semiconductor device of the invention includes an integrated c... | 12/15/2009 |
| 7633146 | Semiconductor device and a method of manufacturing the same Detachably mountable memory card featuring a memory chip(s) and a control chip includes a substrate of an insulating material, conductive layers provided on a first main surface of the substrate, a plurality of external electrode terminals exposed to the opposing, s... | 12/15/2009 |
| 7629679 | Semiconductor package, memory card including the same, and mold for fabricating the memory card A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chi... | 12/08/2009 |
| 7615855 | IC card and method of manufacturing the same An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an externa... | 11/10/2009 |
| 7605453 | Chip module and chip card A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas wit... | 10/20/2009 |
| 7605454 | Memory card and method for devising The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure to create an IC-populated structure. In a preferred embodiment, leads... | 10/20/2009 |
