Bizarre Patents
Cloaking System Using Optoelectronically Controlled Camouflage
A Cloaking System designed to operate in the visible light spectrum, utilizes optoelectronics and/or photonic components to conceal an object within it.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8159055 | Semiconductor device, lead-frame product used for the same and method for manufacturing the same A semiconductor device includes a semiconductor element; a group of back-inner terminals coupled with the semiconductor element through bonding wires and arranged in an area array shape so as to be exposed inside of the bottom; a group of back-outer terminals arrang... | 04/17/2012 |
| 8120153 | High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module A cost-effective, ultra-compact, hybrid power module packaging system and method for making allows device operation in conventional and high temperature ranges over 300° C. Double metal leadframes are directly bonded to the front- and backside of semiconductor chip... | 02/21/2012 |
| 8039934 | Resin-encapsulated semiconductor device and its manufacturing method A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device comprises a semiconductor chip including a silicon substrate, a die pad to which the semiconductor chip is secure... | 10/18/2011 |
| 8030744 | Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same An electrical connection arrangement between a semiconductor circuit arrangement and an external contact device, and to a method for producing the connection arrangement is disclosed. In one embodiment, a metallic layer is deposited onto at least one contact termina... | 10/04/2011 |
| 7994616 | Multilayered lead frame for a semiconductor light-emitting device A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order... | 08/09/2011 |
| 7911041 | Semiconductor device with gold coatings, and process for producing it A semiconductor device (7) has gold coatings (1 to 5) which are applied to metallic or ceramic components (6) of the semiconductor device (7). The gold coatings (1 to 4) have a multifunctional multilayer metal coating... | 03/22/2011 |
| 7709938 | Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same An electrical connection arrangement between a semiconductor circuit arrangement and an external contact device, and to a method for producing the connection arrangement is disclosed. In one embodiment, a metallic layer is deposited onto at least one contact termina... | 05/04/2010 |
| 7705438 | Electronic component and leadframe for producing the component An electronic component includes a semiconductor chip and a leadframe. The leadframe includes a metal coating pattern on its underside to facilitate the application of solder to the electronic component. The metal coating pattern includes wetting regions that are we... | 04/27/2010 |
| 7692277 | Multilayered lead frame for a semiconductor light-emitting device A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially entirely to lead frame body (101) such as copper thin plate in this order... | 04/06/2010 |
| 7608916 | Aluminum leadframes for semiconductor QFN/SON devices A post-mold plated semiconductor device has an aluminum leadframe (105) with a structure including a chip mount pad and a plurality of lead segments without cantilevered lead portions. A semiconductor chip (210) is attached to the chip mount pad, and c... | 10/27/2009 |
| 7501694 | Semiconductor device using multi-layer unleaded metal plating, and method of manufacturing the same A semiconductor device comprises a semiconductor integrated circuit, an external connection terminal connecting the semiconductor integrated circuit to an external device, and a plurality of tin or tin-alloy plating layers formed on the external connection terminal ... | 03/10/2009 |
| 7462926 | Leadframe comprising tin plating or an intermetallic layer formed therefrom A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of... | 12/09/2008 |
| 7443013 | Flexible substrate for package of die The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active surface. The flexible substrate includes a flexible insulating film and a p... | 10/28/2008 |
| 7408248 | Lead frame for semiconductor device A lead frame for semiconductor device is provided with an inner lead part and an outer lead part. A composite plating layer is provided on the entire plane of a base material constituting the lead frame or at least on the outer lead part. The composite plating layer... | 08/05/2008 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7397114 | Semiconductor integrated circuit device and method of manufacturing the same A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to whi... | 07/08/2008 |
| 7378727 | Memory device and a method of forming a memory device A memory device includes a semiconductor substrate having a surface, a plurality of first and second conductive lines, a plurality of memory cells, and a plurality of landing pads. Each of the first conductive lines has a line width wb and two neighboring ones of th... | 05/27/2008 |
| 7372142 | Vertical conduction power electronic device package and corresponding assembling method A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at least a first and a second conduction terminal on respective opposed sid... | 05/13/2008 |
| 7368326 | Methods and apparatus to reduce growth formations on plated conductive leads A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal... | 05/06/2008 |
| 7368328 | Semiconductor device having post-mold nickel/palladium/gold plated leads A semiconductor device having a leadframe comprised of a base metal (110, e.g., copper), a chip mount pad (103) and a plurality of lead segments (104). Each of the segments has a first end (104a) near the mount pad and a second end... | 05/06/2008 |
| 7368807 | Low cost method to produce high volume lead frames A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequent... | 05/06/2008 |
| 7358598 | Process for fabricating a semiconductor package and semiconductor package with leadframe A semiconductor package includes a flat metal leadframe including spaced apart portions, at least some of which constitute electrical connection leads. A filling material fills the spaces that separate the spaced apart portions of the leadframe to form a plate befor... | 04/15/2008 |
| 7348660 | Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package A leadframe includes a multiplicity of leads. The leads have a board level contact portion, an intermediate portion and a chip level contact portion. The intermediate portion is disposed between the board level contact portion and the chip level contact portion. The... | 03/25/2008 |
| 7329944 | Leadframe for semiconductor device A leadframe for a semiconductor device of the present invention is a leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to... | 02/12/2008 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face.... | 01/29/2008 |
| 7309909 | Leadframes for improved moisture reliability of semiconductor devices A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (402) and a plurality of lead segments (403). Covering the base metal are, consecutively, a nickel layer (3... | 12/18/2007 |
| 7301226 | Conductor substrate, semiconductor device and production method thereof A conductor substrate for mounting a semiconductor element, at least a portion thereof mounting the semiconductor element being sealed with an insulating resin, wherein an uppermost surface layer of the conductor substrate comprises copper or an alloy thereof, and t... | 11/27/2007 |
| 7291201 | Method for making nano-scale lead-free solder A method for making Nano-scale lead-free solder includes the following steps of: forming a mixture solution Sn-Ag or Sn-Ag-Cu; making NaBH4, NaOH and alkyl C12H25OSO3Na to a reducing dispersing solution; producing reactant... | 11/06/2007 |
| 7285845 | Lead frame for semiconductor package A lead frame for a semiconductor package having not only high molding resin adhesiveness and a low delamination problem under a severe moisture absorbing atmosphere but also high interface adhesiveness and solder wettability of an Au wire, and a method of manufactur... | 10/23/2007 |
| 7278202 | Method for making overlay surface mount resistor A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween... | 10/09/2007 |
| 7268415 | Semiconductor device having post-mold nickel/palladium/gold plated leads A semiconductor device having a leadframe comprised of a base metal (110, e.g., copper), a chip mount pad (103) and a plurality of lead segments (104). Each of the segments has a first end (104a) near the mount pad and a second end... | 09/11/2007 |
| 7268021 | Lead frame and method of manufacturing the same A lead frame having a structure that can discharge hydrogen adsorbed during deposition and can reduce a galvanic potential difference between plating layers and a method of manufacturing the same are provided. The method includes forming a Ni plating layer formed of... | 09/11/2007 |
| 7265445 | Integrated circuit package An IC package includes a package body of non-conductive material. A conductive heat-sink pad includes an interior pad portion located within an interior of the package body. An exterior pad portion is located external to the package body. The exterior pad portion in... | 09/04/2007 |
| 7262497 | Bumpless assembly package A bumpless assembly package mainly comprises a substrate, and a chip. The substrate has an upper surface and an opposite lower surface, a plurality of first contacts and a plurality of second contacts formed on the upper surface of the substrate, wherein one of the ... | 08/28/2007 |
| 7256481 | Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (302) and a plurality of lead segments (303). Covering the base metal are, consecutively, a continuous nickel ... | 08/14/2007 |
| 7256431 | Insulating substrate and semiconductor device having a thermally sprayed circuit pattern An insulating substrate includes a metal base as a base member, an insulating layer which is a room temperature, aerosol deposited shock solidification film formed on the metal base, and a circuit pattern which is a cold sprayed thermal spray coating formed on the i... | 08/14/2007 |
| 7253029 | Non-magnetic, hermetically-sealed micro device package A process for preparing an electronic package comprising: (a) providing a ceramic housing defining an internal cavity for receiving a micro device and having one or more interface portions; (b) treating the housing to form a tungsten layer on the interface portions;... | 08/07/2007 |
| 7245006 | Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium fi... | 07/17/2007 |
| 7242078 | Surface mount multichip devices A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame... | 07/10/2007 |
| 7239008 | Semiconductor apparatus and method for fabricating the same A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around... | 07/03/2007 |
