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| Number | Title | Issue Date |
| 8188582 | Lead frame, semiconductor device using the lead frame, and methods of manufacturing the same Provided are a lead frame, semiconductor device, and methods of manufacturing the same. The lead frame may include a die pad having at least three pair of sides parallel with each other, and a plurality of inner leads spaced apart from a circumference of the die pad... | 05/29/2012 |
| 8188583 | Semiconductor device and method of manufacturing same To improve the heat dissipation characteristics of a semiconductor device. The semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and a plurality of leads so as to surround the die pad, a plurality... | 05/29/2012 |
| 8178956 | Integrated circuit package system for shielding electromagnetic interference An integrated circuit package system includes: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system i... | 05/15/2012 |
| 8174099 | Leadless package with internally extended package leads A DFN package includes internally extended package leads. One or more package pads are physically and electrically extended from a first edge of the package to a second, opposite edge of the package. These extended package leads can terminate at the edges of the lea... | 05/08/2012 |
| 8174100 | Light source using a light-emitting diode A light source is described herein. An embodiment of the light source comprises a mounting surface and a first lead frame. The first lead frame extends from the mounting surface. The first lead frame comprises a first portion extending from the mounting surface; a c... | 05/08/2012 |
| 8159054 | Semiconductor device The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOSωFET for a high side switch and a power MOSωFET for a low side switch are connected in series. In the non-insulated type DC-DC converter, the power transistor ... | 04/17/2012 |
| 8159053 | Flat leadless packages and stacked leadless package assemblies A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to ... | 04/17/2012 |
| 8154111 | Near chip size semiconductor package A semiconductor package that can fit semiconductor chips of various sizes without having to change the footprint of the carrier package. One aspect of the semiconductor package comprises a leadframe, a semiconductor chip attached to the leadframe, electrical connect... | 04/10/2012 |
| 8148804 | Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufac... | 04/03/2012 |
| 8148803 | Molded stiffener for thin substrates A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise ... | 04/03/2012 |
| 8138587 | Device including two mounting surfaces A device including two mounting surfaces. One embodiment provides a power semiconductor chip and having a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. A first external contact element and a second exter... | 03/20/2012 |
| 8138586 | Integrated circuit package system with multi-planar paddle An integrated circuit package system includes a multi-planar paddle having an uplift rim and an attached integrated circuit over the uplift rim of the multi-planar paddle. ... | 03/20/2012 |
| 8134225 | Quad flat no-lead chip carrier with standoff A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second le... | 03/13/2012 |
| 8129826 | Semiconductor package apparatus having redistribution layer Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also... | 03/06/2012 |
| 8125063 | COL package having small chip hidden between leads A Chip-On-Lead (COL) type semiconductor package having small chip hidden between leads is revealed. The lower surfaces of the leadframe's leads are attached to a wiring substrate and the leads are horizontally bent to form a die-holding cavity. A smaller chip is dis... | 02/28/2012 |
| 8120152 | Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a first plurality of leads disposed in a lead placement area around the die pad, a second plurality of leads disposed in corner regions of the lead placemen... | 02/21/2012 |
| 8120151 | Optical semiconductor device and method for manufacturing the same An optical semiconductor device can have a first lead for an optical semiconductor chip to be mounted on and a second lead for joining to a wire extending from the optical semiconductor chip. The device can be configured to be capable of reducing the possibility of ... | 02/21/2012 |
| 8120150 | Integrated circuit package system with dual connectivity An integrated circuit package system includes: forming a die-attach paddle, a terminal pad, and an external interconnect with the external interconnect below the terminal pad; connecting an integrated circuit die with the terminal pad and the external interconnect; ... | 02/21/2012 |
| 8120149 | Integrated circuit package system An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip ho... | 02/21/2012 |
| 8115287 | Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming outer leads having outer terminal sections, the outer terminal sections having an upper terminal and a bottom terminal; forming inner leads having inner terminal sections wider than ... | 02/14/2012 |
| 8115288 | Lead frame for semiconductor device A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce sp... | 02/14/2012 |
| 8115286 | Integrated sensor including sensing and processing die mounted on opposite sides of package substrate An integrated circuit (IC) device includes a lead frame having a first and a second opposing surface and a plurality of lead fingers. A first die including a signal processor is mounted on the first surface of the lead frame while a second die is mounted on the seco... | 02/14/2012 |
| 8115285 | Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, multiple leads, a chip, a package body, and a protective layer. The die pad includes an upper sloped portion, a lower sloped portion, and a peripheral edge ... | 02/14/2012 |
| 8110906 | Semiconductor device including isolation layer A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the car... | 02/07/2012 |
| 8106492 | Semiconductor package and manufacturing method thereof The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrou... | 01/31/2012 |
| 8106494 | Leadframe for leadless package, structure and manufacturing method using the same A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered t... | 01/31/2012 |
| 8106493 | Semiconductor device package having features formed by stamping Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certai... | 01/31/2012 |
| 8102038 | Semiconductor chip attach configuration having improved thermal characteristics A semiconductor chip 101 with surface 101b free of circuitry assembled on a metal carrier 102 by an attachment layer 103 with thickness 103a. Included in layer 103 are metal bodies 104 and an adhesive po... | 01/24/2012 |
| 8097937 | Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component A leadframe, a housing, a radiation-emitting component formed therefrom, and a method for producing the component includes the leadframe having a mount part with at least one bonding wire connecting area and at least one electrical solder connecting strip into which... | 01/17/2012 |
| 8097938 | Conductive chip-scale package A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder. ... | 01/17/2012 |
| 8093695 | Direct contact leadless flip chip package for high current devices Some exemplary embodiments of an advanced direct contact leadless package and related structure and method, especially suitable for packaging high current semiconductor devices, have been disclosed. One exemplary structure comprises a mold compound enclosing a first... | 01/10/2012 |
| 8089141 | Semiconductor package having leadframe with exposed anchor pads A semiconductor package including a leadframe which has one or more anchor pads formed on and/or defined by the die pad thereof. Such anchor pad(s) may be provided in any one of a multiplicity of different pad shapes, and are adapted to satisfy the required mechanic... | 01/03/2012 |
| 8089140 | Lead frame assembly, lead frame and insulating housing combination, and led module having the same A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second dire... | 01/03/2012 |
| 8072053 | Leadless integrated circuit package having electrically routed contacts A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe are covered with an e... | 12/06/2011 |
| 8072054 | Lead frame A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner lead... | 12/06/2011 |
| 8067824 | Integrated circuit module package and assembly method thereof An integrated circuit module package includes a lead frame having a recessed area. A semiconductor die containing active electrical components is attached to the recessed area of the lead frame. An integrated passive device containing passive electrical components i... | 11/29/2011 |
| 8067826 | Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor... | 11/29/2011 |
| 8067825 | Integrated circuit package system with multiple die An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and forming a cavity for isolating one of the die and a die attach segment of the die paddle. ... | 11/29/2011 |
| 8063472 | Semiconductor package with stacked dice for a buck converter Disclosed in this specification is a buck converter package with stacked dice and a process for forming a buck converter. The package includes a die attach pad with a low side die mounted on one surface and a high side die mounted on the opposing surface. The die at... | 11/22/2011 |
| 8049314 | Integrated circuit package system with insulator over circuitry An integrated circuit package system includes: providing a connection array; attaching a base integrated circuit adjacent the connection array; attaching a package integrated circuit over the base integrated circuit; attaching a package die connector to the package ... | 11/01/2011 |
