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| Number | Title | Issue Date |
| 8183673 | Through-silicon via structures providing reduced solder spreading and methods of fabricating the same A microelectronic device structure as provided herein includes a conductive via having a body portion extending into a substrate from an upper surface thereof and a connecting portion laterally extending along the upper surface of the substrate. The connecting porti... | 05/22/2012 |
| 8174098 | Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via A semiconductor device has a conductive via formed around a perimeter of the semiconductor die. First and second conductive layers are formed on opposite sides of the semiconductor die and thermally connected to the conductive via. An insulating layer is formed over... | 05/08/2012 |
| 8174097 | Electric sub-assembly An electric sub-assembly has an integrated circuit, which contains at least one power semi-conductor component and additional electronic components, the latter being interconnected and linked to connections by the conductors of a lead frame (1, 2, 3). The lea... | 05/08/2012 |
| 8138585 | Four mosfet full bridge module A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N-channel and two P-channel devices or four mosfets of the same type, but four N-channel are ... | 03/20/2012 |
| 8097936 | Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component A component has a device applied to a device carrier, a first conducting layer grown onto the device and onto the device carrier, and an insulating material applied to the first conducting layer such that only a portion of the first conducting layer is covered. ... | 01/17/2012 |
| 8093694 | Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures A non-leaded integrated circuits package system is provided including etching differential height lead structures having inner leads at a paddle height, providing mold locks at the bending points of the differential height lead structures, etching an elevated paddle... | 01/10/2012 |
| 8053876 | Multi lead frame power package According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates therma... | 11/08/2011 |
| 8049313 | Heat spreader for semiconductor package A heat spreader (50) for a semiconductor package (100) includes a heat dissipating portion (52) having a recessed periphery (54). A thermosetting resin (58) is disposed in the recessed periphery (54). The heat spreader (5... | 11/01/2011 |
| 8026581 | Gallium nitride material devices including diamond regions and methods associated with the same Gallium nitride material structures are provided, as well as devices and methods associated with such structures. The structures include a diamond region which may facilitate conduction and removal of heat generated within the gallium nitride material during device ... | 09/27/2011 |
| 8026580 | Semiconductor device package with integrated heat spreader A multi chip housing has a lead frame to which plural die are soldered. A heat spreader conductive cap encloses a volume containing the plural die or chips and is fixed to the periphery of the lead frame. The tops of the die are closely spaced from the interior of t... | 09/27/2011 |
| 8013429 | Air cavity package with copper heat sink and ceramic window frame An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the di... | 09/06/2011 |
| 7977776 | Multichip discrete package A multichip discrete package with a leadframe having a plurality of leads and a first die attach pad (DAP), the first DAP having side portions that extend above the first DAP, a first discrete die bonded to the first DAP, at least a first wirebond which forms an ele... | 07/12/2011 |
| 7977777 | Lead frame thermoplastic solar cell receiver A lead frame thermoplastic package for a solar cell, and a method of manufacturing the same. The lead frame being either a single-lead frame design or a dual-lead frame design. The single-lead frame design being made up of a single-lead metal frame. The dual-lead fr... | 07/12/2011 |
| 7968982 | Thermal enhanced upper and dual heat sink exposed molded leadless package A semiconductor package includes a semiconductor device 30 and a molded upper heat sink 10. The heat sink has an interior surface 16 that faces the semiconductor device and an exterior surface 15 that is at least partially exposed to the ... | 06/28/2011 |
| 7960817 | Semiconductor power module with flexible circuit leadframe A semiconductor power module includes a semiconductor chip thermally interfaced to a ceramic substrate and a leadframe defined by a flexible circuit disposed intermediate the chip and the ceramic substrate. The flexible circuit includes a conductor layer that is sel... | 06/14/2011 |
| 7960818 | Conformal shield on punch QFN semiconductor package In accordance with the present invention, there is provided a punch quad flat no leads (QFN) semiconductor package including a leadframe wherein the leads of the leadframe are selectively half-etched so that only one or more prescribed leads may be electrically conn... | 06/14/2011 |
| 7939919 | LED-packaging arrangement and light bar employing the same An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and... | 05/10/2011 |
| 7936054 | Multi-chip package A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer... | 05/03/2011 |
| 7932586 | Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof The invention relates to leadframe semiconductor packages mounted on a heat-sink and fabrication thereof. A system in package (SiP) comprises a leadframe having extension leads, configured with divisional heat sinks serving as power and ground nets. A set of semicon... | 04/26/2011 |
| 7928544 | Semiconductor chip package assembly with deflection- resistant leadfingers The invention relates to leadframes and semiconductor chip package assemblies using leadframes, and to methods for their assembly. A disclosed embodiment of the invention includes a semiconductor package leadframe with a chip mounting surface for receiving a semicon... | 04/19/2011 |
| 7923826 | Semiconductor device mounted on heat sink having protruded periphery A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor ch... | 04/12/2011 |
| 7906836 | Heat spreader structures in scribe lines An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe li... | 03/15/2011 |
| 7834434 | LED illumination system The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 1... | 11/16/2010 |
| 7834433 | Semiconductor power device In one embodiment the present invention includes a semiconductor power device. The semiconductor power device includes a single gauge lead frame, a semiconductor die, and a heat sink. The semiconductor die is attached to a first level of the lead frame. The heat sin... | 11/16/2010 |
| 7795712 | Lead frame with non-conductive connective bar An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the ... | 09/14/2010 |
| 7795711 | Microelectronic cooling apparatus and associated method An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermall... | 09/14/2010 |
| 7786555 | Semiconductor devices with multiple heat sinks A semiconductor device that includes multiple heat sinks is provided along with methods for forming a semiconductor device having multiple heat sinks. The semiconductor device includes a first heat sink that is configured as a conductive lead frame. The conductive l... | 08/31/2010 |
| 7768104 | Apparatus and method for series connection of two die or chips in single electronics package An apparatus and method for a two semiconductor device package where the semiconductor devices are connected in electrical series. The first device is mounted P-side down on an electrically conductive substrate. Non-active area on the P side is isolated from the ele... | 08/03/2010 |
| 7763959 | Heat slug for package structure A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is connected to and extends from the main body and has a surface in which a plu... | 07/27/2010 |
| 7759778 | Leaded semiconductor power module with direct bonding and double sided cooling A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, th... | 07/20/2010 |
| 7750445 | Stacked synchronous buck converter A multichip module buck converter 10 has a high side power mosfet 12, a low side power mosfet 22 and a pre-molded leadframe 40 between the two mosfets for connecting the source of mosfet 12 to the drain of mosfet 22. Clips | 07/06/2010 |
| 7745914 | Package for receiving electronic parts, and electronic device and mounting structure thereof A package for receiving electronic part has a heat radiating plate having a mounting area where the electronic part is mounted at a center portion of one main surface, a frame body adhered to the one main surface to surround the mounting area, and a wiring conductor... | 06/29/2010 |
| 7741706 | Plastic surface mount large area power device A low profile, 1 or 2 die design, surface mount high power microelectronic package with coefficient of expansion (CTE) matched materials such as Silicon die to Molybdenum conductor (bond pads). The CTE matching of the materials in the package enables the device to w... | 06/22/2010 |
| 7728413 | Resin mold type semiconductor device A semiconductor device includes: a semiconductor element; a metallic plate having a heat radiation surface; a terminal connecting to the element; and a resin mold covering the element, the plate and the terminal. The metallic plate provides an electrode of the semic... | 06/01/2010 |
| 7719096 | Semiconductor device and method for manufacturing a semiconductor device A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for elec... | 05/18/2010 |
| 7671456 | Power management integrated circuit An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout. ... | 03/02/2010 |
| 7671455 | Semiconductor device package with integrated heat spreader A multi chip housing has a lead frame to which plural die are soldered. A heat spreader conductive cap encloses a volume containing the plural die or chips and is fixed to the periphery of the lead frame. The die may be silicon or GaN based MOSFETs or integrated cir... | 03/02/2010 |
| 7663211 | Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture An integrated power device module having a leadframe structure with first and second spaced pads and one or more common source-drain leads located between said first and second pads, first and second transistors flip chip attached respectively to said first and seco... | 02/16/2010 |
| 7652358 | Semiconductor device including main substrate and sub substrates A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates... | 01/26/2010 |
| 7635911 | Chip carrier and system including a chip carrier and semiconductor chips A chip carrier includes a first surface and a second surface that opposes the first surface. The chip carrier acts as a heat sink for semiconductor chips arranged on it. A first recess is provided in the first surface, and a second recess is provided in the second s... | 12/22/2009 |
