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| Number | Title | Issue Date |
| 8188584 | Direct-write wafer level chip scale package A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching proces... | 05/29/2012 |
| 8178957 | Electronic component device, and method of manufacturing the same A method of manufacturing an electronic component device, includes the steps of preparing a wiring substrate, which includes a silicon substrate, a concave portion provided on its upper surface side, a through hole formed to penetrate the silicon substrate on a bott... | 05/15/2012 |
| 8174101 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. ... | 05/08/2012 |
| 8169063 | Semiconductor component and method for producing the same A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the side edges, the rear side and the top side, on which surface-mountable external contacts are arranged. One em... | 05/01/2012 |
| 8164169 | Cooling devices in semiconductor packages An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The d... | 04/24/2012 |
| 8159056 | Package for an electronic device A method of forming a device is provided. A substrate having a component is provided and a sacrificial layer is formed over the component. The sacrificial layer includes a cavity portion disposed about the component and a tunnel portion adjacent to the cavity portio... | 04/17/2012 |
| 8148805 | Forming compliant contact pads for semiconductor packages In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconduc... | 04/03/2012 |
| 8143708 | Semiconductor device and method for manufacturing the same An object is to provide a thin and small semiconductor device that has high reliability and high resistance to external stress and electrostatic discharge. Another object is to manufacture a semiconductor device with high yield while shape defects and defective char... | 03/27/2012 |
| 8138589 | Semiconductor device and method of fabricating the same In fabrication of a semiconductor device mounted on a wiring board, a semiconductor circuit portion is formed over a glass substrate. Then, an interposer having connection terminals are bonded to the semiconductor circuit portion. After that, the glass substrate is ... | 03/20/2012 |
| 8138588 | Package stiffener and a packaged device using the same A package frame for use in packaging microelectromechanical devices and/or spatial light modulators comprises a frame, a stiffener, and a heat dissipater. ... | 03/20/2012 |
| 8134226 | Processing apparatus with memories coupled to respective processors In a processing apparatus, a plurality of processors which perform different kinds of processing is integrated on a first semiconductor substrate. A plurality of memories to be managed by the plurality of processors integrated on the first semiconductor substrate is... | 03/13/2012 |
| 8129827 | Integrated circuit package system with package encapsulation having recess An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external ... | 03/06/2012 |
| 8129828 | Wiring substrate with reinforcement A wiring substrate assembly includes a resin wiring substrate and a reinforcement member. The resin wiring substrate does not have a core substrate, and includes a substrate main surface, a substrate back surface, a laminate structure comprised of resin insulation l... | 03/06/2012 |
| 8115289 | Onboard electric power control device An onboard electric power control device which comprises a power unit, a control unit and a power source unit, in which: an opening portion of a case containing components of the power unit and an opening portion of a case containing components of the control unit a... | 02/14/2012 |
| 8106495 | Semiconductor apparatus and manufacturing method thereof A semiconductor apparatus includes a first wiring substrate, a second wiring substrate, a semiconductor chip, an adhesive layer and a molding resin. The second wiring substrate is stacked and connected on the first wiring substrate through a bump electrode. The semi... | 01/31/2012 |
| 8093696 | Semiconductor device According to one embodiment of the present invention, a semiconductor device is provided, that includes a semiconductor carrier; a cavity formed within the semiconductor carrier, the cavity extending from the top surface of the semiconductor carrier into the semicon... | 01/10/2012 |
| 8093697 | Microelectronic packages and methods therefor A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conduct... | 01/10/2012 |
| 8084849 | Integrated circuit package system with offset stacking An integrated circuit package system includes: providing an interposer having a bond pad and a contact pad; mounting the interposer in an offset location over a carrier with an exposed side of the interposer coplanar with an edge of the carrier; connecting an electr... | 12/27/2011 |
| 8063473 | Nanophotonic transceiver A nanophotonic device. The device includes a substrate, at least one light emitting structure and at least one electronic component. The at least one light emitting structure is capable of transmitting light and is monolithically integrated on the substrate. The at ... | 11/22/2011 |
| 8058714 | Overmolded semiconductor package with an integrated antenna According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die an... | 11/15/2011 |
| 8053877 | Semiconductor package A semiconductor package includes a chip base material; a capacitor formed on the base material; and a cover formed over the base material to cover the capacitor, and having a side portion and an upper portion. The base material is provided with a bonding pattern con... | 11/08/2011 |
| 8049316 | Semiconductor package A semiconductor package is provided with a package body including a base part and a semiconductor device housing part housing a semiconductor device. An electric terminal electrically connected to the device is provided in the housing part and is exposed to an outer... | 11/01/2011 |
| 8049317 | Grid array packages A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surfac... | 11/01/2011 |
| 8039937 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate t... | 10/18/2011 |
| 8039936 | Semiconductor device A semiconductor device includes a semiconductor element and a connector. The semiconductor element has a power device of a voltage drive type for controlling an on operation and an off operation of a main current by input of a drive signal. The connector receives th... | 10/18/2011 |
| 8039938 | Airgap micro-spring interconnect with bonded underfill seal A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the ... | 10/18/2011 |
| 8039935 | Wafer level chip scale packaging structure and method of fabricating the same A wafer level chip scale packaging structure and the method of fabricating the same are provided to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface ... | 10/18/2011 |
| 8035207 | Stackable integrated circuit package system with recess A stackable integrated circuit package system is provided including forming an external interconnect having an interconnect non-recessed portion and an interconnect recessed portion, mounting an integrated circuit die over a paddle that is coplanar with the intercon... | 10/11/2011 |
| 8022521 | Package failure prognostic structure and method In accordance with one embodiment, a failure prognostic package includes a substrate having a first surface and an opposite second surface. An electronic component trace is coupled to the first surface. An electronic component is electrically coupled to the electron... | 09/20/2011 |
| 8022520 | System for hermetically sealing packages for optics A system for hermetically sealing devices. The system includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also inc... | 09/20/2011 |
| 8022519 | System-in-a-package based flash memory card A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within an... | 09/20/2011 |
| 8008760 | Integrated semiconductor device An integrated semiconductor device includes a plurality of semiconductor elements having different integrated element circuits or different sizes; an insulating material arranged between the semiconductor elements; an organic insulating film arranged entirely on the... | 08/30/2011 |
| 8008761 | Optical semiconductor apparatus An optical semiconductor apparatus composed of a cap and a base, includes: a metal package including a plurality of openings penetrating through the base from outside to inside, a lead with its end portion protruding to the inside of the base and an insulator coveri... | 08/30/2011 |
| 8004072 | Packaging systems and methods Packaging systems and methods for semiconductor devices are disclosed. In one embodiment, a packaging system includes a first plate having a first coefficient of thermal expansion (CTE). An integrated circuit is mountable to the first plate. The packaging system inc... | 08/23/2011 |
| 8004073 | Integrated circuit packaging system with interposer and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: attaching a lower integrated circuit, having a first through via, over a substrate with the first through via coupled to the substrate; mounting a pre-formed interposer, having an interposer... | 08/23/2011 |
| 7999366 | Micro-component packaging process and set of micro-components resulting from this process A process for packaging a plurality of micro-components made on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a cover plate; depositing a metal layer on a face of the cover plate or on a face of the waf... | 08/16/2011 |
| 7989936 | Microelectronic device with integrated energy source An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an antenna, an energy supply and an integrated circuit chip. The integrated circuit chip is electrically coupled to the anten... | 08/02/2011 |
| 7989935 | Semiconductor device A semiconductor device having a voltage regulator is disclosed that does not have an external output condenser for phase compensation. The semiconductor device includes a semiconductor chip that includes a voltage regulator, a power supply input terminal, a ground t... | 08/02/2011 |
| 7982294 | Semiconductor die with mask programmable interface selection According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associat... | 07/19/2011 |
| 7977778 | Integrated circuit package system with interference-fit feature An integrated circuit package system is provided including forming an integrated circuit die, forming an interference-fit feature in the integrated circuit die, fitting a support element within the interference-fit feature, connecting an external interconnect and th... | 07/12/2011 |
